產品詳細資料

CPU 1 Arm Cortex-A8 Frequency (MHz) 800, 1000 Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators Image video accelerator Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 105
CPU 1 Arm Cortex-A8 Frequency (MHz) 800, 1000 Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators Image video accelerator Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 105
FCCSP (CBP) 515 144 mm² (12 mm × 12 mm) FCCSP (CUS) 423 256 mm² (16 mm × 16 mm) FCCSP (CBC) 515 196 mm² (14 mm × 14 mm)
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

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技術文件

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 DM3730, DM3725 Digital Media Processors datasheet (Rev. D) 2011/4/11
* 勘誤表 DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F) 2014/2/13
應用說明 OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles PDF | HTML 2019/3/20
技術文章 Enabling Wi-Fi® and Bluetooth® connectivity on RTOS PDF | HTML 2016/4/13
技術文章 Spring has sprung. A sale has sprung. PDF | HTML 2016/4/4
應用說明 Plastic Ball Grid Array [PBGA] Application Note (Rev. B) 2015/8/13
技術文章 Selecting the right processor: WiLink 8 plug and play platforms PDF | HTML 2015/6/26
應用說明 PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) 2013/11/1
使用指南 AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 2012/9/10
使用指南 Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 2012/9/10
更多文件說明 DM37x Design Network Partners 2012/6/5
應用說明 TI OMAP4430 POP SMT Design Guideline (Rev. C) 2011/11/3
應用說明 Introduction to TMS320C6000 DSP Optimization 2011/10/6
應用說明 PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs 2011/6/15
Product overview DM3730 Product Bulletin 2010/9/7
應用說明 PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 2010/6/23
應用說明 PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 2010/6/23
應用說明 AM/DM37x Power Estimation Spreadsheet 2010/6/7
應用說明 AM/DM37x Overview 2010/6/3
應用說明 Setting up AM37x SDRC Registers 2010/6/3
應用說明 AM37x CUS Routing Guidelines 2010/6/3
應用說明 AM3715/03 Memory Subsystem 2010/6/3
使用指南 Flip Chip Ball Grid Array Package Reference Guide (Rev. A) 2005/5/23
應用說明 AN-1281 Bumped Die (Flip Chip) Packages (Rev. A) 2004/5/1

設計與開發

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開發板

BEACN-3P-TORPEDO — Beacon EmbeddedWorks DM3730/AM3703 Torpedo™ 系統模組 (SoM)

DM3730/AM3703 Torpedo 系統模組 (SoM) 是以德州儀器 DaVinci™ DM3730 與 Sitara™ AM3703 處理器為核心打造的精巧且可立即投入生產的平台。Torpedo 的尺寸僅為 15mm x 27mm,將處理器、記憶體、電源管理與基本系統功能整合至超小型的覆蓋面積中,有助於工程師降低設計複雜度並加速開發。

DM3730 型號結合了 1GHz ARM® Cortex™-A8 處理器、TMS320C64x+™ DSP 與 PowerVR SGX™ 圖形加速器,適用於多媒體、視覺與顯示密集型應用。可立即投入生產的 Linux®、Android™ 與 (...)

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軟體開發套件 (SDK)

ANDROIDEVKIT-FROYO — Android FROYO - Dev Kit for DM37x (TI_Android_DevKit/02_02_00)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

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軟體開發套件 (SDK)

ANDROIDEVKIT-GINGERBREAD — Android GINGERBREAD 2.3 - Dev Kit for DM37x (TI_Android_GingerBread_2_3_DevKit_1_0)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

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軟體開發套件 (SDK)

LINUXDVSDK-DM37X — 用於 DM3730/3725 數位媒體處理器的 Linux 數位視訊軟體開發套件 (DVSDK)

The Linux Digital Video Software Development Kit (DVSDK) for DaVinci™ processors provides everything developers need to evaluate and start developing on the DM37x Cortex™-A8 DSP+ARM® microprocessors. With the included Graphical User Interface (GUI)-based Matrix Application Launcher, launching (...)

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驅動程式或資料庫

TELECOMLIB — 電信和媒體庫 - 用於 TMS320C64x+ 和 TMS320C55x 處理器的 FAXLIB、VoLIB 和 AEC/AER

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)

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軟體程式設計工具

FLASHTOOL — FlashTool for AM35x, AM37x, DM37x and OMAP35x Devices

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模擬型號

AM/DM37x CBC BSDL Model (Rev. B)

SPRM507 (9 KB) - BSDL 模型
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模擬型號

AM/DM37x CBC IBIS Model

SPRM510.ZIP (4410 KB) - IBIS 模型
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模擬型號

AM/DM37x CBP BSDL Model

SPRM506.ZIP (9 KB) - BSDL 模型
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模擬型號

AM/DM37x CBP IBIS Model

SPRM509.ZIP (4408 KB) - IBIS 模型
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模擬型號

AM/DM37x CUS BSDL Model

SPRM508.ZIP (10 KB) - BSDL 模型
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模擬型號

AM/DM37x CUS IBIS Model

SPRM511.ZIP (4255 KB) - IBIS 模型
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參考設計

TIDA-00408 — 適用於建築自動化與醫療應用的觸覺回饋電容式觸控顯示器參考設計

採用觸覺回饋的 TIDA-00408 觸控顯示器參考設計展示了適用於恆溫器、建築自動化、工廠自動化、銷售點與汽車應用的觸覺技術。  當使用者與顯示器上的使用者介面互動時,觸控螢幕提供觸摸回饋。  此參考設計包括一個 7” 電容式觸控顯示器、一個 DRV2667 壓電式觸控驅動器和兩個壓電式致動器。

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封裝 針腳 CAD 符號、佔位空間與 3D 模型
FCCSP (CBP) 515 Ultra Librarian
FCCSP (CUS) 423 Ultra Librarian
FCCSP (CBC) 515 Ultra Librarian

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