TAS5756M

現行

30-W 立體聲道、40-W 單聲道、4.5 至 26.4-V 電源、數位輸入 D 級音訊放大器

現在提供此產品的更新版本

open-in-new 比較替代產品
功能相同,但引腳輸出與所比較的裝置不同
TAS5825M 現行 具有 192kHz 架構的 38-W 立體聲道、65-W 單聲道、4.5 至 26-V、數位輸入 D 類智慧音訊放大器 TAS5825M is our 38-W stereo, 65-W mono Class-D digital input smart audio amplifier, with improved SNR, improved quiescent current, and Smart Amp capabilities.

產品詳細資料

Audio input type Digital Input Architecture Class-D Speaker channels (max) Stereo Control interface Software Output power (W) 40 Power stage supply (max) (V) 26.4 Power stage supply (min) (V) 4.5 RDS(on) (Ω) 0.09 THD + N at 1 kHz (%) 0.006 Load (min) (Ω) 2 Analog supply voltage (min) (V) 4.5 Analog supply voltage (max) (V) 26.4 Rating Catalog Operating temperature range (°C) -25 to 85
Audio input type Digital Input Architecture Class-D Speaker channels (max) Stereo Control interface Software Output power (W) 40 Power stage supply (max) (V) 26.4 Power stage supply (min) (V) 4.5 RDS(on) (Ω) 0.09 THD + N at 1 kHz (%) 0.006 Load (min) (Ω) 2 Analog supply voltage (min) (V) 4.5 Analog supply voltage (max) (V) 26.4 Rating Catalog Operating temperature range (°C) -25 to 85
HTSSOP (DCA) 48 101.25 mm² 12.5 x 8.1
  • Flexible Audio I/O Configuration
    • Supports I2S, TDM, LJ, RJ Digital Input
    • 8 kHz to 192 kHz Sample Rate Support
    • Stereo Bridge Tied Load (BTL) or Mono Parallel Bridge Tied Load (PBTL) Operation
    • BD Amplifier Modulation
    • Supports 3-Wire Digital Audio Interface (No MCLK required)
  • High-Performance Closed-Loop Architecture (PVDD = 12V, RSPK = 8 Ω, SPK_GAIN = 20 dBV)
    • Idle Channel Noise = 56 µVrms (A-Wtd)
    • THD+N = 0.006 % (at 1 W, 1 kHz)
    • SNR = 104 A-Wtd (Ref. to THD+N = 1%)
  • PurePath HybridFlow Processing Architecture
    • Several Configurable MiniDSP Programs (called HybridFlows)
    • Download Time <100 ms (typ)
    • Advanced Audio Processing Algorithms
  • Communication Features
    • Software Mode Control via I2C Port
    • Two Address Select Pins – Up to 4 Devices
  • Robustness and Reliability Features
    • Clock Error, DC, and Short-Circuit Protection
    • Over Temperature and Overcurrent Protection
  • Flexible Audio I/O Configuration
    • Supports I2S, TDM, LJ, RJ Digital Input
    • 8 kHz to 192 kHz Sample Rate Support
    • Stereo Bridge Tied Load (BTL) or Mono Parallel Bridge Tied Load (PBTL) Operation
    • BD Amplifier Modulation
    • Supports 3-Wire Digital Audio Interface (No MCLK required)
  • High-Performance Closed-Loop Architecture (PVDD = 12V, RSPK = 8 Ω, SPK_GAIN = 20 dBV)
    • Idle Channel Noise = 56 µVrms (A-Wtd)
    • THD+N = 0.006 % (at 1 W, 1 kHz)
    • SNR = 104 A-Wtd (Ref. to THD+N = 1%)
  • PurePath HybridFlow Processing Architecture
    • Several Configurable MiniDSP Programs (called HybridFlows)
    • Download Time <100 ms (typ)
    • Advanced Audio Processing Algorithms
  • Communication Features
    • Software Mode Control via I2C Port
    • Two Address Select Pins – Up to 4 Devices
  • Robustness and Reliability Features
    • Clock Error, DC, and Short-Circuit Protection
    • Over Temperature and Overcurrent Protection

The TAS5756M device is a high-performance, stereo closed-loopamplifier with integrated audio processor with architecture. To convertfrom digital to analog, the device uses a high performance DAC withBurr-Brown mixed signal heritage.It requires only two power supplies; one DVDD for low-voltage circuitry and one PVDD forhigh-voltage circuitry. It is controlled by a software control port using standardI2C communication. In the family, theTAS5756M uses traditional BD modulation, ensuring low distortion characteristics. The TAS5754M uses1SPW modulation to reduce output ripple current, the expense of slightly higher distortion.

The unique HybridFlow architecture allows the system designer tochoose from several configurable DSP programs that are specifically designed for use in popularaudio end equipment such as bluetooth (BT) speakers, sound bars, docking stations, and subwoofers.This architecture combines the flexibility of a fully programmable device with the fast downloadtime and ease of use of a fixed-function ROM device.

An optimal mix of thermal performance and device cost is provided in the90 mΩ rDS(on) of the output MOSFETs. Additionally, athermally enhanced 48-Pin HTSSOP provides excellent operation in the elevated ambienttemperatures found in modern consumer electronic devices.

For all available packages, see the orderable addendum at the end of the datasheet. Please refer to SLAU577 for information regarding Audio Processing options available via the HybridFlow library.Tested on TAS5756MDCAEVM.

The TAS5756M device is a high-performance, stereo closed-loopamplifier with integrated audio processor with architecture. To convertfrom digital to analog, the device uses a high performance DAC withBurr-Brown mixed signal heritage.It requires only two power supplies; one DVDD for low-voltage circuitry and one PVDD forhigh-voltage circuitry. It is controlled by a software control port using standardI2C communication. In the family, theTAS5756M uses traditional BD modulation, ensuring low distortion characteristics. The TAS5754M uses1SPW modulation to reduce output ripple current, the expense of slightly higher distortion.

The unique HybridFlow architecture allows the system designer tochoose from several configurable DSP programs that are specifically designed for use in popularaudio end equipment such as bluetooth (BT) speakers, sound bars, docking stations, and subwoofers.This architecture combines the flexibility of a fully programmable device with the fast downloadtime and ease of use of a fixed-function ROM device.

An optimal mix of thermal performance and device cost is provided in the90 mΩ rDS(on) of the output MOSFETs. Additionally, athermally enhanced 48-Pin HTSSOP provides excellent operation in the elevated ambienttemperatures found in modern consumer electronic devices.

For all available packages, see the orderable addendum at the end of the datasheet. Please refer to SLAU577 for information regarding Audio Processing options available via the HybridFlow library.Tested on TAS5756MDCAEVM.

下載 觀看有字幕稿的影片 影片

索取更多資訊

提供 PurePath™ Console 2、TAS5756M GUI 和其他設計資源。立即索取

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 5
重要文件 類型 標題 格式選項 日期
* Data sheet TAS5756M Digital Input, Closed-Loop Class-D Amplifier With Processing datasheet (Rev. B) PDF | HTML 2015年 8月 6日
Application note Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) 2019年 8月 26日
Application note AN-1849 An Audio Amplifier Power Supply Design (Rev. C) 2019年 6月 27日
User guide Using the TAS5754/6M and PCM5242 HybridFlow Processor (Rev. A) 2015年 6月 19日
Application note AN-1737 Managing EMI in Class D Audio Applications (Rev. A) 2013年 5月 1日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

TAS5756MDCAEVM — TAS5756M 30W 數位 I2S 輸入、閉合迴路音訊 D 類放大器評估模組

The TAS5756MDCAEVM allows evaluation of the TAS5756M digital I2S input, closed-loop amplifier with onboard audio processor that incorporates TI’s unique HybridFlow architecture. It is populated with two TAS5756MDCA devices, one configured for two channel (stereo) operation and one configured (...)

使用指南: PDF
TI.com 無法提供
應用軟體及架構

PUREPATHCONSOLE PurePath™ Console graphical development suite for audio system design and development

PurePath™ Console is a highly integrated and easy-to-use audio development suite designed specifically to simplify the evaluation, configuration and debug process associated with the development of audio products. Watch how easy it is to use the PurePath™ Console 3 software.

PurePath Console’s (...)
支援產品和硬體

支援產品和硬體

模擬型號

TAS57XXM IBIS Model

SLAM221.ZIP (105 KB) - IBIS Model
模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI 是有助於評估類比電路功能的設計和模擬環境。這款全功能設計和模擬套件使用 Cadence® 的類比分析引擎。PSpice for TI 包括業界最大的模型庫之一,涵蓋我們的類比和電源產品組合,以及特定類比行為模型,且使用無需支付費用。

PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前,建立完整的終端設備設計和解決方案原型,進而縮短上市時間並降低開發成本。 

在 PSpice for TI 設計與模擬工具中,您可以搜尋 TI (...)
封裝 針腳 CAD 符號、佔位空間與 3D 模型
HTSSOP (DCA) 48 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片