製品詳細

DSP type 1 C54x DSP (max) (MHz) 160 CPU 16-bit Operating system DSP/BIOS Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 100
DSP type 1 C54x DSP (max) (MHz) 160 CPU 16-bit Operating system DSP/BIOS Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 100
LQFP (PGE) 144 484 mm² 22 x 22
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Advanced Multibus Architecture With Three Separate 16-Bit Data Memory Buses and One Program Memory Bus
  • 40-Bit Arithmetic Logic Unit (ALU) Including a 40-Bit Barrel Shifter and Two Independent 40-Bit Accumulators
  • 17- × 17-Bit Parallel Multiplier Coupled to a 40-Bit Dedicated Adder for Non-Pipelined Single-Cycle Multiply/Accumulate (MAC) Operation
  • Compare, Select, and Store Unit (CSSU) for the Add/Compare Selection of the Viterbi Operator
  • Exponent Encoder to Compute an Exponent Value of a 40-Bit Accumulator Value in a Single Cycle
  • Two Address Generators With Eight Auxiliary Registers and Two Auxiliary Register Arithmetic Units (ARAUs)
  • Data Bus With a Bus Holder Feature
  • Extended Addressing Mode for 8M × 16-Bit Maximum Addressable External Program Space
  • 128K x 16-Bit On-Chip RAM Composed of:
    • Eight Blocks of 8K × 16-Bit On-Chip Dual-Access Program/Data RAM
    • Eight Blocks of 8K × 16-Bit On-Chip Single-Access Program RAM
  • 16K × 16-Bit On-Chip ROM Configured for Program Memory
  • Enhanced External Parallel Interface (XIO2)
  • Single-Instruction-Repeat and Block-Repeat Operations for Program Code
  • Block-Memory-Move Instructions for Better Program and Data Management
  • Instructions With a 32-Bit Long Word Operand
  • Instructions With Two- or Three-Operand Reads
  • Arithmetic Instructions With Parallel Store and Parallel Load
  • Conditional Store Instructions
  • Fast Return From Interrupt
  • On-Chip Peripherals
    • Software-Programmable Wait-State Generator and Programmable Bank-Switching
    • On-Chip Programmable Phase-Locked Loop (PLL) Clock Generator With External Clock Source
    • One 16-Bit Timer
    • Six-Channel Direct Memory Access (DMA) Controller
    • Three Multichannel Buffered Serial Ports (McBSPs)
    • 8/16-Bit Enhanced Parallel Host-Port Interface (HPI8/16)
  • Power Consumption Control With IDLE1, IDLE2, and IDLE3 Instructions With Power-Down Modes
  • CLKOUT Off Control to Disable CLKOUT
  • On-Chip Scan-Based Emulation Logic, IEEE Std 1149.1 (JTAG) Boundary Scan Logic
  • 144-Pin Ball Grid Array (BGA) (GGU Suffix)
  • 144-Pin Low-Profile Quad Flatpack (LQFP) (PGE Suffix)
  • 6.25-ns Single-Cycle Fixed-Point Instruction Execution Time (160 MIPS)
  • 3.3-V I/O Supply Voltage
  • 1.6-V Core Supply Voltage

All trademarks are the property of their respective owners.

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
TMS320C54x and MicroStar BGA are trademarks of Texas Instruments.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Advanced Multibus Architecture With Three Separate 16-Bit Data Memory Buses and One Program Memory Bus
  • 40-Bit Arithmetic Logic Unit (ALU) Including a 40-Bit Barrel Shifter and Two Independent 40-Bit Accumulators
  • 17- × 17-Bit Parallel Multiplier Coupled to a 40-Bit Dedicated Adder for Non-Pipelined Single-Cycle Multiply/Accumulate (MAC) Operation
  • Compare, Select, and Store Unit (CSSU) for the Add/Compare Selection of the Viterbi Operator
  • Exponent Encoder to Compute an Exponent Value of a 40-Bit Accumulator Value in a Single Cycle
  • Two Address Generators With Eight Auxiliary Registers and Two Auxiliary Register Arithmetic Units (ARAUs)
  • Data Bus With a Bus Holder Feature
  • Extended Addressing Mode for 8M × 16-Bit Maximum Addressable External Program Space
  • 128K x 16-Bit On-Chip RAM Composed of:
    • Eight Blocks of 8K × 16-Bit On-Chip Dual-Access Program/Data RAM
    • Eight Blocks of 8K × 16-Bit On-Chip Single-Access Program RAM
  • 16K × 16-Bit On-Chip ROM Configured for Program Memory
  • Enhanced External Parallel Interface (XIO2)
  • Single-Instruction-Repeat and Block-Repeat Operations for Program Code
  • Block-Memory-Move Instructions for Better Program and Data Management
  • Instructions With a 32-Bit Long Word Operand
  • Instructions With Two- or Three-Operand Reads
  • Arithmetic Instructions With Parallel Store and Parallel Load
  • Conditional Store Instructions
  • Fast Return From Interrupt
  • On-Chip Peripherals
    • Software-Programmable Wait-State Generator and Programmable Bank-Switching
    • On-Chip Programmable Phase-Locked Loop (PLL) Clock Generator With External Clock Source
    • One 16-Bit Timer
    • Six-Channel Direct Memory Access (DMA) Controller
    • Three Multichannel Buffered Serial Ports (McBSPs)
    • 8/16-Bit Enhanced Parallel Host-Port Interface (HPI8/16)
  • Power Consumption Control With IDLE1, IDLE2, and IDLE3 Instructions With Power-Down Modes
  • CLKOUT Off Control to Disable CLKOUT
  • On-Chip Scan-Based Emulation Logic, IEEE Std 1149.1 (JTAG) Boundary Scan Logic
  • 144-Pin Ball Grid Array (BGA) (GGU Suffix)
  • 144-Pin Low-Profile Quad Flatpack (LQFP) (PGE Suffix)
  • 6.25-ns Single-Cycle Fixed-Point Instruction Execution Time (160 MIPS)
  • 3.3-V I/O Supply Voltage
  • 1.6-V Core Supply Voltage

All trademarks are the property of their respective owners.

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
TMS320C54x and MicroStar BGA are trademarks of Texas Instruments.

The SM320VC5416 fixed-point, digital signal processor (DSP) (hereafter referred to as the 5416 unless otherwise specified) is based on an advanced modified Harvard architecture that has one program memory bus and three data memory buses. This processor provides an arithmetic logic unit (ALU) with a high degree of parallelism, application-specific hardware logic, on-chip memory, and additional on-chip peripherals. The basis of the operational flexibility and speed of this DSP is a highly specialized instruction set.

Separate program and data spaces allow simultaneous access to program instructions and data, providing a high degree of parallelism. Two read operations and one write operation can be performed in a single cycle. Instructions with parallel store and application-specific instructions can fully utilize this architecture. In addition, data can be transferred between data and program spaces. Such parallelism supports a powerful set of arithmetic, logic, and bit-manipulation operations that can all be performed in a single machine cycle. The 5416 also includes the control mechanisms to manage interrupts, repeated operations, and function calls.

The SM320VC5416 fixed-point, digital signal processor (DSP) (hereafter referred to as the 5416 unless otherwise specified) is based on an advanced modified Harvard architecture that has one program memory bus and three data memory buses. This processor provides an arithmetic logic unit (ALU) with a high degree of parallelism, application-specific hardware logic, on-chip memory, and additional on-chip peripherals. The basis of the operational flexibility and speed of this DSP is a highly specialized instruction set.

Separate program and data spaces allow simultaneous access to program instructions and data, providing a high degree of parallelism. Two read operations and one write operation can be performed in a single cycle. Instructions with parallel store and application-specific instructions can fully utilize this architecture. In addition, data can be transferred between data and program spaces. Such parallelism supports a powerful set of arithmetic, logic, and bit-manipulation operations that can all be performed in a single machine cycle. The 5416 also includes the control mechanisms to manage interrupts, repeated operations, and function calls.

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技術資料

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種類 タイトル 最新の英語版をダウンロード 日付
* データシート SM320VC5416-EP Fixed-Point Digital Signal Processor データシート 2003年 6月 18日
* VID SM320VC5416-EP VID V6204610 2016年 6月 21日

設計と開発

その他のアイテムや必要なリソースを参照するには、以下のタイトルをクリックして詳細ページをご覧ください。

デバッグ・プローブ

TMDSEMU200-U — XDS200 USB デバッグ・プローブ

XDS200 は、TI の組込みデバイスのデバッグに使用できるデバッグ・プローブ (エミュレータ) です。XDS200 は、低コストの XDS110 と高性能の XDS560v2 に比べて、低コストと良好な性能のバランスを特長としています。単一のポッド (筐体) で、多様な規格 (IEEE1149.1、IEEE1149.7、SWD) をサポートします。すべての XDS デバッグ・プローブは、組込みトレース・バッファ (ETB) を搭載しているすべての Arm® プロセッサと DSP プロセッサで、コア・トレースとシステム・トレースをサポートしています。ピン経由でコア・トレースを実行する場合、 (...)

デバッグ・プローブ

TMDSEMU560V2STM-U — XDS560™ ソフトウェア v2 システム・トレース USB デバッグ・プローブ

XDS560v2 は、XDS560™ ファミリのデバッグ・プローブの中で最高の性能を達成し、従来の JTAG 規格 (IEEE1149.1) と cJTAG (IEEE1149.7) の両方をサポートしています。シリアル・ワイヤ・デバッグ (SWD) をサポートしていないことに注意してください。

すべての XDS デバッグ・プローブは、組み込みトレース・バッファ (ETB) を搭載しているすべての ARM プロセッサと DSP プロセッサで、コア・トレースとシステム・トレースをサポートしています。ピン経由でコア・トレースを実行する場合、XDS560v2 PRO TRACE が必要です。

(...)

デバッグ・プローブ

TMDSEMU560V2STM-UE — Spectrum Digital XDS560v2 システム・トレース USB およびイーサネット

The XDS560v2 System Trace is the first model of the XDS560v2 family of high-performance debug probes (emulators) for TI processors. The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).

The (...)

設計ツール

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TI は複数の企業と提携し、TI の各種プロセッサを使用した幅広いソフトウェア、ツール、SOM (システム・オン・モジュール) を提供する方法で、量産までの開発期間短縮を支援しています。この検索ツールをダウンロードすると、サード・パーティーの各種ソリューションを手早く参照し、お客様のニーズに適したサード・パーティーを見つけることができます。掲載されている各種ソフトウェア、ツール、モジュールの製造と管理を実施しているのは、TI (テキサス・インスツルメンツ) ではなく独立系サード・パーティー各社です。

検索ツールは、製品の種類別に以下の分類を採用しています。

  • ツールに該当するのは、IDE (...)
パッケージ ピン数 ダウンロード
LQFP (PGE) 144 オプションの表示

購入と品質

記載されている情報:
  • RoHS
  • REACH
  • デバイスのマーキング
  • リード端子の仕上げ / ボールの原材料
  • MSL 定格 / ピーク リフロー
  • MTBF/FIT 推定値
  • 材質成分
  • 認定試験結果
  • 継続的な信頼性モニタ試験結果
記載されている情報:
  • ファブの拠点
  • 組み立てを実施した拠点

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