SN65LVDS180
- Meets or Exceeds the Requirements of ANSI
TIA/EIA-644-1995 Standard - Full-Duplex Signaling Rates up to 150 Mbps
- Bus-Pin ESD Exceeds 12 kV
- Operates From a Single 3.3-V Supply
- Low-Voltage Differential Signaling With Typical
Output Voltages of 350 mV and a 100-Ω Load - Propagation Delay Times
- Driver: 1.7 ns Typical
- Receiver: 3.7 ns Typical
- Power Dissipation at 200 MHz
- Driver: 25 mW Typical
- Receiver: 60 mW Typical
- LVTTL Input Levels Are 5-V Tolerant
- Receiver Maintains High Input Impedance With
VCC < 1.5 V - Receiver Has Open-Circuit Fail Safe
The SN65LVDS179, SN65LVDS180, SN65LVDS050, and SN65LVDS051 devices are differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve signaling rates as high as 400 Mbps. The TIA/EIA-644 standard-compliant electrical interface provides a minimum differential output voltage magnitude of 247 mV into a 100-Ω load and receipt of 100-mV signals with up to 1 V of ground potential difference between a transmitter and receiver.
These devices offer various driver, receiver, and enabling combinations in industry-standard footprints. Because these devices are intended for use in simplex or distributed simplex bus structures, the driver enable function does not put the differential outputs into a high-impedance state but rather disconnects the input and reduces the quiescent power used by the device. For these functions with a high-impedance driver output, see the SN65LVDM series of devices. All devices are characterized for operation from –40°C to 85°C.
관심 가지실만한 유사 제품
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기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 최신 영어 버전 다운로드 | 날짜 |
|---|---|---|---|---|---|
| * | 데이터 시트 | SN65LVDSxxx High-Speed Differential Line Drivers and Receivers datasheet (Rev. R) | PDF | HTML | 2016. 1. 22 | |
| Application brief | LVDS to Improve EMC in Motor Drives | 2018. 9. 27 | |||
| Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018. 8. 3 | |||
| Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018. 5. 16 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| TSSOP (PW) | 14 | Ultra Librarian |
| SOIC (D) | 14 | Ultra Librarian |
주문 및 품질
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.