產品詳細資料

Coprocessors 2 Arm Cortex-M4 Protocols Ethernet Hardware accelerators 1 Embedded Vision Engine (EVE) Features Vision Analytics Operating system Android, Linux, RTOS Security Device attestation & anti-counterfeit, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage, Software IP protection TI functional safety category Functional Safety-Compliant Rating Automotive Power supply solution LP87322E-Q1, LP87322F-Q1, LP87332A-Q1, TPS65917-Q1, TPS65919-Q1 Operating temperature range (°C) -40 to 125 Edge AI enabled No
Coprocessors 2 Arm Cortex-M4 Protocols Ethernet Hardware accelerators 1 Embedded Vision Engine (EVE) Features Vision Analytics Operating system Android, Linux, RTOS Security Device attestation & anti-counterfeit, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage, Software IP protection TI functional safety category Functional Safety-Compliant Rating Automotive Power supply solution LP87322E-Q1, LP87322F-Q1, LP87332A-Q1, TPS65917-Q1, TPS65919-Q1 Operating temperature range (°C) -40 to 125 Edge AI enabled No
FCBGA (ABF) 367 225 mm² (15 mm × 15 mm)
  • Architecture designed for ADAS applications
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Supports LPDDR2 up to DDR-667
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 Image Processor Unit (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Seven Dual Clock Comparators (DCC)
  • Memory Cyclic Redundancy Check (CRC)
  • TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memory
  • Error Signaling Module (ESM)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • PWMSS
  • Full HW image pipe: DPC, CFA, 3D-NF, RGB-YUV
    • WDR, HW LDC and perspective
  • Architecture designed for ADAS applications
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Supports LPDDR2 up to DDR-667
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 Image Processor Unit (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Seven Dual Clock Comparators (DCC)
  • Memory Cyclic Redundancy Check (CRC)
  • TESOC (LBIST/PBIST) that enables field testing of logic and on-chip memory
  • Error Signaling Module (ESM)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • MIPI® Camera Serial Interface 2 (CSI-2)
  • PWMSS
  • Full HW image pipe: DPC, CFA, 3D-NF, RGB-YUV
    • WDR, HW LDC and perspective

TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.

The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.

The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.

Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA3x ADAS processor is qualified according to AEC-Q100 standard.

TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). The TDA3x family enables broad ADAS applications in automobiles by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience.

The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture.

The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of Texas Instruments (TI)’s fixed and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac (EVE), and dual-Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB.

The Vision AccelerationPac for this family of products includes embedded vision engine (EVE) offloading the vision analytics functionality from the application processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing.

Additionally, TI provides a complete set of development tools for the Arm, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution.

The TDA3x ADAS processor is qualified according to AEC-Q100 standard.

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此產品系列適用於大量汽車製造商。如需詳細資訊,請與 TI 銷售代表聯繫。

技術文件

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 TDA3x SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0 datasheet (Rev. H) PDF | HTML 2020/2/4
* 使用指南 TDA3x Technical Reference Manual (Rev. D) 2019/7/29
* 勘誤表 TDA3x SoC for Advanced Driver Assistance Systems (ADAS) (SR 1.0, 1.0A) (Rev. F) 2019/10/1
使用指南 Single LP8733-Q1 User's Guide to Power DRA78x and TDA3 (Rev. A) PDF | HTML 2021/3/31
白皮書 Stereo vision- facing the challenges and seeing the opportunities for ADAS (Rev. A) 2020/7/24
應用說明 AM57x, DRA7x, and TDA2x EMIF Tools (Rev. E) 2020/1/6
應用說明 TDA2x/TDA2E Performance (Rev. A) PDF | HTML 2019/6/10
應用說明 TDA3xx Tester On Chip (TESOC) (Rev. A) 2018/10/19
應用說明 ECC/EDC on TDAxx (Rev. B) 2018/6/13
應用說明 TMS320C66x XMC Memory Protection 2018/1/31
應用說明 DSS Bit Exact Output (Rev. A) 2018/1/12
應用說明 Flashing Utility - mflash 2018/1/9
白皮書 Embedded low-power deep learning with TIDL 2017/12/8
應用說明 Dynamic Backup Lines PDF | HTML 2017/11/14
應用說明 Optimizing DRA7xx and TDA2xx Processors for use with Video Display SERDES (Rev. B) 2017/11/7
應用說明 A Guide to Debugging With CCS on the DRA75x, DRA74x, TDA2x and TDA3x Family of D (Rev. B) 2017/11/3
應用說明 DSS BT656 Workaround for TDA2x (Rev. A) 2017/11/3
功能安全資訊 Safety Features on VisionSDK 2017/10/26
應用說明 IISS Image Pipe for Alternate CFA Formats 2017/8/16
功能安全資訊 Safety Manual for TDA3x Automotive Vision Safety Critical Applications Processor 2017/7/18
應用說明 Quality of Service (QoS) Knobs for DRA74x, DRA75x & TDA2x Family of Devices (Rev. A) 2016/12/15
應用說明 Quad Channel Camera Application for Surround View and CMS Camera Systems (Rev. A) 2016/8/23
應用說明 ADC as Voltage Monitoring in TDA3x 2016/6/20
應用說明 TDA3xx ISS Tuning and Debug Infrastructure 2016/6/2
應用說明 ADAS Power Management 2016/3/7
白皮書 Multicore SoCs stay a step ahead of SoC FPGAs 2016/2/23
應用說明 TDA3x Error Signaling Module (ESM) 2016/1/26
白皮書 Surround view camera systems for ADAS (Rev. A) 2015/10/20
應用說明 Guide to fix Perf Issues Using QoS Knobs for DRA74x, DRA75x, TDA2x & TD3x Device 2014/8/13
白皮書 TI Vision SDK, Optimized Vision Libraries for ADAS Systems 2014/4/14
白皮書 TI Gives Sight to Vision-Enabled Automotive Technologies 2013/10/16
白皮書 Empowering Automotive Vision with TI’s Vision AccelerationPac 2013/10/13

設計與開發

電源供應解決方案

為 TDA3MA 尋找可用的電源供應解決方案。TI 提供適用於 TI 與非 TI 之系統單晶片 (SoC)、處理器、微控制器、感測器或現場可編程邏輯閘陣列 (FPGA) 的電源供應解決方案。

開發板

D3-3P-RVP-TDA3X — 適用於 TDA3 處理器的 D3 Embedded RVP-TDA3x 開發套件

RVP-TDA3x 是適用於低成本先進駕駛輔助系統 (ADAS) 的多攝影機平台。其包括視覺加速 Pac (EVE),並且具備板載 ISP (影像訊號處理器)。其不包含 ARM 核心或編解碼器。開發套件支援四個攝影機輸入,但可以視需求自訂。套件購買包括軟體分發和一次性授權。應用包括前置或後置攝影機、2D/3D 環景、雷達、駕駛監控、攝影機監控系統 (CMS)/後視鏡取代方案。

從:D3 Embedded
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開發套件

D3-3P-TDA3X-SK — 適用於 TDA3 處理器的 D3 Embedded DesignCore® TDA3x 汽車入門套件

桌上型入門套件可讓您在以生產為設計考量的電子平台上,評估嵌入式 ADAS 技術。其以德州儀器 TDA3x 先進視覺處理器為基礎,可同步擷取四個 FPD-Link III HD 資料串流 (視訊、雷達、光達等),以進行即時視覺處理與分析。購買套件時會包含 TI 視覺 SDK 與 D3 Embedded 進階視覺軟體架構的軟體分發及單一使用授權。

從:D3 Embedded
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偵錯探測器

LB-3P-TRACE32-DSP — 適用於數位訊號處理器 (DSP) 的 Lauterbach TRACE32 偵錯和追蹤系統

Lauterbach‘s TRACE32® tools are a suite of leading-edge hardware and software components that enables developers to analyze, optimize and certify all kinds of single- or multi-core Digital Signal processors (DSPs) which are a popular choice for audio and video processing as well as radar data (...)

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軟體開發套件 (SDK)

PROCESSOR-SDK-RADAR — RTOS Processor SDK for Radar

處理器 SDK-Vision (Vision SDK) 和處理器 SDK-Radar (Radar SDK) 是適用於 TDAx 處理器的多處理器軟體開發套件。軟體架構可讓使用者建立不同的 ADAS 應用資料流程,其中包含雷達擷取、雷達處理、視訊擷取、視訊預處理、視訊分析演算法和視訊顯示。.此版本還整合了處理器 SDK Linux,以啟用需要 Linux 和 GPU 的汽車 ADAS 功能和示範。SDK 具備適用 EVE 和 DSP 的基礎驅動器、運算與視覺核心。此外還具有使用 TI 範例演算法的示範使用案例,演練 ADAS SoC 中的不同 CPU (...)

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軟體開發套件 (SDK)

PROCESSOR-SDK-VISION — Linux and RTOS Processor SDK for Vision

處理器 SDK-Vision (Vision SDK) 和處理器 SDK-Radar (Radar SDK) 是適用於 TDAx 處理器的多處理器軟體開發套件。軟體架構可讓使用者建立不同的 ADAS 應用資料流程,其中包含雷達擷取、雷達處理、視訊擷取、視訊預處理、視訊分析演算法和視訊顯示。.此版本還整合了處理器 SDK Linux,以啟用需要 Linux 和 GPU 的汽車 ADAS 功能和示範。SDK 具備適用 EVE 和 DSP 的基礎驅動器、運算與視覺核心。此外還具有使用 TI 範例演算法的示範使用案例,演練 ADAS SoC 中的不同 CPU (...)

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IDE、配置、編譯器或偵錯程式

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

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IDE、配置、編譯器或偵錯程式

SYSCONFIG — Standalone desktop version of SysConfig

CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.

SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

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作業系統 (OS)

QNX-3P-NEUTRINO-RTOS — QNX Neutrino RTOS

QNX Neutrino® 即時作業系統 (RTOS) 是一款功能完整且穩固的 RTOS,專為實現適用於汽車、醫療、運輸、軍事和工業嵌入式系統的新一代產品而設計。微核心設計與模組化架構,能讓客戶以低整體擁有成本打造高度最佳化且可靠的系統。
從:QNX
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支援軟體

VCTR-3P-MICROSAR — 適用於微控制器和高性能電腦 (HPC) 的 Vector MICROSAR AUTOSAR 軟體

MICROSAR 與 DaVinci 產品系列透過適用於微控制器與 HPC 的精密嵌入式軟體和強大開發工具,簡化 ECU 開發。有了先進的基礎架構軟體,您即可為 ECU 建立最佳基礎,並利用相關工具簡化所有相關開發作業。MICROSAR 嵌入式軟體是根據 AUTOSAR 經典和適應性等相關標準所開發。軟體也適合符合最高 ASIL D 之 ISO 26262 標準的安全相關應用。此外,智慧網路安全功能可保護控制單元免受未經授權的存取和竄改。Vector 涵蓋所有汽車與其他工業應用的使用案例。對於配備高性能電腦的軟體定義車輛 (SDV),其可提供現代車輛作業系統,以做為開放式模組化軟體生態系統。

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模擬型號

TDA3x BSDL Model

SPRM714.ZIP (9 KB) - BSDL 模型
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模擬型號

TDA3x IBIS Model

SPRM702.ZIP (10940 KB) - IBIS 模型
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模擬型號

TDA3x Thermal Model

SPRM701.ZIP (1 KB) - 熱模型
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計算工具

CLOCKTREETOOL — 適用於 Sitara、車用、視覺分析和數位訊號處理器的時脈樹工具

The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:

  • Visualize the device clock tree
  • Interact with clock tree (...)
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封裝 針腳 CAD 符號、佔位空間與 3D 模型
FCBGA (ABF) 367 Ultra Librarian

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