Home Logik- & Spannungsumsetzung Puffer, Treiber & Transceiver Nicht invertierende Puffer & Treiber
Home
Logik- & Spannungsumsetzung
Puffer, Treiber & Transceiver
Nicht invertierende Puffer & Treiber

SN74LVC2G125

AKTIV

2-Kanal-Puffer, 1,65 bis 5,5 V mit Tri-State-Ausgängen

Jetzt bestellen
Datenblatt

SN74LVC2G125

AKTIV
Datenblatt Jetzt bestellen

Produktdetails

Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Number of channels 2 IOL (max) (mA) 32 Supply current (max) (µA) 10 IOH (max) (mA) -32 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Number of channels 2 IOL (max) (mA) 32 Supply current (max) (µA) 10 IOH (max) (mA) -32 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
DSBGA (YZP) 8 2.8125 mm² 2.25 x 1.25 SSOP (DCT) 8 11.8 mm² 2.95 x 4 VSSOP (DCU) 8 6.2 mm² 2 x 3.1
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model
    • 1000-V Charged-Device Model
  • Available in the Texas Instruments
    NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 4.3 ns at 3.3 V
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    > 2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Can Be Used as a Down Translator to Translate Inputs From a Max of 5.5 V Down
    to the VCC Level
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model
    • 1000-V Charged-Device Model
  • Available in the Texas Instruments
    NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 4.3 ns at 3.3 V
  • Low Power Consumption, 10-µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    < 0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    > 2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Can Be Used as a Down Translator to Translate Inputs From a Max of 5.5 V Down
    to the VCC Level
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II

The SN74LVC2G125 device is a dual bus buffer gate, designed for 1.65-V to 5.5-V VCC operation. This device features dual line drivers with 3-state outputs. The outputs are disabled when the associated output-enable (OE) input is high.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The SN74LVC2G125 device is a dual bus buffer gate, designed for 1.65-V to 5.5-V VCC operation. This device features dual line drivers with 3-state outputs. The outputs are disabled when the associated output-enable (OE) input is high.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
filter Andere Nicht invertierende Puffer & Treiber suchen
Herunterladen Video mit Transkript ansehen Video

Ähnliche Produkte, die für Sie interessant sein könnten

open-in-new Alternativen vergleichen
Selbe Funktionalität wie der verglichene Baustein bei gleicher Anschlussbelegung
SN74AUP2G125 AKTIV 2-Kanal, 0,8-V- bis 3,6-V-Puffer mit Tri-State-Ausgängen und geringem Stromverbrauch Voltage range 0.8V to 3.6V, average propagation delay 8ns, average drive strength 4mA
Ähnliche Funktionalität wie verglichener Baustein
SN74AHC125 AKTIV 4-Kanal-Puffer, 2 bis 5,5 V mit Tri-State-Ausgängen Voltage range 2V to 5.5V, average propagation delay 12ns, average drive strength 9mA
SN74AHC1G125 AKTIV Einzelner 2-V- bis 5,5-V-Puffer mit Tri-State-Ausgängen Voltage range 2V to 5.5V, average propagation delay 12ns, average drive strength 9mA

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 28
Top-Dokumentation Typ Titel Format-Optionen Datum
* Data sheet SN74LVC2G125 Dual Bus Buffer Gate With 3-State Outputs datasheet (Rev. Q) PDF | HTML 28 Mär 2017
Selection guide Logic Guide (Rev. AC) PDF | HTML 13 Nov 2025
Application brief Enabling Optimal Solar Inverter Power Stage Designs with Logic PDF | HTML 17 Aug 2021
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 Nov 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 Dez 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 Mai 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 Mai 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mär 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dez 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note LVC Characterization Information 01 Dez 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Okt 1996
Application note Live Insertion 01 Okt 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 Sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 Mai 1996

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

5-8-LOGIC-EVM — Generisches Logik-Evaluierungsmodul für 5- bis 8-polige DCK-, DCT-, DCU-, DRL- und DBV-Gehäuse

Flexibles EVM zur Unterstützung aller Geräte mit 5- bis 8-poligem DCK-, DCT-, DCU-, DRL- oder DBV-Gehäuse.
Benutzerhandbuch: PDF
Nicht verfügbar auf TI.com
Simulationsmodell

HSPICE MODEL OF SN74LVC2G125

SCEJ232.ZIP (90 KB) - HSpice Model
Herunterladen
Simulationsmodell

SN74LVC2G125 Behavioral SPICE Model

SCEM619.ZIP (7 KB) - PSpice Model
Herunterladen
Simulationsmodell

SN74LVC2G125 IBIS Model (Rev. A)

SCEM288A.ZIP (44 KB) - IBIS Model
Herunterladen
Referenzdesigns

TIDA-00554 — Ultramobiles DLP-NIR-Spektrometer für tragbare chemische Analysegeräte mit Bluetooth-Konnektivität

The ultra-mobile near-infrared (NIR) spectrometer reference design utilizes Texas Instruments' DLP technology in conjunction with a single-element InGaAs detector to deliver high performance measurements in a portable form factor that is more affordable than architectures using an expensive InGaAs (...)
Design guide: PDF
Schaltplan: PDF
Referenzdesigns

TIDA-010132 — Mehrkanaliger RF-Transceiver-Referenzdesign für Radaranwendungen

Dieses Referenzdesign, ein 8-Kanal-Analog-Frontend (AFE), verwendet zwei AFE7444 4-Kanal-HF-Transceiver und ein LMK04828-LMX2594-basiertes Clocking-Subsystem, mit dem Designs auf 16 Kanäle oder mehr skaliert werden können. Jeder AFE-Kanal besteht aus einem DAC mit 14 Bit, 9 GSPS und einem ADC mit (...)
Design guide: PDF
Schaltplan: PDF
Referenzdesigns

TIDM-RF430FRLSENSE — RF430FRL152H – Referenzdesign für NFC-Temperatur und -Lichtsensor

This reference design provides a platform to evaluate the RF430FRL152H NFC Sensor Interface Transponder.  Directly out of the box, thermistor and photo transistor measurements can be communicated to an NFC enabled smart phone or other NFC/RFID Reader device.  This reference design can be (...)
Schaltplan: PDF
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
DSBGA (YZP) 8 Ultra Librarian
SSOP (DCT) 8 Ultra Librarian
VSSOP (DCU) 8 Ultra Librarian
Es gelten die allgemeinen Geschäftsbedingungen von TI für Evaluierungsartikel.

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Alle Forenthemen auf Englisch anzeigen

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos