SN75LVDS051
- Meets or Exceeds the Requirements of ANSI TIA/EIA-644-1995 Standard
- Signaling Rates up to 155 Mbps
- Operates From a Single 3.3-V Supply
- Low-Voltage Differential Signaling With Typical Output Voltages of 350 mV and a 100
Load - LVTTL Input Levels are 5 V Tolerant
- Driver is High Impedance When Disabled or With VCC < 1.5 V
- Receiver has Open-Circuit Fail Safe
- Surface-Mount Packaging
- D Package (SOIC)
- Characterized For Operation From
0°C to 70°C
The SN75LVDS179, SN75LVDS180, SN75LVDS050, and SN75LVDS051 are differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve signaling rates as high as 155 Mbps. The TIA/EIA-644 standard compliant electrical interface provides a minimum differential output voltage magnitude of 247 mV into a 100
load and receipt of 100 mV signals with up to 1 V of ground potential difference between a transmitter and receiver.
The intended application of this device and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100
characteristic impedance. The transmission media may be printed-circuit board traces, backplanes, or cables. (Note: The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other application specific characteristics).
The SN75LVDS179, SN75LVDS180, SN75LVDS050, and SN75LVDS051 are characterized for operation from 0°C to 70°C.
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기술 자료
| 상위 문서 | 유형 | 직함 | 형식 옵션 | 최신 영어 버전 다운로드 | 날짜 |
|---|---|---|---|---|---|
| * | 데이터 시트 | High-Speed Differential Line Drivers And Receivers datasheet (Rev. A) | 2000. 3. 9 | ||
| Application brief | LVDS to Improve EMC in Motor Drives | 2018. 9. 27 | |||
| Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018. 8. 3 | |||
| Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018. 5. 16 | |||
| 애플리케이션 노트 | An Overview of LVDS Technology | 1998. 10. 5 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| SOIC (D) | 16 | Ultra Librarian |