Inicio Conectividad inalámbrica Productos Wi-Fi
Inicio
Conectividad inalámbrica
Productos Wi-Fi

CC2564MODN

ACTIVO

Bluetooth® 4.1 con velocidad básica (BR), velocidad de datos mejorada (EDR), módulo de baja energía

Haga su pedido ahora
Hoja de datos

CC2564MODN

ACTIVO
Hoja de datos Haga su pedido ahora

Detalles del producto

Type Module, Transceiver Protocols Dual-mode Bluetooth Security Networking security Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power Operating temperature range (°C) -30 to 85 Rating Catalog
Type Module, Transceiver Protocols Dual-mode Bluetooth Security Networking security Features Assisted A2DP/HFP 1.6, BR / EDR / LE, Class 1 TX Power Operating temperature range (°C) -30 to 85 Rating Catalog
QFM (MOE) 33 49 mm² 7 x 7
  • Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
    • CC2564MODA With Integrated Antenna
    • CC2564MODN With External Antenna
  • Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
    • FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
    • CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
    • Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
  • Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
    • CC2564MODA
      • Integrated Chip Antenna
      • Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
    • CC2564MODN
      • Single-Ended 50-Ω RF Interface
      • Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
    • Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Support of up to 10 Simultaneous Connections
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1.5 TX Power up to +10 dBm
    • –93 dbm Typical RX Sensitivity
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.
  • Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
    • CC2564MODA With Integrated Antenna
    • CC2564MODN With External Antenna
  • Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
    • FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
    • CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
    • Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
  • Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
    • CC2564MODA
      • Integrated Chip Antenna
      • Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
    • CC2564MODN
      • Single-Ended 50-Ω RF Interface
      • Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
    • Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Support of up to 10 Simultaneous Connections
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1.5 TX Power up to +10 dBm
    • –93 dbm Typical RX Sensitivity
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.

Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Hands-free profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth low energy profiles and services

For more information, see TI Dual-Mode Bluetooth Stack.

In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.

Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Hands-free profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth low energy profiles and services

For more information, see TI Dual-Mode Bluetooth Stack.

In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.
open-in-new Buscar otro/a Productos Wi-Fi
Descargar Ver vídeo con transcripción Video

Documentación técnica

star =Principal documentación para este producto seleccionada por TI
No se encontraron resultados. Borre su búsqueda y vuelva a intentarlo.
Ver todo 21
Tipo Título Fecha
* Data sheet CC2564MODx Bluetooth® Host Controller Interface (HCI) Module datasheet (Rev. E) 16 ene 2016
* Radiation & reliability report CC2564MODN Reliability Data – Reliability Estimate 25 jun 2019
Selection guide CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 13 may 2022
Selection guide Wireless Connectivity Technology Selection Guide (Rev. B) 14 feb 2022
Application note DN035 -- Antenna Quick Guide (Rev. B) 09 feb 2022
User guide Dual-Mode Bluetooth CC2564 Module Evaluation Board User's Guide (Rev. A) 31 ago 2021
Certificate CC2564MODN EC Declaration of Conformity (DoC) (Rev. A) 03 mar 2021
User guide Bluetopia Stack Build Guide for Linux PDF | HTML 15 ene 2021
User guide CC2564x Demo Applications User's Guide PDF | HTML 17 dic 2020
Cybersecurity advisory Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 18 may 2020
Cybersecurity advisory Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 18 may 2020
Application note Capturing Bluetooth Host Controller Interface (HCI) Logs 07 ene 2019
White paper Wireless Connectivity For The Internet of Things, One Size Does Not Fit All (Rev. A) 16 oct 2017
White paper Which TI Bluetooth® solution should I choose? 05 may 2017
White paper White Paper: Why Classic Bluetooth® (BR/EDR)? 04 may 2017
Certificate CC2564MODN CE Certification (Rev. A) 25 feb 2016
More literature Dual-mode Bluetooth CC256x solutions (Rev. C) 03 feb 2016
Technical article Three reasons why our dual-mode Bluetooth stack is your new go-to software solutio PDF | HTML 17 ago 2015
User guide Dual-Mode Bluetooth CC2564 Module Evaluation Board Quick Start Guide 24 jul 2015
White paper Three Flavors of Bluetooth: Which One to Choose? 25 mar 2014
Application note AN058 -- Antenna Selection Guide (Rev. B) 06 oct 2010

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

BOOST-CC2564MODA — Módulo enchufable BoosterPack™ de cadena margarita con sensores de temperatura TMP107

The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA).  The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design (...)

Guía del usuario: PDF
No disponible en TI.com
Placa de evaluación

CC2564MODAEM — Módulo Bluetooth® CC2564 de modo dual con placa de evaluación de antena integrada

The CC2564MODAEM evaluation board contains the Bluetooth BR/EDR/LE HCI solution. Based on TI's CC2564B dual-mode Bluetooth single-chip device, the bCC2564MODA is intended for evaluation and design purposes, reducing design effort and enabling fast time to market.


For a complete evaluation solution, (...)

Guía del usuario: PDF | HTML
No disponible en TI.com
Placa de evaluación

CC2564MODNEM — Placa de evaluación de módulo Bluetooth® de modo dual CC2564

The CC2564MODNEM evaluation board contains the CC2564MODN device and is intended for evaluation and design purposes.

For a complete evaluation solution, the CC2564MODNEM board plugs directly into our hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X and kits for our other (...)

Guía del usuario: PDF
No disponible en TI.com
Placa de evaluación

CC256XQFNEM — Placa de evaluación de CC2564 Bluetooth® de modo dual

The CC256XQFNEM evaluation board contains the CC2564B device and is intended for evaluation and design purposes for the CC256x devices.

For a complete evaluation solution, the CC256XQFNEM board plugs directly into the TI hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X and (...)

Guía del usuario: PDF
No disponible en TI.com
Placa de evaluación

DLPNIRNANOEVM — Módulo de evaluación nano NIRscan™ DLP®

The DLP NIRscan Nano is a compact battery-operated evaluation module (EVM) for portable near-infrared spectroscopy solutions. Featuring the DLP2010NIR digital micromirror device (DMD), the NIRscan Nano supports Bluetooth low energy to enable mobile lab measurements for hand-held spectrometers. The (...)

Guía del usuario: PDF
No disponible en TI.com
Adaptador de interfaz

CC256XSTBTBLESW — Pila Bluetooth® de modo dual TI en MCU STM32F4

TI's Dual-mode Bluetooth stack on STM32F4 MCUs software for Bluetooth + Bluetooth Low Energy enables the STM32 ARM Cortex M4 and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified for CC256XSTBTBLESW (QDID 69887 (...)

Guía del usuario: PDF | HTML
Ver opciones
Kit de desarrollo de software (SDK)

TIBLUETOOTHSTACK-SDK — Pila Bluetooth® de modo dual TI

TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth Low Energy and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0/4.1/4.2 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, (...)

Guía del usuario: PDF | HTML
Ver opciones
Controlador o biblioteca

CC256XM4BTBLESW — Pila Bluetooth® de modo dual TI en MCU TM4C

TI’s Dual-mode Bluetooth stack on TM4C MCUs software for Bluetooth + Bluetooth Low Energy enables the TM4C12x MCU and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849), provides (...)
Guía del usuario: PDF
Descargar
Controlador o biblioteca

CC256XMS432BTBLESW — Pila Bluetooth de modo dual TI en MCU MSP432

TI’s Dual-mode Bluetooth stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886), provides (...)
Guía del usuario: PDF
Descargar
Controlador o biblioteca

CC256XMSPBTBLESW — Pila Bluetooth® de modo dual TI en MCU MSP430™

TI’s Dual-mode Bluetooth stack on MSP430™ MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP430 MCU and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849), (...)
Guía del usuario: PDF
Descargar
IDE, configuración, compilador o depurador

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

Productos y hardware compatibles

Productos y hardware compatibles

Este recurso de diseño es compatible con la mayoría de los productos de estas categorías.

Revise la página de detalles del producto para verificar la compatibilidad.
Iniciar Opciones de descarga
Certificación

CC256X-CERTIFICATION — Certificación de radio para Bluetooth de modo dual

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
Ver opciones
Certificación

CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports

Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
Productos y hardware compatibles

Productos y hardware compatibles

Productos
Productos Wi-Fi
CC2564 — Bluetooth® 4.0 con velocidad de datos mejorada (EDR), baja energía (LE) y ANT CC2564C — Bluetooth® 5.1 con velocidad básica (BR), velocidad de datos mejorada (EDR), baja energía (LE) CC2564MODA — Bluetooth® 4.1 con velocidad básica, velocidad de datos mejorada, módulo de baja energía (LE) con an CC2564MODN — Bluetooth® 4.1 con velocidad básica (BR), velocidad de datos mejorada (EDR), módulo de baja energía
Desarrollo de hardware
BOOST-CC2564MODA — Módulo enchufable BoosterPack™ de cadena margarita con sensores de temperatura TMP107 CC2564MODAEM — Módulo Bluetooth® CC2564 de modo dual con placa de evaluación de antena integrada CC2564MODNEM — Placa de evaluación de módulo Bluetooth® de modo dual CC2564 CC256XCQFN-EM — Módulo de evaluación de controlador Bluetooth® de modo dual CC2564C CC256XQFNEM — Placa de evaluación de CC2564 Bluetooth® de modo dual
Opciones de descarga
Herramienta de diseño

DUALMODE-BT-DESIGN-REVIEWS — Revisiones de diseño de hardware para dispositivos CC256x

To get started with the dual-mode Bluetooth® hardware design review process:
  • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC256x product page links below).
  • Step 2: (...)
Guía del usuario: PDF
Solicitar
Archivo Gerber

CC2564MODNEM Design Files (Rev. A)

SWRA463A.ZIP (1836 KB)
Descargar
Diseños de referencia

TIDA-00554 — Espectrómetro DLP Ultra-mobile NIR para análisis químico portátil con conectividad Bluetooth

The ultra-mobile near-infrared (NIR) spectrometer reference design utilizes Texas Instruments' DLP technology in conjunction with a single-element InGaAs detector to deliver high performance measurements in a portable form factor that is more affordable than architectures using an expensive InGaAs (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

BT-MSPAUDSINK-RD — Diseño de referencia de receptor de audio MSP430 y Bluetooth

TI's Bluetooth + MSP430 Audio sink reference design can be used by customers to create a variety of applications for low end, low power audio solutions. Some application possibilities - toys, low end bluetooth speakers, audio streaming accessories. This reference design is a cost effective audio (...)
Guía del usuario: PDF
Esquema: PDF
Diseños de referencia

CC256XEM-RD — Diseño de referencia de Bluetooth® CC256x

This CC256x Bluetooth® evaluation module reference design is an RF reference design with antenna which can be easily connected to many Microcontroller Units (MCUs), such as TI's MSP430 or Tiva C series MCUs. The reference design can be copied into your board, allowing for a cost-effective design (...)
Guía del usuario: PDF
Esquema: PDF
Diseños de referencia

BT-MSPAUDSOURCE-RD — Diseño de referencia de fuente de audio MSP MCU y Bluetooth

The Bluetooth and low-power MSP microcontroller Audio Source reference design can be used by customers to create a variety of applications for low-end, low-power audio source solutions for applications including toys, projectors, smart remotes and any audio streaming accessories. This reference (...)
Guía del usuario: PDF
Esquema: PDF
Paquete Pasadores Descargar
QFM (MOE) 33 Ver opciones
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

Ver todos los temas del foro en inglés

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

Videos