PAL16R6AM

ACTIVO

Circuitos PAL estándar de alta velocidad

Detalles del producto

Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Clock frequency (max) (MHz) 25 Supply current (max) (µA) 180000 Rating Military Operating temperature range (°C) -55 to 125
Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Clock frequency (max) (MHz) 25 Supply current (max) (µA) 180000 Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 20 167.464 mm² 24.2 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Choice of Operating Speeds
    • High-Speed, A Devices . . . 25 MHz Min
    • Half-Power, A-2 Devices . . . 16 MHz Min
  • Choice of Input/Output Configuration
  • Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package
  • DEVICE
    I
    INPUTS
    3-STATE
    O OUTPUTS
    REGISTERED
    Q OUTPUTS
    I/O
    PORT
    S
    PAL16L8
    10
    2
    0
    6
    PAL16R4
    8
    0
    4 (3-state buffers)
    4
    PAL16R6
    8
    0
    6 (3-state buffers)
    2
    PAL16R8
    8
    0
    8 (3-state buffers)
    0

    PAL is a registered trademark of Advanced Micro Devices Inc.

  • Choice of Operating Speeds
    • High-Speed, A Devices . . . 25 MHz Min
    • Half-Power, A-2 Devices . . . 16 MHz Min
  • Choice of Input/Output Configuration
  • Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package
  • DEVICE
    I
    INPUTS
    3-STATE
    O OUTPUTS
    REGISTERED
    Q OUTPUTS
    I/O
    PORT
    S
    PAL16L8
    10
    2
    0
    6
    PAL16R4
    8
    0
    4 (3-state buffers)
    4
    PAL16R6
    8
    0
    6 (3-state buffers)
    2
    PAL16R8
    8
    0
    8 (3-state buffers)
    0

    PAL is a registered trademark of Advanced Micro Devices Inc.

These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allow for quick design of "custom" functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The Half-Power versions offer a choice of operating frequency, switching speeds, and power dissipation. In many cases, these Half-Power devices can result in significant power reduction from an overall system level.

The PAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.

These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allow for quick design of "custom" functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The Half-Power versions offer a choice of operating frequency, switching speeds, and power dissipation. In many cases, these Half-Power devices can result in significant power reduction from an overall system level.

The PAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.

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Documentación técnica

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Tipo Título Fecha
* Data sheet Standard High-Speed Programmable Array Logic Circuits datasheet 01 mar 1992
* SMD PAL16R6AM SMD 81036092A 21 jun 2016

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Encapsulado Pines Símbolos CAD, huellas y modelos 3D
CDIP (J) 20 Ultra Librarian
LCCC (FK) 20 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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