TXS0206A
- Level Translator
- VCCA and VCCB Range of 1.1 V to 3.6 V
- Fast Propagation Delay (4.4 ns Maximum
When Translating Between 1.8 V and 3 V)
- ESD Protection Exceeds JESD 22
- 2500-V Human-Body Model (A114-B)
- 250-V Machine Model (A115-A)
- 1500-V Charged-Device Model (C101)
The TXS0206A is a level shifter for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards.
The voltage-level translator has two supply voltage pins. VCCA as well as VCCB can be operated over the full range of 1.1 V to 3.6 V. The TXS0206A enables system designers to easily interface applications processors or digital basebands to memory cards and SDIO peripherals operating at a different I/O voltage level.
The TXS0206A is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings. Memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206A an ideal choice for these applications.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TXS0206A SD Card Voltage-Translation Transceiver datasheet (Rev. B) | PDF | HTML | 2016/01/20 |
| Application note | Schematic Checklist - A Guide to Designing with Auto-Bidirectional Translators | PDF | HTML | 2024/07/12 | |
| Application note | Understanding Transient Drive Strength vs. DC Drive Strength in Level-Shifters (Rev. A) | PDF | HTML | 2024/07/03 | |
| Selection guide | Voltage Translation Buying Guide (Rev. A) | 2021/04/15 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
TXS0206AEVM — TXS0206A 평가 모듈
TXS0206A EVM 은 보드를 완전히 개발할 필요 없이 평가 및 프로토타입 제작을 간소화하기 위해 제작되었습니다. 이 EVM은 각 장치 핀에 대한 프로브 및 신호 연결을 위한 주변 기기 헤더 스타일 패드를 제공합니다.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| DSBGA (YFP) | 20 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치