DRV8818A
- Stepper motor driver
- Simple STEP/DIR interface
- Up to 1/8 microstepping indexer
- Programmable mixed decay, blanking, and off time
- 8V to 35V operating supply voltage range
- Smart tune, slow, fast, and mixed decay options
- High current capacity: 2.5A full-scale, 1.8A RMS
- Low RDS(ON): 310mΩ HS + LS at 24V, 25°C
- Separate logic supply voltage (VCC)
- Pin-to-pin compatible with
- Thermally-enhanced surface mount package
- Protection features
- VM Undervoltage Lockout (UVLO)
- Overcurrent Protection (OCP)
- Thermal Shutdown (TSD)
- Indexer zero position output (HOMEn)
The DRV8818A provides an integrated stepper motor driver for printers, scanners, and other automated equipment applications. The device has two H-bridge drivers and microstepping indexer logic to control a stepper motor.
The output driver block for each consists of N-channel power MOSFETs configured as full H-bridges to drive the motor windings.
A simple STEP/DIR interface allows controller circuits to be easily interfaced. The mode pins allow for configuration of the motor in full-step, half-step, quarter-step, or eighth-step modes. Decay mode and PWM off time are programmable.
Internal shutdown functions are provided for over current protection, short circuit protection, under-voltage lockout and overtemperature.
The DRV8818A is packaged in a 28-pin HTSSOP package with PowerPAD™.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | DRV8818A 35V, 2.5A Stepper Motor Driver with 1/8 Microstepping, STEP/DIR Interface and Smart Tune Technology datasheet | PDF | HTML | 2025年 7月 16日 |
設計與開發
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DRV8818EVM — DRV8818 評估模組
The DRV8818 evaluation module (EVM) demonstrates the capabilities and performance of the DRV8818 integrated micro-stepping motor driver from Texas Instruments. This EVM comes with an on-board MSP430 microprocessor which has been pre-programmed for standalone operation. The regulated voltage for the (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| HTSSOP (PWP) | 28 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。