ISO7631FC
- Signaling Rate: 150 Mbps (M-Grade), 25 Mbps
(C-Grade) - Robust Design with Integrated Noise Filter
(C-Grade) - Low Power Consumption, Typical ICC per Channel
(3.3-V Supplies):- ISO7631FM: 2 mA at 10 Mbps
- ISO7631FC: 1.5 mA at 10 Mbps
- ISO7641FC: 1.3 mA at 10 Mbps
- Extremely-Low ICC_disable (C-Grade)
- Low Propagation Delay: 7 ns Typical (M-Grade)
- Output Defaults to Low-State in Fail-Safe Mode
- Wide Temperature Range: –40°C to 125°C
- 50 KV/µs Transient Immunity, Typical
- Long Life With SiO2 Isolation Barrier
- Operates From 2.7-V (M-Grade), 3.3-V and 5-V
Supply and Logic Levels - 2.7-V (M-Grade), 3.3-V and 5-V Level Translation
- Wide Body SOIC-16 Package
- Safety and Regulatory Approvals
- 2500 VRMS Isolation for 1 Minute per UL 1577
- 4242 VPK Basic Insulation per DIN V VDE V
0884-10 and DIN EN 61010-1 - CSA Component Acceptance Notice 5A, IEC
60950-1 and IEC 61010-1 End Equipment
Standards - CQC Certification per GB4943.1-2011
- TUV 3000 VRMS Reinforced Insulation
according to EN/UL/CSA 60950-1 and
EN/UL/CSA 61010-1
The ISO7631F and ISO7641F devices provide galvanic isolation up to 4242 VPK per VDE. The ISO7631F device has three channels, two of which operate in the forward direction and one which operates in the reverse direction. The ISO7641F device has 4 channels, three of which operate in the forward direction and one of which operates in the reverse direction. Suffix F indicates that output defaults to low-state in fail-safe conditions (see ). M-Grade devices are high-speed isolators capable of up to150-Mbps data rates with fast propagation delays, whereas C-Grade devices are capable of up to 25-Mbps data rates with low power consumption and integrated filters for noise-prone applications. C-Grade devices are recommended for lower-speed applications where input noise pulses of less than 6 ns duration must be suppressed, or when low-power consumption is critical.
Each isolation channel has a logic input and output buffer separated by a silicon dioxide (SiO2) insulation barrier. Used in conjunction with isolated power supplies, these devices prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. The devices have TTL input thresholds and can operate from 2.7-V (M-Grade), 3.3-V and 5-V supplies. All inputs are 5-V tolerant when supplied from 3.3-V or 2.7-V supplies.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | ISO76x1 Low-Power Triple and Quad-Channels Digital Isolators datasheet (Rev. F) | PDF | HTML | 2016/04/22 |
Certificate | VDE Certificate for Basic Isolation for DIN EN IEC 60747-17 (Rev. W) | 2024/01/31 | ||
White paper | Improve Your System Performance by Replacing Optocouplers with Digital Isolators (Rev. C) | PDF | HTML | 2023/09/07 | |
Certificate | CSA Certificate for ISO76xxDW | 2023/03/03 | ||
Certificate | CQC Certificate for ISO752xDW, ISO76xxDW (Rev. A) | 2023/02/07 | ||
Certificate | ISO76x, ISO75xx TUV Certificate | 2022/08/08 | ||
Certificate | UL Certificate of Compliance File E181974 Vol 4 Sec 4 | 2022/08/08 | ||
White paper | Why are Digital Isolators Certified to Meet Electrical Equipment Standards? | 2021/11/16 | ||
White paper | Distance Through Insulation: How Digital Isolators Meet Certification Requiremen | PDF | HTML | 2021/06/11 | |
EVM User's guide | Universal Digital Isolator Evaluation Module | PDF | HTML | 2021/03/04 | |
Application brief | Considerations for Selecting Digital Isolators | 2018/07/24 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
DIGI-ISO-EVM — 범용 디지털 아이솔레이터 평가 모듈
DIGI-ISO-EVM은 5가지 패키지(8핀 네로우 바디 SOIC(D), 8핀 와이드 바디 SOIC(DWV), 16핀 와이드 바디 SOIC(DW), 16핀 울트라 와이드 바디 SOIC(DWW), 16핀 QSOP(DBQ) 패키지)에서 TI 싱글 채널, 듀얼 채널, 트리플 채널, 쿼드 채널 또는 6채널 디지털 절연기 장치를 평가하는 데 사용되는 평가 모듈(EVM)입니다. EVM에는 최소한의 외부 구성품으로 장치를 평가할 수 있는 충분한 Berg 핀 옵션이 있습니다.
ISO723X724XEVM — ISO723X724XEVM 평가 모듈
The ISO723X724X evaluation module (EVM) supports the rapid, parametric evaluation of the Triple and Quad Digital Isolators. The EVM will be delivered with an ISO7241C soldered on the board. If another device is desired, please order samples from www.ti.com. If you do not have the capability to (...)
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOIC (DW) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치