ADS58B18

ACTIVO

Convertidor analógico a digital (ADC) de 11 bits y 200 MSPS

Detalles del producto

Sample rate (max) (Msps) 200 Resolution (Bits) 11 Number of input channels 1 Interface type Parallel CMOS, Parallel LVDS Analog input BW (MHz) 550 Features Low Power Rating Catalog Peak-to-peak input voltage range (V) 2 Power consumption (typ) (mW) 310 Architecture Pipeline SNR (dB) 66.3 ENOB (Bits) 10.6 SFDR (dB) 87.5 Operating temperature range (°C) -40 to 85 Input buffer Yes
Sample rate (max) (Msps) 200 Resolution (Bits) 11 Number of input channels 1 Interface type Parallel CMOS, Parallel LVDS Analog input BW (MHz) 550 Features Low Power Rating Catalog Peak-to-peak input voltage range (V) 2 Power consumption (typ) (mW) 310 Architecture Pipeline SNR (dB) 66.3 ENOB (Bits) 10.6 SFDR (dB) 87.5 Operating temperature range (°C) -40 to 85 Input buffer Yes
VQFN (RGZ) 48 49 mm² 7 x 7
  • ADS58B18: 11-Bit, 200MSPS
  • ADS58B19: 9-Bit, 250MSPS
  • Integrated High-Impedance Analog Input Buffer
  • Ultralow Power:
    • Analog Power: 258mW at 200MSPS
    • I/O Power: 69mW (DDR LVDS, low LVDS swing)
  • High Dynamic Performance:
    • ADS58B18: 66dBFS SNR and 81dBc SFDR at 150MHz
    • ADS58B19: 55.7dBFS SNR and 76dBc SFDR at 150MHz
  • Enhanced SNR Using TI-Proprietary SNRBoost Technology (ADS58B18 Only)
    • –77.7dBFS SNR in 20MHz Bandwidth
  • Dynamic Power Scaling with Sample Rate
  • Output Interface:
    • Double Data Rate (DDR) LVDS with Programmable Swing and Strength
      • Standard Swing: 350mV
      • Low Swing: 200mV
      • Default Strength: 100Ω Termination
      • 2x Strength: 50Ω Termination
    • 1.8V Parallel CMOS Interface Also Supported
  • Programmable Gain for SNR/SFDR Trade-Off
  • DC Offset Correction
  • Supports Low Input Clock Amplitude
  • Package: QFN-48 (7mm × 7mm)

PowerPAD is a trademark of Texas Instruments Incorporated.
All other trademarks are the property of their respective owners.

  • ADS58B18: 11-Bit, 200MSPS
  • ADS58B19: 9-Bit, 250MSPS
  • Integrated High-Impedance Analog Input Buffer
  • Ultralow Power:
    • Analog Power: 258mW at 200MSPS
    • I/O Power: 69mW (DDR LVDS, low LVDS swing)
  • High Dynamic Performance:
    • ADS58B18: 66dBFS SNR and 81dBc SFDR at 150MHz
    • ADS58B19: 55.7dBFS SNR and 76dBc SFDR at 150MHz
  • Enhanced SNR Using TI-Proprietary SNRBoost Technology (ADS58B18 Only)
    • –77.7dBFS SNR in 20MHz Bandwidth
  • Dynamic Power Scaling with Sample Rate
  • Output Interface:
    • Double Data Rate (DDR) LVDS with Programmable Swing and Strength
      • Standard Swing: 350mV
      • Low Swing: 200mV
      • Default Strength: 100Ω Termination
      • 2x Strength: 50Ω Termination
    • 1.8V Parallel CMOS Interface Also Supported
  • Programmable Gain for SNR/SFDR Trade-Off
  • DC Offset Correction
  • Supports Low Input Clock Amplitude
  • Package: QFN-48 (7mm × 7mm)

PowerPAD is a trademark of Texas Instruments Incorporated.
All other trademarks are the property of their respective owners.

The ADS58B18/B19 are members of the ultralow power ADS4xxx analog-to-digital converter (ADC) family that features integrated analog buffers and SNRBoost technology. The ADS58B18 and ADS58B19 are 11-bit and 9-bit ADCs with sampling rates up to 200MSPS and 250MSPS, respectively. Innovative design techniques are used to achieve high dynamic performance while consuming extremely low power. The analog input pins have buffers with constant performance and input impedance across a wide frequency range. This architecture makes these parts well-suited for multi-carrier, wide bandwidth communications applications such as PA linearization.

The ADS58B18 uses TI-proprietary SNRBoost technology that can be used to overcome SNR limitation as a result of quantization noise for bandwidths less than Nyquist (fS/2).

Both devices have gain options that can be used to improve SFDR performance at lower full-scale input ranges, especially at very high input frequencies. They also include a dc offset correction loop that can be used to cancel the ADC offset. At lower sampling rates, the ADC automatically operates at scaled-down power with no loss in performance.

These devices support both double data rate (DDR) low-voltage differential signaling (LVDS) and parallel CMOS digital output interfaces. The low data rate of the DDR LVDS interface (maximum 500Mbps) makes it possible to use low-cost field-programmable gate array (FPGA)-based receivers. They have a low-swing LVDS mode that can be used to further reduce the power consumption. The strength of the LVDS output buffers can also be increased to support 50Ω differential termination.

The ADS58B18/B19 are both available in a compact QFN-48 package and specified over the industrial temperature range (–40°C to +85°C).

The ADS58B18/B19 are members of the ultralow power ADS4xxx analog-to-digital converter (ADC) family that features integrated analog buffers and SNRBoost technology. The ADS58B18 and ADS58B19 are 11-bit and 9-bit ADCs with sampling rates up to 200MSPS and 250MSPS, respectively. Innovative design techniques are used to achieve high dynamic performance while consuming extremely low power. The analog input pins have buffers with constant performance and input impedance across a wide frequency range. This architecture makes these parts well-suited for multi-carrier, wide bandwidth communications applications such as PA linearization.

The ADS58B18 uses TI-proprietary SNRBoost technology that can be used to overcome SNR limitation as a result of quantization noise for bandwidths less than Nyquist (fS/2).

Both devices have gain options that can be used to improve SFDR performance at lower full-scale input ranges, especially at very high input frequencies. They also include a dc offset correction loop that can be used to cancel the ADC offset. At lower sampling rates, the ADC automatically operates at scaled-down power with no loss in performance.

These devices support both double data rate (DDR) low-voltage differential signaling (LVDS) and parallel CMOS digital output interfaces. The low data rate of the DDR LVDS interface (maximum 500Mbps) makes it possible to use low-cost field-programmable gate array (FPGA)-based receivers. They have a low-swing LVDS mode that can be used to further reduce the power consumption. The strength of the LVDS output buffers can also be increased to support 50Ω differential termination.

The ADS58B18/B19 are both available in a compact QFN-48 package and specified over the industrial temperature range (–40°C to +85°C).

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet 11-Bit, 200MSPS/9-Bit, 250MSPS, Ultralow-Power ADCs with Analog Buffer datasheet (Rev. D) 28 ene 2011
User guide Interfacing Altera FPGAs to ADS4249 and DAC3482 (TIDA-00069 Reference Guide) 10 jul 2012
Application note High-Speed, Analog-to-Digital Converter Basics 11 ene 2012
Application note Power Supply Design for the ADS41xx (Rev. A) 29 dic 2011
Application note Driving High-Speed ADCs: Circuit Topologies and System-Level Parameters (Rev. A) 10 sep 2010
Application note Smart Selection of ADC/DAC Enables Better Design of Software-Defined Radio 28 abr 2009
Application note CDCE62005 as Clock Solution for High-Speed ADCs 04 sep 2008
Application note CDCE72010 as a Clocking Solution for High-Speed Analog-to-Digital Converters 08 jun 2008
Application note Phase Noise Performance and Jitter Cleaning Ability of CDCE72010 02 jun 2008
Application note QFN Layout Guidelines 28 jul 2006

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

ADS58B18EVM — Módulo de evaluación del convertidor analógico a digital ADS58B18 de 11 bits y 200 MSPS

El ADS58B18EVM es una placa de circuito que permite a los diseñadores evaluar el rendimiento del dispositivo ADS58B18 de Texas Instruments, un convertidor analógico a digital de 11 bits y 200 MSPS con una potencia extremadamente baja. El ADC cuenta con una entrada analógica con búfer y salidas DDR (...)

Guía del usuario: PDF | HTML
GUI para el módulo de evaluación (EVM)

DATACONVERTERPRO-SW High Speed Data Converter Pro GUI Installer, v5.31

This high-speed data converter pro GUI is a PC (Windows® XP/7/10 compatible) program designed to aid in evaluation of most TI high-speed data converter [analog-to-digital converter (ADC) and digital-to-analog converter (DAC)] and analog front-end (AFE) platforms. Designed to support the entire (...)

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GUI para el módulo de evaluación (EVM)

SLAC384 ADS41xx SPI GUI rev1.6

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Modelo de simulación

ADS414x, ADS412x, ADS58B1x, IBIS MODEL

SBAM091.ZIP (318 KB) - IBIS Model
Modelo de simulación

ADS414x, ADS412x, ADS58B1x, IBIS MODEL (Rev. A)

SBAM091A.ZIP (318 KB) - IBIS Model
Lista de materiales (BOM)

ADS41xx EVM BOM, Schematic, and PCB

SLAR048.ZIP (2222 KB)
Herramienta de cálculo

ANALOG-ENGINEER-CALC PC software analog engineer's calculator

The analog engineer’s calculator is designed to speed up many of the repetitive calculations that analog circuit design engineers use on a regular basis. This PC-based tool provides a graphical interface with a list of various common calculations ranging from setting operational-amplifier (...)

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Herramienta de cálculo

JITTER-SNR-CALC Jitter and SNR calculator

JITTER-SNR-CALC can be used for calculating theoretical Signal to Noise (SNR) performance of ADCs based on input frequency and clock jitter.

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Herramienta de simulación

PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® para TI es un entorno de diseño y simulación que ayuda a evaluar la funcionalidad de los circuitos analógicos. Esta completa suite de diseño y simulación utiliza un motor de análisis analógico de Cadence®. Disponible sin ningún costo, PSpice para TI incluye una de las bibliotecas de modelos (...)
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
VQFN (RGZ) 48 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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