Startseite Mikrocontroller (MCUs) & Prozessoren Microprocessors & DSPs Multimedia & industrial networking SoCs
Startseite
Mikrocontroller (MCUs) & Prozessoren
Microprocessors & DSPs
Multimedia & industrial networking SoCs

OMAP3515

AKTIV

Sitara-Prozessor: Arm Cortex-A8, 3D-Grafik, LPDDR

Jetzt bestellen
Datenblatt
Benutzerhandbücher
Fehlerverzeichnis

OMAP3515

AKTIV
Datenblatt Jetzt bestellen

Produktdetails

CPU 1 Arm Cortex-A8 Frequency (MHz) 720 Graphics acceleration 1 3D Display type 1 LCD Operating system Linux, RTOS Security Cryptographic acceleration Rating Catalog Power supply solution TPS65921, TPS65950 Operating temperature range (°C) -40 to 105
CPU 1 Arm Cortex-A8 Frequency (MHz) 720 Graphics acceleration 1 3D Display type 1 LCD Operating system Linux, RTOS Security Cryptographic acceleration Rating Catalog Power supply solution TPS65921, TPS65950 Operating temperature range (°C) -40 to 105
FCCSP (CBB) 515 144 mm² 12 x 12 FCCSP (CUS) 423 256 mm² 16 x 16
  • OMAP3 Devices:
    • OMAP™ 3 Architecture
    • MPU Subsystem
      • Up to 720-MHz ARM® Cortex™-A8 Core
      • NEON™ SIMD Coprocessor
    • PowerVR® SGX™ Graphics Accelerator
      • Tile-Based Architecture Delivering up to 1 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine-Grained Task Switching, Load Balancing, and Power Management
      • Programmable High-Quality Image Anti-Aliasing
    • Fully Software-Compatible with ARM9™
    • Commercial and Extended Temperature Grades
  • ARM Cortex-A8 Core
    • ARMv7 Architecture
      • TrustZone®
      • Thumb®-2
      • MMU Enhancements
    • In-Order, Dual-Issue, Superscalar Microprocessor Core
    • NEON Multimedia Architecture
    • Over 2x Performance of ARMv6 SIMD
    • Supports Both Integer and Floating-Point SIMD
    • Jazelle® RCT Execution Environment Architecture
    • Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack
    • Embedded Trace Macrocell (ETM) Support for Noninvasive Debug
  • ARM Cortex-A8 Memory Architecture:
    • -KB Instruction Cache (4-Way Set-Associative)
    • -KB Data Cache (4-Way Set-Associative)
    • -KB L2 Cache
  • 112KB of ROM
  • 64KB of Shared SRAM
  • Endianess:
    • ARM Instructions – Little Endian
    • ARM Data – Configurable
  • External Memory Interfaces:
    • General Purpose Memory Controller (GPMC)
      • 16-Bit-Wide Multiplexed Address and Data Bus
      • Up to 8 Chip-Select Pins with 128-MB Address Space per Chip-Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (with ECC Hamming Code Calculation), SRAM, and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, and so forth)
      • Nonmultiplexed Address and Data Mode (Limited 2-KB Address Space)
  • System Direct Memory Access (sDMA) Controller (32 Logical Channels with Configurable Priority)
  • Camera Image Signal Processor (ISP)
    • CCD and CMOS Imager Interface
    • Memory Data Input
    • BT.601 (8-Bit) and BT.656 (10-Bit) Digital YCbCr 4:2:2 Interface
    • Glueless Interface to Common Video Decoders
    • Resize Engine
      • Resize Images From 1/4x to 4x
      • Separate Horizontal and Vertical Control
  • Display Subsystem
    • Parallel Digital Output
      • Up to 24-Bit RGB
      • HD Maximum Resolution
      • Supports Up to 2 LCD Panels
      • Support for Remote Frame Buffer Interface (RFBI) LCD Panels
    • 2 10-Bit Digital-to-Analog Converters (DACs) Supporting:
      • Composite NTSC and PAL Video
      • Luma and Chroma Separate Video (S-Video)
    • Rotation 90-, 180-, and 270-Degrees
    • Resize Images From 1/4x to 8x
    • Color Space Converter
    • 8-Bit Alpha Blending
  • Serial Communication
    • 5 Multichannel Buffered Serial Ports (McBSPs)
      • 512-Byte Transmit and Receive Buffer (McBSP1, McBSP3, McBSP4, and McBSP5)
      • 5-KB Transmit and Receive Buffer (McBSP2)
      • SIDETONE Core Support (McBSP2 and McBSP3 Only) For Filter, Gain, and Mix Operations
      • Direct Interface to I2S and PCM Device and TDM Buses
      • 128-Channel Transmit and Receive Mode
    • Four Master or Slave Multichannel Serial Port Interface (McSPI) Ports
    • High-, Full-, and Low-Speed USB OTG Subsystem (12- and 8-Pin ULPI Interface)
    • High-, Full-, and Low-Speed Multiport USB Host Subsystem
      • 12- and 8-Pin ULPI Interface or 6-, 4-, and 3-Pin Serial Interface
    • One HDQ™/1-Wire® Interface
    • UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)
    • Three Master and Slave High-Speed Inter-Integrated Circuit (I2C) Controllers
  • Removable Media Interfaces:
    • Three Multimedia Card (MMC)/Secure Digital (SD) with Secure Data I/O (SDIO)
  • Comprehensive Power, Reset, and Clock Management
    • SmartReflex™ Technology
    • Dynamic Voltage and Frequency Scaling (DVFS)
  • Test Interfaces
    • IEEE 1149.1 (JTAG) Boundary-Scan Compatible
    • ETM Interface
    • Serial Data Transport Interface (SDTI)
  • 12 32-Bit General-Purpose Timers
  • 2 32-Bit Watchdog Timers
  • 1 32-Bit 32-kHz Sync Timer
  • Up to General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)
  • 5-nm CMOS Technologies
  • Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)
  • Discrete Memory Interface
  • Packages:
  • 1.8-V I/O and 3.0-V (MMC1 Only),


    Note: These are default Operating Performance Point (OPP) voltages and could be optimized to lower values using SmartReflex AVS.
  • OMAP3 Devices:
    • OMAP™ 3 Architecture
    • MPU Subsystem
      • Up to 720-MHz ARM® Cortex™-A8 Core
      • NEON™ SIMD Coprocessor
    • PowerVR® SGX™ Graphics Accelerator
      • Tile-Based Architecture Delivering up to 1 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine-Grained Task Switching, Load Balancing, and Power Management
      • Programmable High-Quality Image Anti-Aliasing
    • Fully Software-Compatible with ARM9™
    • Commercial and Extended Temperature Grades
  • ARM Cortex-A8 Core
    • ARMv7 Architecture
      • TrustZone®
      • Thumb®-2
      • MMU Enhancements
    • In-Order, Dual-Issue, Superscalar Microprocessor Core
    • NEON Multimedia Architecture
    • Over 2x Performance of ARMv6 SIMD
    • Supports Both Integer and Floating-Point SIMD
    • Jazelle® RCT Execution Environment Architecture
    • Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack
    • Embedded Trace Macrocell (ETM) Support for Noninvasive Debug
  • ARM Cortex-A8 Memory Architecture:
    • -KB Instruction Cache (4-Way Set-Associative)
    • -KB Data Cache (4-Way Set-Associative)
    • -KB L2 Cache
  • 112KB of ROM
  • 64KB of Shared SRAM
  • Endianess:
    • ARM Instructions – Little Endian
    • ARM Data – Configurable
  • External Memory Interfaces:
    • General Purpose Memory Controller (GPMC)
      • 16-Bit-Wide Multiplexed Address and Data Bus
      • Up to 8 Chip-Select Pins with 128-MB Address Space per Chip-Select Pin
      • Glueless Interface to NOR Flash, NAND Flash (with ECC Hamming Code Calculation), SRAM, and Pseudo-SRAM
      • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, and so forth)
      • Nonmultiplexed Address and Data Mode (Limited 2-KB Address Space)
  • System Direct Memory Access (sDMA) Controller (32 Logical Channels with Configurable Priority)
  • Camera Image Signal Processor (ISP)
    • CCD and CMOS Imager Interface
    • Memory Data Input
    • BT.601 (8-Bit) and BT.656 (10-Bit) Digital YCbCr 4:2:2 Interface
    • Glueless Interface to Common Video Decoders
    • Resize Engine
      • Resize Images From 1/4x to 4x
      • Separate Horizontal and Vertical Control
  • Display Subsystem
    • Parallel Digital Output
      • Up to 24-Bit RGB
      • HD Maximum Resolution
      • Supports Up to 2 LCD Panels
      • Support for Remote Frame Buffer Interface (RFBI) LCD Panels
    • 2 10-Bit Digital-to-Analog Converters (DACs) Supporting:
      • Composite NTSC and PAL Video
      • Luma and Chroma Separate Video (S-Video)
    • Rotation 90-, 180-, and 270-Degrees
    • Resize Images From 1/4x to 8x
    • Color Space Converter
    • 8-Bit Alpha Blending
  • Serial Communication
    • 5 Multichannel Buffered Serial Ports (McBSPs)
      • 512-Byte Transmit and Receive Buffer (McBSP1, McBSP3, McBSP4, and McBSP5)
      • 5-KB Transmit and Receive Buffer (McBSP2)
      • SIDETONE Core Support (McBSP2 and McBSP3 Only) For Filter, Gain, and Mix Operations
      • Direct Interface to I2S and PCM Device and TDM Buses
      • 128-Channel Transmit and Receive Mode
    • Four Master or Slave Multichannel Serial Port Interface (McSPI) Ports
    • High-, Full-, and Low-Speed USB OTG Subsystem (12- and 8-Pin ULPI Interface)
    • High-, Full-, and Low-Speed Multiport USB Host Subsystem
      • 12- and 8-Pin ULPI Interface or 6-, 4-, and 3-Pin Serial Interface
    • One HDQ™/1-Wire® Interface
    • UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)
    • Three Master and Slave High-Speed Inter-Integrated Circuit (I2C) Controllers
  • Removable Media Interfaces:
    • Three Multimedia Card (MMC)/Secure Digital (SD) with Secure Data I/O (SDIO)
  • Comprehensive Power, Reset, and Clock Management
    • SmartReflex™ Technology
    • Dynamic Voltage and Frequency Scaling (DVFS)
  • Test Interfaces
    • IEEE 1149.1 (JTAG) Boundary-Scan Compatible
    • ETM Interface
    • Serial Data Transport Interface (SDTI)
  • 12 32-Bit General-Purpose Timers
  • 2 32-Bit Watchdog Timers
  • 1 32-Bit 32-kHz Sync Timer
  • Up to General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)
  • 5-nm CMOS Technologies
  • Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)
  • Discrete Memory Interface
  • Packages:
  • 1.8-V I/O and 3.0-V (MMC1 Only),


    Note: These are default Operating Performance Point (OPP) voltages and could be optimized to lower values using SmartReflex AVS.

devices are based on the enhanced OMAP 3 architecture.

The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:

  • Streaming video
  • Video conferencing
  • High-resolution still image

The device supports high-level operating systems (HLOSs), such as:

  • Linux®
  • Windows® CE
  • Android™

This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.

The following subsystems are part of the device:

  • Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
  • PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP35 device only)
  • Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
  • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out.
  • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals

The device also offers:

  • A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption.
  • Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)

OMAP35 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package. (See Table 1-1 for package differences).

This data manual presents the electrical and mechanical specifications for the OMAP35 applications processors. The information in this data manual applies to both the commercial and extended temperature versions of the OMAP35 applications processors unless otherwise indicated. This data manual consists of the following sections:

  • Section 2: Terminal Description: assignment, electrical characteristics, multiplexing, and functional description
  • Section 3: Electrical Characteristics: power domains, operating conditions, power consumption, and DC characteristics
  • Section 4: Clock Specifications input and output clocks, DPLL and DLL
  • Section 5: Video Dac Specifications
  • Section 6: Timing Requirements and Switching Characteristics
  • Section 7: Package Characteristics: thermal characteristics, device nomenclature, and mechanical data for available packaging

devices are based on the enhanced OMAP 3 architecture.

The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:

  • Streaming video
  • Video conferencing
  • High-resolution still image

The device supports high-level operating systems (HLOSs), such as:

  • Linux®
  • Windows® CE
  • Android™

This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.

The following subsystems are part of the device:

  • Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
  • PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP35 device only)
  • Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
  • Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out.
  • Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals

The device also offers:

  • A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption.
  • Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)

OMAP35 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package. (See Table 1-1 for package differences).

This data manual presents the electrical and mechanical specifications for the OMAP35 applications processors. The information in this data manual applies to both the commercial and extended temperature versions of the OMAP35 applications processors unless otherwise indicated. This data manual consists of the following sections:

  • Section 2: Terminal Description: assignment, electrical characteristics, multiplexing, and functional description
  • Section 3: Electrical Characteristics: power domains, operating conditions, power consumption, and DC characteristics
  • Section 4: Clock Specifications input and output clocks, DPLL and DLL
  • Section 5: Video Dac Specifications
  • Section 6: Timing Requirements and Switching Characteristics
  • Section 7: Package Characteristics: thermal characteristics, device nomenclature, and mechanical data for available packaging
filter Andere Multimedia & industrial networking SoCs suchen
Herunterladen Video mit Transkript ansehen Video
Keine Designunterstützung von TI verfügbar

Für dieses Produkt gibt es keine laufende Designunterstützung von TI für neue Projekte wie neue Inhalte oder Software-Updates. Wenn verfügbar, finden Sie im Produktordner relevante Begleitmaterialien, Software und Tools. Sie können auch in den TI E2ETM Supportforen nach archivierten Informationen suchen.

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 18
Typ Titel Datum
* Data sheet OMAP3515 and OMAP3503 Applications Processors datasheet (Rev. H) 10 Okt 2013
* Errata OMAP3530/25/15/03 Applications Processor Silicon Errata (Rev. F) 12 Okt 2010
* User guide OMAP35x Technical Reference Manual (Rev. Y) 19 Dez 2012
User guide SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V) 01 Jun 2020
Application note (Cancelled - see the B revision, create by mistake 14-may-2009) (Rev. C) PDF | HTML 03 Mär 2020
Application note OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles 20 Mär 2019
User guide How-To and Troubleshooting Guide for PRU-ICSS PROFIBUS 24 Sep 2018
Application note PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) 01 Nov 2013
User guide Delta for OMAP35x Technical Reference Manual Version X to Version Y (Rev. Y) 10 Dez 2012
Application note PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 23 Jun 2010
Application note PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 23 Jun 2010
Application note Migrating from OMAP3530 to AM37x 03 Jun 2010
Application note Migrating from OMAP3530 to AM35x 24 Mai 2010
User guide OMAP35x Peripherals Overview Reference Guide (Rev. A) 20 Jan 2010
Application note OMAP35x Linux PSP Data Sheet 16 Okt 2009
Design guide Powering OMAP35x with TPS65073x 13 Okt 2009
Application note Powering OMAP™3 With TPS6235x: Design-In Guide 03 Dez 2008
Application note OMAP35x 0.65mm Pitch Layout Methods (Rev. B) 26 Jun 2008

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Debug-Tastkopf

TMDSEMU200-U — XDS200-USB-Debug-Tastkopf

Der XDS200 ist ein Debug-Tastkopf (Emulator) zum Debugging von Embedded-Bausteinen von TI.  Der XDS200 bietet ein ausgewogenes Preis-Leistungs-Verhältnis im Vergleich zum preiswerten XDS110 und dem leistungsstarken XDS560v2.  Er unterstützt eine große Zahl von Standards (IEEE1149.1, IEEE1149.7, (...)

Nicht verfügbar auf TI.com
Debug-Tastkopf

TMDSEMU560V2STM-U — XDS560v2 System-Trace-USB-Debug-Tastkopf

Der XDS560v2 ist die leistungsstärkste Debug-Sonde aus der XDS560™ Familie von Debug-Sonden und unterstützt sowohl den traditionellen JTAG-Standard (IEEE1149.1) als auch cJTAG (IEEE1149.7).  Bitte beachten: Diese Lösung unterstützt kein Serial Wire Debug (SWD).

Alle XDS-Debug-Tastköpfe unterstützen (...)

Nicht verfügbar auf TI.com
Debug-Tastkopf

TMDSEMU560V2STM-UE — XDS560v2 System-Trace-USB-und Ethernet-Debug-Tastkopf

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

Nicht verfügbar auf TI.com
Software-Entwicklungskit (SDK)

ANDROIDSDK-SITARA — Android-Entwicklungskit für Sitara-Mikroprozessoren

Obwohl das Android-Betriebssystem ursprünglich für Mobiltelefone entwickelt wurde, bietet es Entwicklern von Embedded-Anwendungen die Möglichkeit, ihr Produkt auf einfache Weise mit einem leistungsstarken Betriebssystem auszustatten. Android wurde in Zusammenarbeit mit Google entwickelt und liefert (...)
View Options
Software-Entwicklungskit (SDK)

LINUXDVSDK-OMAP3530 — Linux Digital Video Software Development Kit (DVSDK) für OMAP3530/3525-Digitalmedienprozessoren

The Linux Digital Video Software Development Kit (DVSDK) enables OMAP35x system integrators to quickly develop Linux-based multimedia applications that can be easily ported across different devices in the OMAP35x generation, including OMAP3530 and OMAP3525 application processors. The DVSDK combines (...)
View Options
IDE, Konfiguration, Compiler oder Debugger

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Diese Designressource unterstützt die meisten Produkte in diesen Kategorien.

Informationen zum Support sind der Seite mit den Produktdetails zu entnehmen.
Start Download-Optionen
Software-Codec

C64XPLUSCODECS — CODECS – Video und Sprache – C64x+-basierte Geräte (OMAP35x, C645x, C647x, DM646, DM644x, DM643x)

Die TI-Codecs sind kostenlos, werden mit Produktionslizenzen geliefert und stehen ab sofort zum Download bereit. Alle Codecs wurden eingehend geprüft und lassen sich problemlos in Video- und Sprachanwendungen integrieren. Klicken Sie auf die Schaltfläche „GET SOFTWARE“ (oben), um auf die neuesten, (...)
View Options
Software-Codec

OMAP35XCODECS — Codecs for OMAP35x - Software and Documentation

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into audio, video and voice applications. Click GET SOFTWARE button (above) to access the most recent, tested codec versions available. Datasheets and Release Notes (...)

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Produkte
Multimedia & industrial networking SoCs
OMAP3503 — Sitara-Prozessor: Arm Cortex-A8, LPDDR OMAP3515 — Sitara-Prozessor: Arm Cortex-A8, 3D-Grafik, LPDDR OMAP3525 — Anwendungsprozessor OMAP3530 — Anwendungsprozessor
Download-Optionen
Software-Programmiertool

FLASHTOOL — FlashTool for AM35x, AM37x, DM37x and OMAP35x Devices

Flash Tool is a Windows-based application that can be used to transfer binary images from a host PC to TI Sitara AM35x, AM37x, DM37x and OMAP35x target platforms.


Additional Information:

TI GForge - Welcome to gforge.ti.com

TI E2E Community

Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Produkte
Multimedia & industrial networking SoCs
AM3505 — Sitara-Prozessor: Arm Cortex-A8, Video-Frontend AM3517 — Sitara-Prozessor: Arm Cortex-A8, 3D-Grafik, Video-Frontend AM3703 — Sitara-Prozessor: Arm Cortex-A8, Kamera AM3715 — Sitara-Prozessor: Arm Cortex-A8, 3D Grafik, Kamera DM3725 — Digitaler Medienprozessor DM3730 — Digitaler Medienprozessor OMAP3503 — Sitara-Prozessor: Arm Cortex-A8, LPDDR OMAP3515 — Sitara-Prozessor: Arm Cortex-A8, 3D-Grafik, LPDDR OMAP3525 — Anwendungsprozessor OMAP3530 — Anwendungsprozessor
Download-Optionen
Simulationsmodell

OMAP3515/03 CBB IBIS Model (Rev. A)

SPRM320A.ZIP (1575 KB) - IBIS Model
Herunterladen
Simulationsmodell

OMAP3515/03 CBB BSDL Model (Rev. C)

SPRM313C.ZIP (11 KB) - BSDL Model
Herunterladen
Simulationsmodell

OMAP3515/03 CBC IBIS Model (Rev. A)

SPRM321A.ZIP (1559 KB) - IBIS Model
Herunterladen
Simulationsmodell

OMAP3515/03 CBC BSDL MODEL

SPRM473.ZIP (10 KB) - BSDL Model
Herunterladen
Simulationsmodell

OMAP3515/03 CUS BSDL Model (Rev. B)

SPRM312B.ZIP (10 KB) - BSDL Model
Herunterladen
Simulationsmodell

OMAP3515/03 CUS IBIS Model (Rev. B)

SPRM319B.ZIP (1537 KB) - IBIS Model
Herunterladen
Berechnungstool

POWEREST — Tool zur Schätzung des Stromverbrauchs (Power Estimation Tool, PET)

Das Tool zur Schätzung des Stromverbrauchs (Power Estimation Tool, PET) bietet Benutzern die Möglichkeit, Einblicke in den Stromverbrauch ausgewählter TI-Prozessoren zu erhalten. Das Tool bietet dem Benutzer die Möglichkeit, mehrere Anwendungsszenarien auszuwählen und ein besseres Verständnis des (...)
View Options
Schaltplan

Schematic for PR785: Discrete Power Solution for OMAP3503 & OMAP3515

SLUA480.PDF (129 KB)
Herunterladen
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
FCCSP (CBB) 515 Ultra Librarian
FCCSP (CUS) 423 Ultra Librarian
Es gelten die allgemeinen Geschäftsbedingungen von TI für Evaluierungsartikel.

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Alle Forenthemen auf Englisch anzeigen

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos