MUX708-Q1
- AEC-Q100 qualified for automotive applications
- Device temperature grade 1: –40°C to 125°C ambient operating temperature
- Device HBM classification level H1C
- Device CDM classification level C3
- Latch-up immune
- Dual supply range: ±4.5V to ±22V
- Single supply range: 4.5V to 44V
- Low on-resistance: 4Ω
- Low charge injection: 3pC
- High current support: 400mA (maximum) (WQFN)
- High current support: 300mA (maximum) (TSSOP)
- –40°C to +125°C operating temperature
- 1.8V logic compatible inputs
- Integrated pull-down resistor on logic pins
- Fail-safe logic
- Rail-to-rail operation
- Bidirectional signal path
- Break-before-make switching
The MUX708-Q1 is an 8:1, 1 channel multiplexer featuring low on resistance. The device works with a single supply (4.5V to 44V), dual supplies (±4.5V to ±22V), or asymmetric supplies (such as VDD = 12V, VSS = –5V). The MUX708-Q1 support bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD.
The MUX708-Q1 has low on and off leakage currents allowing it to be used in high precision measurement applications. The MUX708-Q1 provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the MUX708-Q1 to be used in harsh environments.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | MUX708-Q1 Automotive 44V, low Ron, 8:1 multiplexer with 1.8V logic datasheet | PDF | HTML | 2026年 2月 13日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
TMUX-24PW-EVM — 適用於 16 針腳、20 針腳和 24 針腳 PW 薄型收縮小外形封裝 (TSSOP) 的 TMUX 通用評估模組
TMUX-24PW-EVM 可對 TI 的 TMUX 產品系列進行快速原型設計和 DC 特性分析,這些產品使用 16、20 或 24 針腳 TSSOP 封裝 (PW),並且額定用於高電壓操作。
TMUXRUM-RRPEVM — 適用於 16 針腳 RUM 和 RRP 四方扁平無引線 (QFN) 封裝的 TMUX 通用評估模組
TMUXRUM-RRPEVM 可對 TI 的 TMUX 產品系列進行快速原型設計和 DC 特性分析,這些產品使用 16 接腳 RUM 或 RRP 封裝 (QFN),並且額定用於高電壓操作。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點