The LM49251 is a fully integrated audio subsystem designed for portable handheld
applications such as cellular phones. Part of TI’s PowerWise family of products, the LM49251
utilizes a high efficiency class G headphone amplifier topology as well as a high efficiency class
D loudspeaker.
The headphone amplifiers feature TI’s class G ground referenced architecture that creates
a ground-referenced output with dynamic supply rails for optimum efficiency. The stereo class D
speaker amplifier provides both a no-clip feature and speaker protection. The Enhanced Emission
Suppression (E2S) outputs feature a patented, ultra low EMI PWM
architecture that significantly reduces RF emissions.
The LM49251 features separate volume controls for the mono and stereo inputs. Mode
selection, shutdown control, and volume are controlled through an I2C
compatible interface.
Click and pop suppression eliminates audible transients on power-up/down and during
shutdown. The LM49251 is available in an ultra-small 30-bump DSBGA package (2.55mmx3.02mm)
The LM49251 is a fully integrated audio subsystem designed for portable handheld
applications such as cellular phones. Part of TI’s PowerWise family of products, the LM49251
utilizes a high efficiency class G headphone amplifier topology as well as a high efficiency class
D loudspeaker.
The headphone amplifiers feature TI’s class G ground referenced architecture that creates
a ground-referenced output with dynamic supply rails for optimum efficiency. The stereo class D
speaker amplifier provides both a no-clip feature and speaker protection. The Enhanced Emission
Suppression (E2S) outputs feature a patented, ultra low EMI PWM
architecture that significantly reduces RF emissions.
The LM49251 features separate volume controls for the mono and stereo inputs. Mode
selection, shutdown control, and volume are controlled through an I2C
compatible interface.
Click and pop suppression eliminates audible transients on power-up/down and during
shutdown. The LM49251 is available in an ultra-small 30-bump DSBGA package (2.55mmx3.02mm)