CC2745R7-Q1

現行

具有 864kB 快閃記憶體、HSM、APU、CAN-FD 的車用 SimpleLink™ Bluetooth® LE 無線 MCU

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產品規格表

document-pdfAcrobat CC274xR-Q1, CC274xP-Q1 Automotive SimpleLink™ Bluetooth® Low Energy Wireless MCU datasheet (Rev. D) (英文) PDF | HTML

使用指南

document-pdfAcrobat
CC27xx Technical Reference Manual (Rev. A) (英文)

CC2745R7-Q1

現行

產品規格表

立即訂購

產品詳細資料

Type

Wireless MCU

Technology

2.4 GHz, Bluetooth® LE

Protocols

Qualified against Bluetooth® Core 6.0

CPU

Arm® Cortex®-M33

Flash memory (kByte)

864

RAM (kByte)

128

CAN (#)

CAN-FD

Number of GPIOs

TX power (max) (dBm)

Features

AEC-Q100 Grade 2 qualified, Channel Sounding, DC/DC, Integrated Algorithm Processing Unit (APU), Integrated RF switch, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD

Peripherals

1 Watchdog timer, 1 comparator, 12-bit ADC, 2 SPI, 2 UART, 4 timers, I2C, I2S, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC)

Security

Cryptographic acceleration, Hardware-enforced isolation, ISO21434 automotive cybersecurity compliant, Secure boot, Secure storage

Cryptographic accelerators

AES, ECC, RSA, SHA-2, TRNG

Rating

Automotive

Operating temperature range (°C)

-40 to 125

TI functional safety category

Hardware accelerators

CDE NPU

Edge AI enabled

Yes

Type

Wireless MCU

Technology

2.4 GHz, Bluetooth® LE

Protocols

Qualified against Bluetooth® Core 6.0

CPU

Arm® Cortex®-M33

Flash memory (kByte)

864

RAM (kByte)

128

CAN (#)

CAN-FD

Number of GPIOs

TX power (max) (dBm)

Features

AEC-Q100 Grade 2 qualified, Channel Sounding, DC/DC, Integrated Algorithm Processing Unit (APU), Integrated RF switch, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD

Peripherals

1 Watchdog timer, 1 comparator, 12-bit ADC, 2 SPI, 2 UART, 4 timers, I2C, I2S, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC)

Security

Cryptographic acceleration, Hardware-enforced isolation, ISO21434 automotive cybersecurity compliant, Secure boot, Secure storage

Cryptographic accelerators

AES, ECC, RSA, SHA-2, TRNG

Rating

Automotive

Operating temperature range (°C)

-40 to 125

TI functional safety category

Hardware accelerators

CDE NPU

Edge AI enabled

Yes

VQFN (RHA)

36 mm² (6 mm × 6 mm)

Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
Algorithm Processing Unit (APU) (96MHz)
- Mathematical accelerator for efficient vector and matrix operations
- Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)

Up to 1MB of in-system programmable flash
Up to 162KB of SRAM
32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
Serial wire debug (SWD)

AEC-Q100 Grade 2 qualified:
- –40°C to +125°C junction temperature
HBM ESD Classification Level 2 (ESD HBM level 1C on RF pin, per AEC-Q100 Rev. J)
CDM ESD Classification Level C2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)

23 GPIOs, digital peripherals can be routed to multiple GPIOs:
- Two SWD IO pads, multiplexed with GPIOs
- Two LFXT IO pads, multiplexed with GPIOs
- 19 DIOs (analog or digital IOs)
All GPIOs with wakeup and interrupt capabilities
3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
Real-time clock (RTC)
Watchdog timer
System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
12-bit ADC, up to 1.2MSPS, eight external inputs
Temperature sensor and battery monitor
1× low-power comparator
2× UART with LIN capability
2× SPI
1× I2C
1× I2S
1× CAN-FD controller with CAN/CAN-FD ISO 16845-1:2016 certification compliance

ISO21434 Automotive Cybersecurity Compliant
Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
- AES (up to 256 bits) crypto accelerator
- ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
- SHA-2 (up to 512 bits) accelerator
- True random number generator
- HSM firmware update support
- Differential power analysis (DPA) countermeasures for AES and ECC
Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
Secure boot and secure firmware updates
Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
Voltage glitch monitor (VGM)

On-chip buck DC/DC converter
RX current: 6.1mA
TX current at 0dBm: 7.7mA
TX current at +10dBm: 24.5mA (R variant)
TX current at +20dBm: 143mA (P variant)
Active mode MCU 96MHz (CoreMark): 6.8mA
Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
Shutdown: 160nA

Bluetooth® Core 6.0 Qualified
- Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)

2.4GHz RF transceiver compatible with Bluetooth Low Energy specification
Output power up to +10dBm (R variant)
Output power up to +20dBm (P variant)
Integrated BALUN
Integrated RF switch
Receiver sensitivity:
- Bluetooth LE 125kbps: –103.5dBm
- Bluetooth LE 1Mbps: –97dBm

Regulatory compliance

Designed for systems targeting compliance with worldwide radio frequency regulations
- EN 300 328 (Europe)
- FCC CFR47 Part 15 (US)
- ARIB STD-T66 (Japan)

LP-EM-CC2745R10-Q1, LP-EM-CC2755P10 LaunchPad™ Development Kit
BP-EM-CS Multiple antenna board for Bluetooth Channel Sounding
SimpleLink™ Low Power F3 Software Development Kit (SDK)
- Fully qualified Bluetooth® software protocol stack in the SDK
  - Up to 32 concurrent multirole connections
  - Bluetooth Low Energy 6.0 Support
  - CCC Digital Key 3 / ICCE Bluetooth APIs support for secure car access systems
Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
SysConfig system configuration tool
SmartRF™ Studio for simple radio configuration

Operating ranges

Junction temperature TJ: –40°C to 125°C
Wide supply voltage range 1.71V to 3.8V

Package

6mm × 6mm QFN40 with wettable flanks
RoHS-compliant package

Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
Algorithm Processing Unit (APU) (96MHz)
- Mathematical accelerator for efficient vector and matrix operations
- Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)

Up to 1MB of in-system programmable flash
Up to 162KB of SRAM
32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
Serial wire debug (SWD)

AEC-Q100 Grade 2 qualified:
- –40°C to +125°C junction temperature
HBM ESD Classification Level 2 (ESD HBM level 1C on RF pin, per AEC-Q100 Rev. J)
CDM ESD Classification Level C2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)

23 GPIOs, digital peripherals can be routed to multiple GPIOs:
- Two SWD IO pads, multiplexed with GPIOs
- Two LFXT IO pads, multiplexed with GPIOs
- 19 DIOs (analog or digital IOs)
All GPIOs with wakeup and interrupt capabilities
3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
Real-time clock (RTC)
Watchdog timer
System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
12-bit ADC, up to 1.2MSPS, eight external inputs
Temperature sensor and battery monitor
1× low-power comparator
2× UART with LIN capability
2× SPI
1× I2C
1× I2S
1× CAN-FD controller with CAN/CAN-FD ISO 16845-1:2016 certification compliance

ISO21434 Automotive Cybersecurity Compliant
Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
- AES (up to 256 bits) crypto accelerator
- ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
- SHA-2 (up to 512 bits) accelerator
- True random number generator
- HSM firmware update support
- Differential power analysis (DPA) countermeasures for AES and ECC
Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
Secure boot and secure firmware updates
Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
Voltage glitch monitor (VGM)

On-chip buck DC/DC converter
RX current: 6.1mA
TX current at 0dBm: 7.7mA
TX current at +10dBm: 24.5mA (R variant)
TX current at +20dBm: 143mA (P variant)
Active mode MCU 96MHz (CoreMark): 6.8mA
Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
Shutdown: 160nA

Bluetooth® Core 6.0 Qualified
- Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)

2.4GHz RF transceiver compatible with Bluetooth Low Energy specification
Output power up to +10dBm (R variant)
Output power up to +20dBm (P variant)
Integrated BALUN
Integrated RF switch
Receiver sensitivity:
- Bluetooth LE 125kbps: –103.5dBm
- Bluetooth LE 1Mbps: –97dBm

Regulatory compliance

Designed for systems targeting compliance with worldwide radio frequency regulations
- EN 300 328 (Europe)
- FCC CFR47 Part 15 (US)
- ARIB STD-T66 (Japan)

LP-EM-CC2745R10-Q1, LP-EM-CC2755P10 LaunchPad™ Development Kit
BP-EM-CS Multiple antenna board for Bluetooth Channel Sounding
SimpleLink™ Low Power F3 Software Development Kit (SDK)
- Fully qualified Bluetooth® software protocol stack in the SDK
  - Up to 32 concurrent multirole connections
  - Bluetooth Low Energy 6.0 Support
  - CCC Digital Key 3 / ICCE Bluetooth APIs support for secure car access systems
Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
SysConfig system configuration tool
SmartRF™ Studio for simple radio configuration

Operating ranges

Junction temperature TJ: –40°C to 125°C
Wide supply voltage range 1.71V to 3.8V

Package

6mm × 6mm QFN40 with wettable flanks
RoHS-compliant package

The SimpleLink™ CC274xR-Q1 and CC274xP-Q1 devices are AEC-Q100 complaint wireless microcontrollers (MCUs) supporting Bluetooth Low Energy 6.0 for automotive applications. These devices are optimized for low-power wireless communication in applications such as car access, including passive entry passive start (PEPS), phone as a key (PaaK), and remote keyless entry (RKE). The key features of this device include:

Support for features in Bluetooth 6.0 and earlier versions:
- LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
Bluetooth Channel Sounding technology support and an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and a secure phase-based ranging mechanism for distance estimation
- APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT, super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC), and neural network algorithms.
ArmCustom Data Extension (CDE) instruction support for machine learning acceleration
Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
Advanced security features for connected wireless MCUs:
- An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
- Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
- Arm Cortex M33 TrustZone-M based trusted execution environment support
- Secure key storage support with HSM and TrustZone-M
- Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
- Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
Extended temperature support with the lowest standby current
Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

The CC274xR/P-Q1 devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

Support for features in Bluetooth 6.0 and earlier versions:
- LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
Bluetooth Channel Sounding technology support and an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and a secure phase-based ranging mechanism for distance estimation
- APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT, super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC), and neural network algorithms.
ArmCustom Data Extension (CDE) instruction support for machine learning acceleration
Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
Advanced security features for connected wireless MCUs:
- An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
- Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
- Arm Cortex M33 TrustZone-M based trusted execution environment support
- Secure key storage support with HSM and TrustZone-M
- Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
- Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
Extended temperature support with the lowest standby current
Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

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重要文件	類型	標題	格式選項	下載最新的英文版本		日期
*	資料表	CC274xR-Q1, CC274xP-Q1 Automotive SimpleLink™ Bluetooth® Low Energy Wireless MCU datasheet (Rev. D)	PDF \| HTML			2025/11/5
*	使用指南	CC27xx Technical Reference Manual (Rev. A)	PDF \| HTML			2025/5/19
*	勘誤表	CC274xx-Q1 SimpleLink ™ Wireless MCU Device Revision E Errata (Rev. B)	PDF \| HTML			2026/1/6
	應用說明	Practical Software Debugging Methods and Software Design FAQs for CC27xx and CC23xx	PDF \| HTML			2026/7/15
	Application brief	CC27xx HSM Timing Benchmarks	PDF \| HTML			2026/7/13
	網路安全諮詢	Invalid Bluetooth® LE Data Length Extension (DLE) Parameter Leading to DoS	PDF \| HTML			2026/5/28
	網路安全諮詢	Denial of Service during Bluetooth LE authentication and connection	PDF \| HTML			2026/5/28
	網路安全諮詢	Enabling Tools Client Mode Leads to Possibility of Bypassing Debug Authentication on CC27xx Devices	PDF \| HTML			2026/5/12
	應用說明	CC27xx Operation and Configuration Without an External 32kHz Crystal	PDF \| HTML			2026/5/11
	應用說明	CC234x and CC27xx Hardware Configuration and PCB Design Considerations (Rev. A)	PDF \| HTML			2026/2/4
	應用說明	AN103 -- Basic RF Testing of CCxxxx Devices (Rev. A)	PDF \| HTML			2025/12/11
	應用說明	How to Certify Your Bluetooth Product (Rev. N)	PDF \| HTML			2025/11/18
	證書	LP-EM-CC2745R10-Q1 EU Declaration of Conformity (DoC) (Rev. A)				2025/5/13
	技術文章	以低功率無線 MCU 解決關鍵無線連線網路安全挑戰 (Rev. A)	PDF \| HTML	Download English Version (Rev.A)	PDF \| HTML	2024/12/19
	應用說明	High Accuracy, Low Cost, Secure Ranging with Bluetooth Channel Sounding	PDF \| HTML			2024/2/27
	應用說明	RF PCB Simulation Cookbook				2019/1/9
	應用說明	CC-Antenna-DK2 and Antenna Measurements Summary (Rev. A)	PDF \| HTML			2017/10/2

設計與開發

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開發板

LP-EM-CC2745R10-Q1 — 適用 SimpleLink™ 2.4 GHz 無線 MCU 的 CC2745R10-Q1 LaunchPad™ 開發套件

此 LaunchPad™ 開發套件可加速開發具備整合式功率放大器與無線電支援以進行 2.4GHz 操作的裝置。LaunchPad 配備符合 AEC-Q100 規範的無線微控制器 (MCU)，可支援汽車應用的 Bluetooth® 低功耗（5.3 與即將推出的版本）。這是一款分離式 LaunchPad™ 開發套件，因此不包含 XDS 偵錯器。建議的偵錯器爲 LP-XDS110 或 LP-XDS110ET。

使用指南: PDF | HTML

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開發套件

LP-XDS110 — XDS110 LaunchPad™ 開發套件偵錯器

The LP-XDS110 LaunchPad 開發套件偵錯器，是可對德州儀器 (TI) 微控制器、微處理器和 DSP XDS 相容產品進行編程和偵錯的工具。The LP-XDS110 設計為透過 20 針腳邊緣連接器直接連接到分離式 Launchpad，也可用於對其他使用 XDS110 OUT 連接器的 LaunchPad 和 XDS 相容裝置進行偵錯。

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開發套件

LP-XDS110ET — 具有 EnergyTrace™ 軟體的 XDS110ET LaunchPad™ 開發套件偵錯器

LP-XDS110ET LaunchPad 開發套件偵錯器可用於對德州儀器 (TI) 微控制器、微處理器和 DSP XDS 相容裝置進行編程和偵錯。LP-XDS110ET 設計為透過 20 針腳邊緣連接器直接連接到分離式 Launchpad 開發套件，也可用於對其他使用 XDS110 OUT 連接器的 LaunchPad 開發套件和 XDS 相容裝置進行偵錯。LP-XDS110ET 增加了功率量測電路、可支援 EnergyTrace™ 軟體。

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偵錯探測器

TMDSEMU110-U — XDS110 JTAG 偵錯探測器

德州儀器 XDS110 是一種全新的偵錯探測器 (模擬器) 類別，適用於 TI 嵌入式處理器。XDS110 取代 XDS100 系列，可在單一 Pod 中支援更廣泛的標準 (IEEE1149.1、IEEE1149.7、SWD)。同時，所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。對於針腳上的核心追蹤，則需要 XDS560v2 PRO TRACE。

德州儀器 XDS110 透過 TI 20 針腳連接器（具有用於 TI 14 針腳和 Arm 10 針腳和 Arm 20 針腳的多轉接器）連接到目標電路板，並透過 USB2.0 (...)

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偵錯探測器

TSK-3P-BLUEBOX — TASKING BlueBox hardware debugger

TASKING’s Debug, Trace, and Test tools offer comprehensive solutions for efficient debugging, tracing, and testing of TI's embedded systems. The scalable TASKING BlueBox debuggers allow users to easily flash, debug, and test across TI's portfolio. Development on TI hardware is made even easier with (...)

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軟體開發套件 (SDK)

SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

SimpleLink™ 低功率 SDK 支援 CC13xx、CC23xx、CC26xx 及 CC27xx 產品系列。這些 SDK 搭配可提供適合開發 Sub-1 GHz 與 2.4 GHz 應用的全方位軟體套件，包括在 SimpleLink CC13xx、CC23xx、CC26xx 和 CC27xx 無線 MCU 上支援 Bluetooth® 低功耗、網狀網路、Zigbee®、Matter、Thread、802.15.4 型、專有與多協定解決方案。

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CCSTUDIO-OPENOCD — OpenOCD Binary Releases

Pre-built binaries for the popular open-source OpenOCD debug stack.

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檢視 GitHub

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IDE、配置、編譯器或偵錯程式

SYSCONFIG — Standalone desktop version of SysConfig

CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.

SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

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啟動

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IDE、配置、編譯器或偵錯程式

TSK-3P-VX-TOOLSET — 適用於 Arm 的 TASKING VX 工具套件

適用於 Arm 的 VX 工具套件是一套經過認證的編譯器工具鏈，可用於指定 Cortex-M 與 Cortex-R 核心裝置的安全關鍵嵌入式軟體開發。透過整合 Eclipse IDE、進階多核心支援，以及與 TASKING BlueBox 除錯器的相容性，VX 工具套件可簡化開發流程。通過 TÜV NORD 認證，符合 ISO 26262（最高支援 ASIL D）及 ISO 21434 標準。

從：TASKING Germany GmbH

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SMARTRF-STUDIO-8 — 適用於 CC23xx 和 CC27xx 裝置以及 CC140xP 收發器的 SmartRF Studio 8 應用軟體

SmartRF™ Studio 是一款 Windows 應用程式，功用在於協助射頻系統的設計人員在為所有 TI CC1xxx 及 CC2xxx 低功耗射頻裝置設計過程中，能在早期階段輕鬆評估無線電。此程式簡化了配置暫存器值和命令的產生，以及射頻系統的實際測試和除錯。

SmartRF Studio 支援下列 TI 裝置：

資源

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計算工具

BT-POWER-CALC — Bluetooth Power Calculator for CC13xx, CC26xx, CC23xx, and CC27xx devices

This tool is used to calculate Bluetooth Low Energy power consumption estimates for various use cases on TI Bluetooth devices. The calculator includes both advertising and peripheral use cases with the ability to configure different use case profile parameters. The calculator outputs an estimate (...)

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認證

CC27XX-REPORTS — LP-EM-CC27XX CE & FCC Certification Reports & DOC for Reference-only

This page provides access to the CC27XX certification reports for the CC27XX EVMs. EVM certification reports are provided for reference only. When using a chip down design, the customer is responsible for their own certification.

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設計工具