SN74BCT574
- Operating Voltage Range of 4.5 V to 5.5 V
- State-of-the-Art BiCMOS Design Significantly Reduces ICCZ
- Full Parallel Access for Loading
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
These 8-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
The eight flip-flops of the BCT574 devices are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels that were set up at the data (D) inputs.
A buffered output-enable (OE)\ input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components.
To ensure the high-impedance state during power up or power down, (OE)\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
(OE)\ does not affect internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
您可能會感興趣的類似產品
引腳對引腳的功能與所比較的產品相同
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | SN54BCT574, SN74BCT574 datasheet (Rev. C) | 2003年 3月 11日 | |
Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022年 12月 15日 | |
Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021年 7月 26日 | ||
Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||
Application note | Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) | 1997年 8月 1日 | ||
Application note | Designing With Logic (Rev. C) | 1997年 6月 1日 | ||
Application note | Input and Output Characteristics of Digital Integrated Circuits | 1996年 10月 1日 | ||
Application note | Live Insertion | 1996年 10月 1日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
14-24-LOGIC-EVM — 適用於 14 針腳至 24 針腳 D、DB、DGV、DW、DYY、NS 和 PW 封裝的邏輯產品通用評估模組
14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。
封裝 | 引腳 | 下載 |
---|---|---|
PDIP (N) | 20 | 檢視選項 |
SOIC (DW) | 20 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點