DS90C383B
- No special start-up sequence required between clock/data and /PD pins. Input signal (clock and data) can be applied either before or after the device is powered
- Support Spread Spectrum Clocking up to 100kHz frequency modulation and deviations of ±2.5% center spread or -5% down spread
- "Input Clock Detection" feature will pull all LVDS pairs to logic low when input clock is missing and when /PD pin is logic high
- 18 to 68 MHz shift clock support
- Best-in-Class Setup and Hold Times on TxINPUTs
- Tx power consumption < 130 mW (typ) at 65MHz Grayscale
- 40% Less Power Dissipation than BiCMOS Alternatives
- Tx Power-down mode < 60μW (typ)
- Supports VGA, SVGA, XGA and Dual Pixel SXGA.
- Narrow bus reduces cable size and cost
- Up to 1.8 Gbps throughput
- Up to 227 Megabytes/sec bandwidth
- 345 mV (typ) swing LVDS devices for low EMI
- PLL requires no external components
- Compatible with TIA/EIA-644 LVDS standard
- Low profile 56-lead TSSOP package
- Improved replacement for:
- SN75LVDS83, DS90C383A
All trademarks are the property of their respective owners. TRI-STATE is a trademark of Texas Instruments. TRI-STATE is a trademark of Texas Instruments.
The DS90C383B transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughput is 227 Mbytes/sec. The DS90C383B transmitter can be programmed for Rising edge strobe or Falling edge strobe through a dedicated pin. A Rising edge or Falling edge strobe transmitter will interoperate with a Falling edge strobe Receiver (DS90CF386) without any translation logic.
This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | DS90C383B 3.3V Prog LVDS Trans 24-Bit FPD Link-65 MHz datasheet (Rev. G) | 2013年 4月 17日 | |
| Application note | High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs | 2018年 11月 9日 | ||
| Application note | How to Map RGB Signals to LVDS/OpenLDI(OLDI) Displays (Rev. A) | 2018年 6月 29日 | ||
| Application note | AN-1032 An Introduction to FPD-Link (Rev. C) | 2017年 8月 8日 | ||
| Application note | Receiver Skew Margin for Channel Link I and FPD Link I Devices | 2016年 1月 13日 | ||
| Application note | TFT Data Mapping for Dual Pixel LDI Application - Alternate A - Color Map | 2004年 5月 15日 | ||
| Application note | AN-1056 STN Application Using FPD-Link | 2004年 5月 14日 | ||
| Application note | AN-1085 FPD-Link PCB and Interconnect Design-In Guidelines | 2004年 5月 14日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前,建立完整的終端設備設計和解決方案原型,進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中,您可以搜尋 TI (...)
TINA-TI — 基於 SPICE 的類比模擬程式
TIDA-01051 — 針對自動測試設備最佳化 FPGA 利用率和數據處理能力的參考設計
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| TSSOP (DGG) | 56 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。