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邏輯和電壓轉換
正反器、鎖存器和暫存器
D 型鎖存器

SN74AHCT16373

現行

具有 3 態輸出的 16 位元透明 D 型鎖存器

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產品規格表

SN74AHCT16373

現行
產品規格表 立即訂購

產品詳細資料

Number of channels 16 Technology family AHCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 110 IOL (max) (mA) 8 IOH (max) (mA) -8 Supply current (max) (µA) 40 Features Balanced outputs, Flow-through pinout, Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 125 Rating Catalog
Number of channels 16 Technology family AHCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Input type TTL-Compatible CMOS Output type 3-State Clock frequency (max) (MHz) 110 IOL (max) (mA) 8 IOH (max) (mA) -8 Supply current (max) (µA) 40 Features Balanced outputs, Flow-through pinout, Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 125 Rating Catalog
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm² 9.7 x 6.4
  • Members of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Process
  • Inputs are TTL-Voltage Compatible
  • Distributed VCC and GND Pins Minimize High-Speed
    Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883,
    Method 3015; Exceeds 200 V Using Machine Model
    (C = 200 pF, R = 0)
  • Package Options Include:
    • Plastic Shrink Small-Outline (DL) Package
    • Thin Shrink Small-Outline (DGG) Package
    • Thin Very Small-Outline (DGV) Package
    • 80-mil Fine-Pitch Ceramic Flat (WD) Package
      Using 25-mil Center-to-Center Spacings
  • Members of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Process
  • Inputs are TTL-Voltage Compatible
  • Distributed VCC and GND Pins Minimize High-Speed
    Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883,
    Method 3015; Exceeds 200 V Using Machine Model
    (C = 200 pF, R = 0)
  • Package Options Include:
    • Plastic Shrink Small-Outline (DL) Package
    • Thin Shrink Small-Outline (DGG) Package
    • Thin Very Small-Outline (DGV) Package
    • 80-mil Fine-Pitch Ceramic Flat (WD) Package
      Using 25-mil Center-to-Center Spacings

The SNxAHCT16373 devices are 16-bit transparent D-type latches with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The SNxAHCT16373 devices are 16-bit transparent D-type latches with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
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類型 標題 日期
* Data sheet SNx4AHCT16373 16-Bit Transparent D-Type Latches With 3-State Outputs datasheet (Rev. I) PDF | HTML 2014年 8月 5日

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內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

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