產品詳細資料

Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Clock frequency (max) (MHz) 40 Supply current (max) (µA) 100000 Rating Military Operating temperature range (°C) -55 to 125
Supply voltage (min) (V) 4.75 Supply voltage (max) (V) 5.25 Clock frequency (max) (MHz) 40 Supply current (max) (µA) 100000 Rating Military Operating temperature range (°C) -55 to 125
CDIP (JT) 24 221.44 mm² 32 x 6.92 LCCC (FD) 28 130.6449 mm² 11.43 x 11.43
  • High-Performance: fmax (w/o feedback)
    • TIBPAL20R’ -15C Series . . . 45 MHz
    • TIBPAL20R’ -20M Series . . . 41.6 MHz
  • High-Performance . . . 45 MHz Min
  • Reduced ICC of 180 mA Max
  • Functionally Equivalent, but Faster Than
    PAL20L8, PAL20R4, PAL20R6, PAL20R8
  • Power-Up Clear on Registered Devices (All Register Outputs are
    Set Low, but Voltage Levels at the Output Pins Go High)
  • Preload Capability on Output Registers Simplifies Testing
  • Package Options Include Both Plastic and Ceramic Chip Carriers
    in Addition to Plastic and Ceramic DIPs

IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.

  • High-Performance: fmax (w/o feedback)
    • TIBPAL20R’ -15C Series . . . 45 MHz
    • TIBPAL20R’ -20M Series . . . 41.6 MHz
  • High-Performance . . . 45 MHz Min
  • Reduced ICC of 180 mA Max
  • Functionally Equivalent, but Faster Than
    PAL20L8, PAL20R4, PAL20R6, PAL20R8
  • Power-Up Clear on Registered Devices (All Register Outputs are
    Set Low, but Voltage Levels at the Output Pins Go High)
  • Preload Capability on Output Registers Simplifies Testing
  • Package Options Include Both Plastic and Ceramic Chip Carriers
    in Addition to Plastic and Ceramic DIPs

IMPACT is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

Extra circuitry has been provided to allow loading of each register asynchronously to either a high or low state. This feature simplifies testing because the registers can be set to an initial state prior to executing the test sequence.

The TIBPAL20’ C series is characterized from 0°C to 75°C. The TIBPAL20’ M series is characterized for operation over the full military temperature range of ’55°C to 125°C.

These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board space.

Extra circuitry has been provided to allow loading of each register asynchronously to either a high or low state. This feature simplifies testing because the registers can be set to an initial state prior to executing the test sequence.

The TIBPAL20’ C series is characterized from 0°C to 75°C. The TIBPAL20’ M series is characterized for operation over the full military temperature range of ’55°C to 125°C.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 1
類型 標題 日期
* Data sheet HighPerformance Impact Programmable Array Logic Circuits datasheet (Rev. A) 2011年 1月 5日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

封裝 引腳 下載
CDIP (JT) 24 檢視選項
LCCC (FD) 28 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片