TLE2021M
- Supply current: 300µA, max
- High unity-gain bandwidth: 2MHz
- High slew rate: 0.65V/µs
- Specified for both 5V single-supply and ±15V operation
- Phase-reversal protection
- High open-loop gain: 6.5V/µV (136dB)
- Low offset voltage: 100µV, max
- Low input bias current: 50nA, max
- Low noise voltage: 19nV/√Hz
The TLE2021, TLE2022, and TLE2024 (TLE202x) devices are precision, high-speed, low-power operational amplifiers using a new Texas Instruments state-of-the art bipolar process. These devices combine the best features of the OP21, with a highly improved slew rate and unity-gain bandwidth.
The complementary bipolar process uses isolated vertical pnp transistors that yield dramatic improvement in unity-gain bandwidth and slew rate over similar devices.
The addition of a bias circuit in conjunction with this process results in extremely stable parameters with both time and temperature. Therefore, a precision device remains a precision device even with changes in temperature and over years of use.
This combination of excellent dc performance with a common-mode input voltage range that includes the negative rail makes these devices an excellent choice for low-level signal conditioning applications in either single-supply or split-supply configurations. In addition, these devices offer phase-reversal protection circuitry that eliminates an unexpected change in output states when one of the inputs is less than the negative supply rail.
A variety of available options includes small-outline and chip-carrier versions for high-density systems applications.
The C-suffix devices are characterized for operation from 0°C to 70°C. The I-suffix devices are characterized for operation from –40°C to +85°C. The M-suffix devices are characterized for operation over the full military temperature range of –55°C to +125°C.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TLE202x High-Speed, Low-Power, Bipolar Precision Operational Amplifiers datasheet | PDF | HTML | 2025年 7月 31日 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點