首頁 邏輯和電壓轉換 正反器、鎖存器和暫存器 D 型鎖存器
首頁
邏輯和電壓轉換
正反器、鎖存器和暫存器
D 型鎖存器

SN74ALVCH162260

現行

具有 3 態輸出的 12 位元至 24 位元多工 D 型鎖存器

立即訂購
產品規格表

SN74ALVCH162260

現行
產品規格表 立即訂購

產品詳細資料

Number of channels 12 Technology family ALVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Input type Standard CMOS Output type 3-State Clock frequency (max) (MHz) 150 IOL (max) (mA) 12 IOH (max) (mA) -12 Supply current (max) (µA) 40 Features Balanced outputs, Bus-hold, Damping resistors, Flow-through pinout, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 12 Technology family ALVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Input type Standard CMOS Output type 3-State Clock frequency (max) (MHz) 150 IOL (max) (mA) 12 IOH (max) (mA) -12 Supply current (max) (µA) 40 Features Balanced outputs, Bus-hold, Damping resistors, Flow-through pinout, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Operating temperature range (°C) -40 to 85 Rating Catalog
SSOP (DL) 56 190.647 mm² 18.42 x 10.35 TSSOP (DGG) 56 113.4 mm² 14 x 8.1
  • Member of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process
  • B-Port Outputs Have Equivalent 26- Series Resistors, So No External Resistors Are Required
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Package Options Include Thin-Shrink Small-Outline (DGG) and Plastic Shrink Small-Outline (DL) Packages

NOTE: For tape and reel order entry: The DGGR package is abbreviated to GR.
EPIC and Widebus are trademarks of Texas Instruments Incorporated.
  • Member of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process
  • B-Port Outputs Have Equivalent 26- Series Resistors, So No External Resistors Are Required
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Package Options Include Thin-Shrink Small-Outline (DGG) and Plastic Shrink Small-Outline (DL) Packages

NOTE: For tape and reel order entry: The DGGR package is abbreviated to GR.
EPIC and Widebus are trademarks of Texas Instruments Incorporated.

This 12-bit to 24-bit multiplexed D-type latch is designed for 1.65-V to 3.6-VCC operation.

The SN74ALVCH162260 is used in applications in which two separate data paths must be multiplexed onto, or demultiplexed from, a single data path. Typical applications include multiplexing and/or demultiplexing address and data information in microprocessor or bus-interface applications. This device also is useful in memory-interleaving applications.

Three 12-bit I/O ports (A1-A12, 1B1-1B12, and 2B1-2B12) are available for address and/or data transfer. The output-enable (OE1B\, OE2B\, and OEA\) inputs control the bus transceiver functions. The OE1B\ and OE2B\ control signals also allow bank control in the A-to-B direction.

Address and/or data information can be stored using the internal storage latches. The latch-enable (LE1B, LE2B, LEA1B, and LEA2B) inputs are used to control data storage. When the latch-enable input is high, the latch is transparent. When the latch-enable input goes low, the data present at the inputs is latched and remains latched until the latch-enable input is returned high.

The B outputs, which are designed to sink up to 12 mA, include equivalent 26- resistors to reduce overshoot and undershoot.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN74ALVCH162260 is characterized for operation from –40°C to 85°C.

This 12-bit to 24-bit multiplexed D-type latch is designed for 1.65-V to 3.6-VCC operation.

The SN74ALVCH162260 is used in applications in which two separate data paths must be multiplexed onto, or demultiplexed from, a single data path. Typical applications include multiplexing and/or demultiplexing address and data information in microprocessor or bus-interface applications. This device also is useful in memory-interleaving applications.

Three 12-bit I/O ports (A1-A12, 1B1-1B12, and 2B1-2B12) are available for address and/or data transfer. The output-enable (OE1B\, OE2B\, and OEA\) inputs control the bus transceiver functions. The OE1B\ and OE2B\ control signals also allow bank control in the A-to-B direction.

Address and/or data information can be stored using the internal storage latches. The latch-enable (LE1B, LE2B, LEA1B, and LEA2B) inputs are used to control data storage. When the latch-enable input is high, the latch is transparent. When the latch-enable input goes low, the data present at the inputs is latched and remains latched until the latch-enable input is returned high.

The B outputs, which are designed to sink up to 12 mA, include equivalent 26- resistors to reduce overshoot and undershoot.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN74ALVCH162260 is characterized for operation from –40°C to 85°C.
filter 尋找其它 D 型鎖存器
下載 觀看有字幕稿的影片 影片

您可能會感興趣的類似產品

open-in-new 比較替代產品
引腳對引腳且具備與所比較裝置相同的功能
SN74LVC841A 現行 具有 3 態輸出的 10 位元匯流排介面 D 型鎖存器 Larger voltage range (1.65V to 5.5V)
功能與所比較的裝置相似
SN74LVC573A 現行 具有 3 態輸出的八路透明 D 型鎖存器 Larger voltage range (1.65V to 5.5V)

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 20
類型 標題 日期
* Data sheet SN74ALVCH162260 datasheet (Rev. I) 2004年 8月 5日
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
Application note An Overview of Bus-Hold Circuit and the Applications (Rev. B) 2018年 9月 17日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
User guide ALVC Advanced Low-Voltage CMOS Including SSTL, HSTL, And ALB (Rev. B) 2002年 8月 1日
More literature Standard Linear & Logic for PCs, Servers & Motherboards 2002年 6月 13日
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 2002年 5月 22日
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 1999年 9月 8日
Application note TI SN74ALVC16835 Component Specification Analysis for PC100 1998年 8月 3日
Application note Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A) 1998年 5月 13日
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997年 12月 1日
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997年 8月 1日
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997年 6月 1日
Application note Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
Application note Live Insertion 1996年 10月 1日
Application note Understanding Advanced Bus-Interface Products Design Guide 1996年 5月 1日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

模擬型號

SN74ALVCH162260 IBIS Model (Rev. B)

SCEM065B.ZIP (144 KB) - IBIS Model
下載
封裝 針腳 CAD 符號、佔位空間與 3D 模型
SSOP (DL) 56 Ultra Librarian
TSSOP (DGG) 56 Ultra Librarian
適用 TI 的評估品項標準條款與條件。

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

以英文檢視所有論壇主題

內容係由 TI 和社群貢獻者依「現狀」提供，且不構成 TI 規範。檢視使用條款。

若有關於品質、封裝或訂購 TI 產品的問題，請參閱 TI 支援。​​​​​​​​​​​​​​

影片