Inicio Lógica y traducción de voltaje Configurable & programmable logic ICs Programmable logic arrays (PLA)
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Configurable & programmable logic ICs
Programmable logic arrays (PLA)

PAL16R6AM

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PAL16R6AM

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Detalles del producto

Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Clock frequency (max) (MHz) 25 Supply current (max) (µA) 180000 Rating Military Operating temperature range (°C) -55 to 125
Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Clock frequency (max) (MHz) 25 Supply current (max) (µA) 180000 Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 20 167.464 mm² 24.2 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Choice of Operating Speeds
    • High-Speed, A Devices . . . 25 MHz Min
    • Half-Power, A-2 Devices . . . 16 MHz Min
  • Choice of Input/Output Configuration
  • Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package
    • DEVICE
    		I
    INPUTS
    		 3-STATE
    O OUTPUTS
    		 REGISTERED
    Q OUTPUTS
    		 I/O
    PORT
    S
    PAL16L8
    10
    2
    0
    6
    PAL16R4
    8
    0
    4 (3-state buffers)
    4
    PAL16R6
    8
    0
    6 (3-state buffers)
    2
    PAL16R8
    8
    0
    8 (3-state buffers)
    0

    PAL is a registered trademark of Advanced Micro Devices Inc.
  • Choice of Operating Speeds
    • High-Speed, A Devices . . . 25 MHz Min
    • Half-Power, A-2 Devices . . . 16 MHz Min
  • Choice of Input/Output Configuration
  • Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package
    • DEVICE
    		I
    INPUTS
    		 3-STATE
    O OUTPUTS
    		 REGISTERED
    Q OUTPUTS
    		 I/O
    PORT
    S
    PAL16L8
    10
    2
    0
    6
    PAL16R4
    8
    0
    4 (3-state buffers)
    4
    PAL16R6
    8
    0
    6 (3-state buffers)
    2
    PAL16R8
    8
    0
    8 (3-state buffers)
    0

    PAL is a registered trademark of Advanced Micro Devices Inc.

These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allow for quick design of "custom" functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The Half-Power versions offer a choice of operating frequency, switching speeds, and power dissipation. In many cases, these Half-Power devices can result in significant power reduction from an overall system level.

The PAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.

These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allow for quick design of "custom" functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The Half-Power versions offer a choice of operating frequency, switching speeds, and power dissipation. In many cases, these Half-Power devices can result in significant power reduction from an overall system level.

The PAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.

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Documentación técnica

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Tipo Título Fecha
* Data sheet Standard High-Speed Programmable Array Logic Circuits datasheet 01 mar 1992
* SMD PAL16R6AM SMD 81036092A 21 jun 2016

Diseño y desarrollo

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Paquete Pasadores Descargar
CDIP (J) 20 Ver opciones
LCCC (FK) 20 Ver opciones
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Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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