LMH6723
- Large Signal Bandwidth and Slew Rate 100% Tested
- 370 MHz Bandwidth (AV = 1, VOUT = 0.5 VPP)
−3 dB BW - 260 MHz (AV = +2 V/V, VOUT = 0.5 VPP)
−3 dB BW - 1 mA Supply Current
- 110 mA Linear Output Current
- 0.03%, 0.11° Differential Gain, Phase
- 0.1 dB Gain Flatness to 100 MHz
- Fast Slew Rate: 600 V/µs
- Unity Gain Stable
- Single Supply Range of 4.5 to 12V
- Improved Replacement for CLC450, CLC452, (LMH6723)
The LMH6723/LMH6724 provides a 260 MHz small signal bandwidth at a gain of +2 V/V and a 600 V/µs slew rate while consuming only 1 mA from ±5V supplies.
The LMH6723/LMH6724 supports video applications with its 0.03% and 0.11° differential gain and phase for NTSC and PAL video signals, while also offering a flat gain response of 0.1 dB to 100 MHz. Additionally, the LMH6723/LMH6724 can deliver 110 mA of linear output current. This level of performance, as well as a wide supply range of 4.5 to 12V, makes the LMH6723/LMH6724 an ideal op amp for a variety of portable applications. With small packages (SOIC and SOT-23), low power requirement, and high performance, the LMH6723/LMH6724 serves a wide variety of portable applications.
The LMH6723/LMH6724 is manufactured in Texas Instruments VIP10 complimentary bipolar process.
技術資料
| 上位の文書 | タイプ | タイトル | フォーマットオプション | 最新の英語版をダウンロード | 日付 | |
|---|---|---|---|---|---|---|
| * | データシート | LMH6723/LMH6724 Single/Dual/Quad 370-MHz, 1-mA Current Feedback Operational Amplifier データシート (Rev. I) | PDF | HTML | 2014/08/20 | ||
| 技術記事 | 3 common questions when designing with high-speed amplifiers | PDF | HTML | 2020/07/17 | |||
| e-Book(PDF) | The Signal - オペアンプ設計ブログ集 | PDF | HTML | 英語版 | PDF | HTML | 2018/03/23 | |
| ユーザー・ガイド | AN-2095 LMH730316 SOT23-5 / SOT23-6 Hi Performance Amplifier Eval Board (Rev. B) | 2013/05/01 |
設計と開発
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National Semiconductor offers this unpopulated Evaluation Board to aid in the evaluation and testing of high-speed Op Amp that are offered in the 5-/6-Pin SOT-23 package. This 4 layer board is designed to improve speed and reduce harmonic distortion by careful placement and routing of components (...)
| パッケージ | ピン数 | CAD シンボル、フットプリント、および 3D モデル |
|---|---|---|
| SOT-23 (DBV) | 5 | Ultra Librarian |
| WAFERSALE (YS) | — | Ultra Librarian |
| SOIC (D) | 8 | Ultra Librarian |