ISO6731-Q1
- Functional Safety-Capable
- Documentation available to aid functional safety system design: ISO6731-Q1
- AEC-Q100 qualified with the following results:
- Device temperature Grade 1: –40°C to +125°C ambient operating temperature range
- Meets VDA320 isolation requirements
- 50 Mbps data rate
- Robust isolation barrier:
- High lifetime at 1500 VRMS working voltage
- Up to 5000 VRMS isolation rating
- Up to 10 kV surge capability
- ±75 kV/µs typical CMTI
- Wide supply range: 1.71 V to 1.89 V and 2.25 V to 5.5 V
- 1.71 V to 5.5 V level translation
- Default output high (ISO6731-Q1) and low (ISO6731F-Q1) options
- 1.6 mA per channel typical at 1 Mbps
- Low propagation delay: 11 ns typical
- Robust electromagnetic compatibility (EMC)
- System-level ESD, EFT, and surge immunity
- ±8 kV IEC 61000-4-2 contact discharge protection across isolation barrier
- Low emissions
- Wide-SOIC (DW-16) Package
- Safety-Related Certifications:
- DIN VDE V 0884-11:2017-01
- UL 1577 component recognition program
- IEC 62368-1, IEC 61010-1, IEC 60601-1
- GB 4943.1-2011 certifications (pending)
The ISO6731-Q1 device is a high-performance, triple-channel digital isolators ideal for cost-sensitive applications requiring up to 5000 VRMS isolation ratings per UL 1577. This device is also certified by VDE, TUV, CSA, and CQC.
The ISO6731-Q1 devics provides high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by TIs double capacitive silicon dioxide (SiO2) insulation barrier. This device comes with enable pins which can be used to put the respective outputs in high impedance for multi-master driving applications. The ISO6731-Q1 device has two forward and one reverse-direction channels. In the event of input power or signal loss, the default output is high for the device without suffix F and low for the device with suffix F. See Device Functional Modes section for further details.
Used in conjunction with isolated power supplies, this device helps prevent noise currents on data buses, such as CAN and LIN from damaging sensitive circuitry. Through innovative chip design and layout techniques, the electromagnetic compatibility of the ISO6731-Q1 device has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO6731-Q1 device is available in a 16-pin SOIC wide-body (DW) package and is a pin-to-pin upgrade to the older generations.
관심 가지실만한 유사 제품
비교 대상 장치보다 업그레이드된 기능을 지원하는 드롭인 대체품
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | ISO6731-Q1 General-Purpose Triple-Channel Automotive Digital Isolator with Robust EMC datasheet (Rev. A) | PDF | HTML | 2021/03/17 |
Certificate | VDE Certificate for Reinforced Isolation for DIN EN IEC 60747-17 (Rev. S) | 2024/02/29 | ||
Certificate | CQC Certificate for ISOxxDWx (Rev. J) | 2023/03/27 | ||
Certificate | CSA Certificate for ISO67xxDW | 2023/02/16 | ||
Certificate | TUV Certificate for Isolation Devices (Rev. K) | 2022/08/05 | ||
Certificate | UL Certificate of Compliance File E181974 Vol 4 Sec 6 (Rev. P) | 2022/08/05 | ||
White paper | Why are Digital Isolators Certified to Meet Electrical Equipment Standards? | 2021/11/16 | ||
White paper | Distance Through Insulation: How Digital Isolators Meet Certification Requiremen | PDF | HTML | 2021/06/11 | |
Functional safety information | ISO6731-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA | PDF | HTML | 2021/02/22 | |
User guide | ISO67xx Triple- and Quad-Digital Isolator Evaluation Module | PDF | HTML | 2020/07/30 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
DIGI-ISO-EVM — 범용 디지털 아이솔레이터 평가 모듈
DIGI-ISO-EVM은 5가지 패키지(8핀 네로우 바디 SOIC(D), 8핀 와이드 바디 SOIC(DWV), 16핀 와이드 바디 SOIC(DW), 16핀 울트라 와이드 바디 SOIC(DWW), 16핀 QSOP(DBQ) 패키지)에서 TI 싱글 채널, 듀얼 채널, 트리플 채널, 쿼드 채널 또는 6채널 디지털 절연기 장치를 평가하는 데 사용되는 평가 모듈(EVM)입니다. EVM에는 최소한의 외부 구성품으로 장치를 평가할 수 있는 충분한 Berg 핀 옵션이 있습니다.
ISO6741DWEVM — ISO67xx 범용, 트리플 또는 쿼드 채널 디지털 아이솔레이터 평가 모듈
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOIC (DW) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.