CY74FCT574T

ACTIVO

Biestables tipo D con activación de borde octal con salidas de 3 estados

Detalles del producto

Number of channels 8 Technology family FCT Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 100 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (µA) 200 Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 8 Technology family FCT Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 100 IOL (max) (mA) 64 IOH (max) (mA) -32 Supply current (max) (µA) 200 Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
SOIC (DW) 20 131.84 mm² 12.8 x 10.3 SSOP (DBQ) 20 51.9 mm² 8.65 x 6
  • Function, Pinout, and Drive Compatible With FCT and F Logic
  • Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
  • Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
  • Ioff Supports Partial-Power-Down Mode Operation
  • Matched Rise and Fall Times
  • Fully Compatible With TTL Input and Output Logic Levels
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Edge-Triggered D-Type Inputs
  • 250-MHz Typical Switching Rate
  • CY54FCT574T
    • 32-mA Output Sink Current
    • 12-mA Output Source Current
  • CY74FCT574T
    • 64-mA Output Sink Current
    • 32-mA Output Source Current
  • 3-State Outputs

  • Function, Pinout, and Drive Compatible With FCT and F Logic
  • Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
  • Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
  • Ioff Supports Partial-Power-Down Mode Operation
  • Matched Rise and Fall Times
  • Fully Compatible With TTL Input and Output Logic Levels
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Edge-Triggered D-Type Inputs
  • 250-MHz Typical Switching Rate
  • CY54FCT574T
    • 32-mA Output Sink Current
    • 12-mA Output Source Current
  • CY74FCT574T
    • 64-mA Output Sink Current
    • 32-mA Output Source Current
  • 3-State Outputs

The \x92FCT574T devices are high-speed, low-power, octal D-type flip-flops, featuring separate D-type inputs for each flip-flop. These devices have 3-state outputs for bus-oriented applications. A buffered clock (CP) and output-enable (OE\) inputs are common to all flip-flops. The \x92FCT574T are identical to \x92FCT374T, except for a flow-through pinout to simplify board design. The eight flip-flops in the \x92FCT574T store the state of their individual D inputs that meet the setup-time and hold-time requirements on the low-to-high CP transition. When OE\ is low, the contents of the eight flip-flops are available at the outputs. When OE\ is high, the outputs are in the high-impedance state. The state of OE\ does not affect the state of the flip-flops.

These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The \x92FCT574T devices are high-speed, low-power, octal D-type flip-flops, featuring separate D-type inputs for each flip-flop. These devices have 3-state outputs for bus-oriented applications. A buffered clock (CP) and output-enable (OE\) inputs are common to all flip-flops. The \x92FCT574T are identical to \x92FCT374T, except for a flow-through pinout to simplify board design. The eight flip-flops in the \x92FCT574T store the state of their individual D inputs that meet the setup-time and hold-time requirements on the low-to-high CP transition. When OE\ is low, the contents of the eight flip-flops are available at the outputs. When OE\ is high, the outputs are in the high-impedance state. The state of OE\ does not affect the state of the flip-flops.

These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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Documentación técnica

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Tipo Título Fecha
* Data sheet 8-Bit Registers With 3-State Outputs datasheet 11 oct 2001
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 15 dic 2022
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 jun 2004
User guide CYFCT Parameter Measurement Information 02 abr 2001
Selection guide Advanced Bus Interface Logic Selection Guide 09 ene 2001

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

14-24-LOGIC-EVM — Módulo de evaluación genérico de productos lógicos para encapsulados D, DB, DGV, DW, DYY, NS y PW de

El módulo de evaluación 14-24-LOGIC-EVM (EVM) está diseñado para admitir cualquier dispositivo lógico que esté en un encapsulado D, DW, DB, NS, PW, DYY o DGV de 14 a 24 pines.

Guía del usuario: PDF | HTML
Paquete Pasadores Descargar
SOIC (DW) 20 Ver opciones
SSOP (DBQ) 20 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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