產品詳細資料

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5, 12 Protocols Analog Ron (typ) (Ω) 30 CON (typ) (pF) 5 Supply current (typ) (µA) 2 Bandwidth (MHz) 200 Operating temperature range (°C) -55 to 125 Features Break-before-make Input/output continuous current (max) (mA) 25 Rating Catalog Drain supply voltage (max) (V) 10 Supply voltage (max) (V) 10
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5, 12 Protocols Analog Ron (typ) (Ω) 30 CON (typ) (pF) 5 Supply current (typ) (µA) 2 Bandwidth (MHz) 200 Operating temperature range (°C) -55 to 125 Features Break-before-make Input/output continuous current (max) (mA) 25 Rating Catalog Drain supply voltage (max) (V) 10 Supply voltage (max) (V) 10
PDIP (N) 14 181.42 mm² 19.3 x 9.4 SOIC (D) 14 51.9 mm² 8.65 x 6 TSSOP (PW) 14 32 mm² 5 x 6.4
  • Wide Analog-Input-Voltage Range . . . 0V to 10V
  • Low "ON" Resistance
    • 45 (Typ) . . . . VCC = 4.5V
    • 35 (Typ) . . . . VCC = 6V
    • 30 (Typ) . .1fcVCC = 9V
  • Fast Switching and Propagation Delay Times
  • Low "OFF" Leakage Current
  • Built-In "Break-Before-Make" Switching
  • Suitable for Sample and Hold Applications
  • Wide Operating Temperature Range . . . -55°C to 125°C
  • HC Types
    • 2V to 10V Operation
    • High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V
  • Wide Analog-Input-Voltage Range . . . 0V to 10V
  • Low "ON" Resistance
    • 45 (Typ) . . . . VCC = 4.5V
    • 35 (Typ) . . . . VCC = 6V
    • 30 (Typ) . .1fcVCC = 9V
  • Fast Switching and Propagation Delay Times
  • Low "OFF" Leakage Current
  • Built-In "Break-Before-Make" Switching
  • Suitable for Sample and Hold Applications
  • Wide Operating Temperature Range . . . -55°C to 125°C
  • HC Types
    • 2V to 10V Operation
    • High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V

The CD74HC4016 contains four independent digitally controlled analog switches that use silicon-gate CMOS technology to achieve operating speeds similar to LSTTL with the low power consumption of standard CMOS integrated circuits.

Each switch has two input/output terminals (nY, nZ) and an active high enable input (nE). Current through the switch will not cause additional VCC current provided the analog voltage is maintained between VCC and GND.

The CD74HC4016 contains four independent digitally controlled analog switches that use silicon-gate CMOS technology to achieve operating speeds similar to LSTTL with the low power consumption of standard CMOS integrated circuits.

Each switch has two input/output terminals (nY, nZ) and an active high enable input (nE). Current through the switch will not cause additional VCC current provided the analog voltage is maintained between VCC and GND.

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類型 標題 日期
* Data sheet CD74HC4016 datasheet (Rev. C) 2004年 8月 2日
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 2022年 6月 2日
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 2021年 12月 1日
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
User guide Signal Switch Data Book (Rev. A) 2003年 11月 14日
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997年 6月 1日
Application note Designing With Logic (Rev. C) 1997年 6月 1日
Application note Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
Application note Live Insertion 1996年 10月 1日
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions 1996年 5月 1日
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996年 4月 1日

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The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

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PDIP (N) 14 檢視選項
SOIC (D) 14 檢視選項
TSSOP (PW) 14 檢視選項

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