現在提供此產品的更新版本
功能相同,但引腳輸出與所比較的裝置不同
HD3SS3202
- Provides MUX/DEMUX Solution for USB
Type-C™ Ecosystem for USB 3.1 Gen 1 and
Gen 2 Data Rates - Compatible With MIPI DSI/CSI-2 DPHY, LVDS, PCIE Gen III, SATA Express, SATA
- Operates up to 10 Gbps
- Wide –3-dB Differential BW of over 8 GHz
- Excellent Dynamic Characteristics (at 5 GHz)
- Crosstalk = –41 dB
- Off Isolation = –20 dB
- Insertion Loss = –2.4 dB
- Return Loss = –8 dB
- Bidirectional "Mux/De-Mux" Differential Switch
- Supports Common Mode Voltage 0 to 2 V
- Single Supply Voltage VCC of 3.3 V ±10%
- Commercial Temperature Range of 0°C to 70°C (HD3SS3202)
- Industrial Temperature Range of –40°C to 85°C (HD3SS3202I)
The HD3SS3202 is a high-speed bidirectional passive switch in mux or demux configurations suited for USB Type-C™ applications that support USB 3.1 Gen 1 and Gen 2 data rates. Based on control pin SEL, the device supplies switching on differential channels between Port B or Port C to Port A.
The HD3SS3202 is a generic analog differential passive switch. It works with any high-speed interface application that requires a common mode voltage range of 0 to 2 V, and requires a differential signaling with differential amplitude at a maximum of 1800 mVpp. The device has adaptive tracking that makes sure the channel stays unchanged for the full common mode voltage range.
The device allows high-speed switching with minimum attenuation to the signal eye diagram with little added jitter. It uses < 1.65 mW (typical) of power when in operation. It has a shutdown mode that is used by the OEn pin resulting < .02 µW (typical).
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | HD3SS3202 Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux datasheet (Rev. A) | PDF | HTML | 2018年 9月 4日 |
Application note | Passive Mux Selection Based On Bandwidth (Rev. A) | PDF | HTML | 2024年 7月 31日 | |
Application note | High-Speed Layout Guidelines for Signal Conditioners and USB Hubs | 2018年 6月 14日 | ||
EVM User's guide | HD3SS3202 EVM User's Guide | 2018年 5月 25日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
UQFN (RSV) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。