計算工具
BQ51013B
- Integrated Wireless Power Supply Receiver Solution
- 93% Overall peak AC-DC efficiency
- Full synchronous rectifier
- WPC v1.2 compliant communication control
- Output voltage conditioning
- Only IC required between Rx coil and output
- Wireless power consortium (WPC) v1.2 compliant (FOD enabled) highly accurate current sense
- Dynamic rectifier control for improved load transient response
- Dynamic efficiency scaling for optimized performance over wide range of output power
- Adaptive communication limit for robust communication
- Supports 20-V maximum input
- Low-power dissipative rectifier overvoltage clamp (VOVP = 15 V)
- Thermal shutdown
- Multifunction NTC and control pin for temperature monitoring, charge complete, and fault host control
The BQ51013B device is a single-chip, advanced, flexible, secondary-side device for wireless power transfer in portable applications capable of providing up to 5 W. The BQ51013B devices provide the receiver (RX) AC-to-DC power conversion and regulation while integrating the digital control required to comply with the Wireless Power Consortium (WPC) Qi v1.2 communication protocol. Together with the BQ50012A primary-side controller (or other Qi transmitter), the BQ51013B enables a complete contactless power transfer system for a wireless power supply solution. Global feedback is established from the secondary to the primary to control the power transfer process using the Qi v1.2 protocol.
The BQ51013B integrates a low-resistance synchronous rectifier, low-dropout regulator (LDO), digital control, and accurate voltage and current loops to ensure high efficiency and low power dissipation.
The BQ51013B also includes a digital controller that calculates the amount of power received by the mobile device within the limits set by the WPC v1.2 standard. The controller then communicates this information to the transmitter (TX) to allow the TX to determine if a foreign object is present within the magnetic interface and introduces a higher level of safety within magnetic field. This Foreign Object Detection (FOD) method is part of the requirements under the WPC v1.2 specification.
技術文件
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檢視所有 4 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | BQ51013B Highly Integrated Wireless Receiver Qi (WPC v1.2) Compliant Power Suppl datasheet (Rev. D) | 2020年 9月 22日 | |
| Product overview | Battery Management Solutions for Wearable and Fitness Devices (Rev. C) | 2014年 8月 18日 | ||
| Application note | Test and Troubleshoot a Wireless Power Receiver | 2014年 8月 6日 | ||
| EVM User's guide | bq51013xEVM-764 Evaluation Module (WCSP Package) (Rev. A) | 2013年 8月 5日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| DSBGA (YFP) | 28 | Ultra Librarian |
| VQFN (RHL) | 20 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。