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CC2564C

現行

符合 Bluetooth 核心 5.1 標準的 Bluetooth® 雙模式收發器

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CC2564C

現行
產品規格表 立即訂購

產品詳細資料

CPU Proprietary Type Transceiver Technology 2.4 GHz, Bluetooth® Classic, Bluetooth® Dual-Mode, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.1 Operating system FreeRTOS, Linux Features Advanced audio distribution profile, Classic audio, Hands-free profile Edge AI enabled No Security Secure communication Rating Catalog Operating temperature range (°C) -40 to 85
CPU Proprietary Type Transceiver Technology 2.4 GHz, Bluetooth® Classic, Bluetooth® Dual-Mode, Bluetooth® LE Protocols Qualified against Bluetooth® Core 5.1 Operating system FreeRTOS, Linux Features Advanced audio distribution profile, Classic audio, Hands-free profile Edge AI enabled No Security Secure communication Rating Catalog Operating temperature range (°C) -40 to 85
VQFNP-MR (RVM) 76 64 mm² (8 mm × 8 mm)
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack
  • TI’s Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 5.1 Delaration ID D049226
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • VQFNP-MR Package Family, RVM Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • HCI Tester Tool to Evaluate RF Performance of the Device and Configure Service Pack

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventh-generation Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

 
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技術文件

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 CC2564C Dual-Mode Bluetooth® Controller datasheet (Rev. B) 2020/12/2
應用說明 QFN and SON PCB Attachment (Rev. C) PDF | HTML 2023/12/6
使用指南 CC256x TI Bluetooth Stack SPPLEDemo App PDF | HTML 2023/8/8
使用指南 CC256x TI’s Bluetooth Stack Basic HFGAGDemo APP PDF | HTML 2023/8/8
使用指南 TI Bluetooth Stack HIDDemo App PDF | HTML 2023/8/4
選擇指南 CC256x Getting Started Selection Guide (Rev. C) PDF | HTML 2022/5/13
選擇指南 無線連線技術選擇指南 (Rev. B) Download English Version (Rev.B) 2022/3/7
更多文件說明 Dual-Mode Bluetooth® CC256xCQFNEM Evaluation Board (Rev. C) PDF | HTML 2021/12/20
使用指南 CC2564C TI Dual-mode Bluetooth Stack on MSP432 MCUs (Rev. B) PDF | HTML 2021/12/20
使用指南 CC2564C TI Dual-mode Bluetooth Stack on STM32F4 MCUs (Rev. B) PDF | HTML 2021/12/2
Application brief TI Bluetooth CC2564C Solution (Rev. B) PDF | HTML 2021/12/1
使用指南 CC2564B to CC2564C Migration Guide (Rev. B) PDF | HTML 2021/12/1
使用指南 Bluetopia Stack Build Guide for Linux PDF | HTML 2021/1/15
使用指南 CC2564x Demo Applications User's Guide PDF | HTML 2020/12/17
網路安全諮詢 Bluetooth Low Energy – Invalid Connection Request (SweynTooth) (Rev. A) PDF | HTML 2020/7/17
網路安全諮詢 Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V PDF | HTML 2020/5/18
網路安全諮詢 Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) PDF | HTML 2020/5/18
應用說明 Capturing Bluetooth Host Controller Interface (HCI) Logs 2019/1/7
白皮書 Which TI Bluetooth® solution should I choose? 2017/5/5
白皮書 White Paper: Why Classic Bluetooth® (BR/EDR)? 2017/5/4
技術文章 Introducing TI’s dual-mode Bluetooth® 4.2 CC2564C solution PDF | HTML 2016/12/13
應用說明 Application Notes for CC2564C Bluetooth® 4.1 and 4.2 2016/11/1

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

CC256XCQFN-EM — CC2564C 雙模式 Bluetooth® 控制器評估模組

TI CC256xC Bluetooth® 裝置為一套支援基本速率 (BR)、強化資料傳輸速率 (EDR) 及 LE 主機控制器介面 (HCI) 的解決方案，可減少設計工作並加快上市時間。此模組採用 TI 第七代核心架構，是經過產品實證，支援 Bluetooth 5.1 雙模式通訊協定的解決方案。CC256xQFN-EM 電路板用於評估雙模式藍牙 CC2564C 控制器，該控制器支援傳統藍牙和 Bluetooth® 低耗能 (LE) 無線技術。

使用指南: PDF | HTML
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開發板

PIDEU-3P-PAN13X6C — Panasonic Industry PAN13x6C 藍牙射頻 (RF) 模組

Panasonic 的 PAN1326C2 / PAN1316C 系列為主機控制介面 (HCI) Bluetooth® 射頻 (RF) 模組，讓 Texas Instruments™ 第七代藍牙核心積體電路 CC2564C 成為易於使用的模組形式。PAN1326C2/PAN1316C 與 Bluetooth® 5.1 相容，且可提供同級最佳的 RF 性能，涵蓋範圍約為其他藍牙低功耗解決方案的兩倍。此系列提供兩種版本：一種具備整合式晶片天線 (ENW89823A5KF)，可將 RF 設計作業降至最低；另一種具備 RF 底部焊盤 (...)

從：Panasonic Industrial Devices Europe GmbH
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子卡

BDE-3P-BD2564CX — BDE BD2564Cx 無線模組

BDE-3P-BD2564Cx 模組為 Bluetooth 5.1 基本速率 (BR)、增強資料速率 (EDR) 以及低功耗 (LE) 雙模式收發器模組，以 TI 的 CC2564C 為基礎。.這些模組具備高達 +10dBm 的傳輸功率，以及及高達 -93dBm 的接收靈敏度，提供同級最佳的 RF 性能。通過認證且免權利金的雙模式 Bluetooth 5.1 通訊協定軟體堆疊和設定檔，以及各種範例應用，有助於減少設計心力，並確保加快上市時間。此模組提供兩種不同天線選項的變體：適用於外部天線的 ANT 針腳，以及和整合式 PCB 追蹤天線。

從：BDE Technology Inc.
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子卡

BDE-3P-BDM209B — BDE BDM209B dual-mode Bluetooth® module

BDE-BDM209B is a Bluetooth 5.1 Basic Rate (BR), Enhanced Data Rate (EDR) and Low Energy (LE) Dual-Mode module.

The module offers Bluetooth Classic and Bluetooth LE radio (CC2564C) from Texas Instruments (TI) and an ultra-low-power Arm® Cortex®-M4 32-bit MCU (STM32L431). It integrates all required (...)

從：BDE Technology Inc.
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IDE、配置、編譯器或偵錯程式

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

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驅動程式或資料庫

CC2564CMSP432BTBLESW — MSP432 MCU 的 CC2564C TI 雙模式 Bluetooth® 堆疊

TI 在 MSP432 MCU 上的 CC2564C 雙模式 Bluetooth® 堆疊軟體，適用於 Bluetooth + Bluetooth 低功耗，支援 MSP432 MCU，並包含實作 Bluetooth 5.1 規格的單模式與雙模式產品。Bluetooth 堆疊已完全通過認證（QDID172096 和 QDID172097），提供簡易的命令行範例應用程式以加速開發，並且根據需求提供 MFI 功能。

如需完整的評估解決方案，CC2564C 雙模式 Bluetooth 堆疊可直接與 TI 硬體開發套件配合使用：EXP432P401R、BOOST-CCEMADAPTER 和 (...)

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驅動程式或資料庫

CC2564CSTBTBLESW — STM32F4 MCU 的 CC2564C TI 雙模式 Bluetooth® 堆疊

TI 在 STM32F4 MCU 上的 CC2564C 雙模式 Bluetooth® 堆疊軟體，適用於 Bluetooth + Bluetooth 低功耗，支援 STM32 ARM Cortex M4 MCU，並包含實作 Bluetooth 5.1 規格的單模式與雙模式產品。Bluetooth 堆疊已完全通過認證（QDID172096 和 QDID172097），提供簡易的命令行範例應用程式以加速開發，並且根據需求提供 MFI 功能。

如需完整的評估解決方案，CC2564C 雙模式 Bluetooth 堆疊可直接與 TI 硬體開發套件配合使用：STM3240G-EVAL。此外，適用於 (...)

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驅動程式或資料庫

CC256XC-BT-SP — 適用於 CC256xC 的 Bluetooth® Service Pack

CC256xC Bluetooth Service Pack (SP) 包含具有平台特定配置和錯誤修復的強制初始化指令碼（BTS 檔案）。

此外，Bluetooth Service Pack 也包含 CC2564C 裝置的搭配檔案，可用於測試與偵錯。Service Pack 由以下檔案組成：

  • 初始指令碼 BTS 檔案 (initscripts-TIInit_6.12.26.bts)
  • 初始指令碼附加元件
    • 音訊/語音處理附加元件 (initscripts-TIInit_6.12.26_avpr_add-on.bts)
    • BLE 附加元件 (...)
lock = 需要匯出核准 (1 分鐘)
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驅動程式或資料庫

TI-BT-STACK-LINUX-ADDON — 適用於 AM335x EVM、AM437x EVM 以及具有 WL18xx 和 CC256x 之 BeagleBone 的 TI Bluetooth Linux 外掛程式

本套件包含 TI Bluetooth 堆疊與 Platform Manager 的安裝套件、預編譯物件與原始碼，可輕鬆升級 AM437x EVM、AM335x EVM 或 BeagleBone 上的預設 LINUX EZSDK 二進位。該軟體使用 Linaro GCC 4.7 建置，可以新增到其他平台上使用類似工具鏈的 Linux SDK 中。

Bluetooth 堆疊已完全通過認證（QDID172096 和 QDID172097），提供簡易的命令行範例應用程式以加速開發，並且根據需求提供 MFI 功能。

有關授權資訊、發行說明和支援的設定檔，請下載套件。如需 TI Bluetooth 堆疊和 (...)

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認證

CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports

您是否正在尋找 CC256x 模組認證支援？CC256x 認證可為您的產品成功認證提供相關資訊和支援。在此頁面中，您會找到我們模組及評估電路板的最新認證報告。
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設計工具

DUALMODE-BT-DESIGN-REVIEWS — 適用於 CC256x 裝置的硬體設計審查

若要開始進行雙模式 Bluetooth® 硬體設計審查程序，請執行以下步驟：

  • 步驟 1：申請審查之前，請務必檢閱技術文件與相關產品頁的設計與開發資源（請參閱下方的 CC256x 產品頁連結）。
  • 步驟 2：下載並填寫硬體設計審查申請表。
  • 步驟 3：請將填好的硬體設計審查申請表及所需文件以電子郵件傳送至：dualmode-bt-hw-review@list.ti.com

雙模式 Bluetooth 硬體設計審查流程提供一對一接觸的方式，並由主題內容專家協助審查您的設計，提供您寶貴的意見。在要求審查之前，請務必檢閱技術文件及相應產品頁上提供的設計與開發資源。產品頁資源可能不再需要進行設計審查。< /p>

(...)

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封裝 針腳 CAD 符號、佔位空間與 3D 模型
VQFNP-MR (RVM) 76 Ultra Librarian
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