제품 상세 정보

DSP type 1 C54x DSP (max) (MHz) 160 CPU 16-bit Operating system DSP/BIOS Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 100
DSP type 1 C54x DSP (max) (MHz) 160 CPU 16-bit Operating system DSP/BIOS Rating HiRel Enhanced Product Operating temperature range (°C) -40 to 100
LQFP (PGE) 144 484 mm² 22 x 22
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Advanced Multibus Architecture With Three Separate 16-Bit Data Memory Buses and One Program Memory Bus
  • 40-Bit Arithmetic Logic Unit (ALU) Including a 40-Bit Barrel Shifter and Two Independent 40-Bit Accumulators
  • 17- × 17-Bit Parallel Multiplier Coupled to a 40-Bit Dedicated Adder for Non-Pipelined Single-Cycle Multiply/Accumulate (MAC) Operation
  • Compare, Select, and Store Unit (CSSU) for the Add/Compare Selection of the Viterbi Operator
  • Exponent Encoder to Compute an Exponent Value of a 40-Bit Accumulator Value in a Single Cycle
  • Two Address Generators With Eight Auxiliary Registers and Two Auxiliary Register Arithmetic Units (ARAUs)
  • Data Bus With a Bus Holder Feature
  • Extended Addressing Mode for 8M × 16-Bit Maximum Addressable External Program Space
  • 128K x 16-Bit On-Chip RAM Composed of:
    • Eight Blocks of 8K × 16-Bit On-Chip Dual-Access Program/Data RAM
    • Eight Blocks of 8K × 16-Bit On-Chip Single-Access Program RAM
  • 16K × 16-Bit On-Chip ROM Configured for Program Memory
  • Enhanced External Parallel Interface (XIO2)
  • Single-Instruction-Repeat and Block-Repeat Operations for Program Code
  • Block-Memory-Move Instructions for Better Program and Data Management
  • Instructions With a 32-Bit Long Word Operand
  • Instructions With Two- or Three-Operand Reads
  • Arithmetic Instructions With Parallel Store and Parallel Load
  • Conditional Store Instructions
  • Fast Return From Interrupt
  • On-Chip Peripherals
    • Software-Programmable Wait-State Generator and Programmable Bank-Switching
    • On-Chip Programmable Phase-Locked Loop (PLL) Clock Generator With External Clock Source
    • One 16-Bit Timer
    • Six-Channel Direct Memory Access (DMA) Controller
    • Three Multichannel Buffered Serial Ports (McBSPs)
    • 8/16-Bit Enhanced Parallel Host-Port Interface (HPI8/16)
  • Power Consumption Control With IDLE1, IDLE2, and IDLE3 Instructions With Power-Down Modes
  • CLKOUT Off Control to Disable CLKOUT
  • On-Chip Scan-Based Emulation Logic, IEEE Std 1149.1 (JTAG) Boundary Scan Logic
  • 144-Pin Ball Grid Array (BGA) (GGU Suffix)
  • 144-Pin Low-Profile Quad Flatpack (LQFP) (PGE Suffix)
  • 6.25-ns Single-Cycle Fixed-Point Instruction Execution Time (160 MIPS)
  • 3.3-V I/O Supply Voltage
  • 1.6-V Core Supply Voltage

All trademarks are the property of their respective owners.

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
TMS320C54x and MicroStar BGA are trademarks of Texas Instruments.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Advanced Multibus Architecture With Three Separate 16-Bit Data Memory Buses and One Program Memory Bus
  • 40-Bit Arithmetic Logic Unit (ALU) Including a 40-Bit Barrel Shifter and Two Independent 40-Bit Accumulators
  • 17- × 17-Bit Parallel Multiplier Coupled to a 40-Bit Dedicated Adder for Non-Pipelined Single-Cycle Multiply/Accumulate (MAC) Operation
  • Compare, Select, and Store Unit (CSSU) for the Add/Compare Selection of the Viterbi Operator
  • Exponent Encoder to Compute an Exponent Value of a 40-Bit Accumulator Value in a Single Cycle
  • Two Address Generators With Eight Auxiliary Registers and Two Auxiliary Register Arithmetic Units (ARAUs)
  • Data Bus With a Bus Holder Feature
  • Extended Addressing Mode for 8M × 16-Bit Maximum Addressable External Program Space
  • 128K x 16-Bit On-Chip RAM Composed of:
    • Eight Blocks of 8K × 16-Bit On-Chip Dual-Access Program/Data RAM
    • Eight Blocks of 8K × 16-Bit On-Chip Single-Access Program RAM
  • 16K × 16-Bit On-Chip ROM Configured for Program Memory
  • Enhanced External Parallel Interface (XIO2)
  • Single-Instruction-Repeat and Block-Repeat Operations for Program Code
  • Block-Memory-Move Instructions for Better Program and Data Management
  • Instructions With a 32-Bit Long Word Operand
  • Instructions With Two- or Three-Operand Reads
  • Arithmetic Instructions With Parallel Store and Parallel Load
  • Conditional Store Instructions
  • Fast Return From Interrupt
  • On-Chip Peripherals
    • Software-Programmable Wait-State Generator and Programmable Bank-Switching
    • On-Chip Programmable Phase-Locked Loop (PLL) Clock Generator With External Clock Source
    • One 16-Bit Timer
    • Six-Channel Direct Memory Access (DMA) Controller
    • Three Multichannel Buffered Serial Ports (McBSPs)
    • 8/16-Bit Enhanced Parallel Host-Port Interface (HPI8/16)
  • Power Consumption Control With IDLE1, IDLE2, and IDLE3 Instructions With Power-Down Modes
  • CLKOUT Off Control to Disable CLKOUT
  • On-Chip Scan-Based Emulation Logic, IEEE Std 1149.1 (JTAG) Boundary Scan Logic
  • 144-Pin Ball Grid Array (BGA) (GGU Suffix)
  • 144-Pin Low-Profile Quad Flatpack (LQFP) (PGE Suffix)
  • 6.25-ns Single-Cycle Fixed-Point Instruction Execution Time (160 MIPS)
  • 3.3-V I/O Supply Voltage
  • 1.6-V Core Supply Voltage

All trademarks are the property of their respective owners.

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
TMS320C54x and MicroStar BGA are trademarks of Texas Instruments.

The SM320VC5416 fixed-point, digital signal processor (DSP) (hereafter referred to as the 5416 unless otherwise specified) is based on an advanced modified Harvard architecture that has one program memory bus and three data memory buses. This processor provides an arithmetic logic unit (ALU) with a high degree of parallelism, application-specific hardware logic, on-chip memory, and additional on-chip peripherals. The basis of the operational flexibility and speed of this DSP is a highly specialized instruction set.

Separate program and data spaces allow simultaneous access to program instructions and data, providing a high degree of parallelism. Two read operations and one write operation can be performed in a single cycle. Instructions with parallel store and application-specific instructions can fully utilize this architecture. In addition, data can be transferred between data and program spaces. Such parallelism supports a powerful set of arithmetic, logic, and bit-manipulation operations that can all be performed in a single machine cycle. The 5416 also includes the control mechanisms to manage interrupts, repeated operations, and function calls.

The SM320VC5416 fixed-point, digital signal processor (DSP) (hereafter referred to as the 5416 unless otherwise specified) is based on an advanced modified Harvard architecture that has one program memory bus and three data memory buses. This processor provides an arithmetic logic unit (ALU) with a high degree of parallelism, application-specific hardware logic, on-chip memory, and additional on-chip peripherals. The basis of the operational flexibility and speed of this DSP is a highly specialized instruction set.

Separate program and data spaces allow simultaneous access to program instructions and data, providing a high degree of parallelism. Two read operations and one write operation can be performed in a single cycle. Instructions with parallel store and application-specific instructions can fully utilize this architecture. In addition, data can be transferred between data and program spaces. Such parallelism supports a powerful set of arithmetic, logic, and bit-manipulation operations that can all be performed in a single machine cycle. The 5416 also includes the control mechanisms to manage interrupts, repeated operations, and function calls.

다운로드 스크립트와 함께 비디오 보기 동영상

기술 문서

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
모두 보기2
유형 직함 날짜
* Data sheet SM320VC5416-EP Fixed-Point Digital Signal Processor datasheet 2003/06/18
* VID SM320VC5416-EP VID V6204610 2016/06/21

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

디버그 프로브

TMDSEMU200-U — XDS200 USB 디버그 프로브

XDS200은 TI 임베디드 디바이스 디버깅에 사용되는 디버그 프로브(에뮬레이터)입니다. XDS200은 저렴한 XDS110 및 고성능 XDS560v2에 비해 저렴한 비용으로 우수한 성능을 균형 있게 제공합니다. 단일 포드에서 광범위한 표준(IEEE1149.1, IEEE1149.7, SWD)을 지원합니다. 모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 Arm® 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 코어 추적의 경우 XDS560v2 PRO TRACE가 (...)

TI.com에서 구매할 수 없습니다
디버그 프로브

TMDSEMU560V2STM-U — XDS560v2 시스템 추적 USB 디버그 프로브

XDS560v2는 디버그 프로브의 XDS560™ 제품군 중 최고의 성능을 가진 제품으로, 기존의 JTAG 표준(IEEE1149.1)과 cJTAG(IEEE1149.7)를 모두 지원합니다. SWD(직렬 와이어 디버그)는 지원하지 않습니다.

모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 ARM 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.

XDS560v2는 MIPI HSPT 60핀 커넥터(TI 14핀, (...)

TI.com에서 구매할 수 없습니다
디버그 프로브

TMDSEMU560V2STM-UE — XDS560v2 시스템 추적 USB 및 이더넷 디버그 프로브

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)

TI.com에서 구매할 수 없습니다
설계 툴

PROCESSORS-3P-SEARCH — Arm 기반 MPU, arm 기반 MCU 및 DSP 타사 검색 툴

TI는 여러 회사와의 협력을 통해 TI 프로세서를 사용하여 광범위한 소프트웨어, 툴 및 SOM을 제공해서 생산 단계로 가는 속도를 높이고 있습니다. 이 검색 툴을 다운로드하여 타사 솔루션을 빠르게 검색하고 필요에 맞는 올바른 타사를 찾아보세요. 여기에 나열된 소프트웨어, 툴 및 모듈은 텍사스 인스트루먼트가 아닌 독립적인 타사에서 생산 및 관리하고 있습니다.

검색 툴은 다음과 같이 제품 유형별로 분류되어 있습니다.

  • 툴에는 IDE/컴파일러, 디버그 및 추적, 시뮬레이션 및 모델링 소프트웨어, 플래시 프로그래머가 포함되어 있습니다.
  • OS에는 (...)
패키지 다운로드
LQFP (PGE) 144 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

동영상