TMP139
- Supports JEDEC JESD302-1 DDR5 Grade B temperature sensor
- Exceeds JEDEC temperature accuracy specification:
- ±0.25°C typical
- ±0.5°C maximum (+75°C to +95°C)
- ±0.75°C maximum (–40°C to +125°C)
- Operating temperature range: –40°C to +125°C
- Low power consumption:
- 8.3-µA typical average quiescent current
- 4.0-µA typical standby current
- I/O power supply of 1 V
- Core power supply of 1.8 V
- Two wire serial bus interface (I 2C and I3C basic operation modes)
- Up to 12.5-MHz data transfer rate in I3C basic mode
- In Band Interrupt (IBI) for alerting host
- Parity error check function for host writes
- Packet error check function for host read and writes
- 11-bit resolution: 0.25°C (1 LSB)
- Standard 6-ball DSBGA (WCSP) package with 0.5-mm pitch
The TMP139 is a high-accuracy temperature sensor with an I 2C / I3C compliant digital interface supporting In Band Interrupts (IBI). Supporting the interface requirements of JEDEC JESD302-1 for Grade-B devices, the TMP139 exceeds the temperature accuracy requirements of the specification, enabling higher performance DDR5 memory modules. Available in a compact 6-ball DSBGA package, TMP139 is designed for high-speed, high-accuracy and low-power thermal monitoring applications.
The TMP139 has a typical accuracy of ±0.25°C over the entire temperature range from –40°C to +125 °C and offers an on-chip 11-bit analog-to-digital converter (ADC) providing a temperature resolution of 0.25°C.
The TMP139 is designed to operate from a core power supply of 1.8 V and I/O power supply of 1 V, with a low typical average quiescent current of 8.3 µA when performing conversions every 125 ms.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | TMP139 0.5°C Accuracy, JEDEC DDR5 Grade B, Digital Temperature Sensor With I2C and I3C Interface datasheet (Rev. C) | PDF | HTML | 2023/5/4 | ||
| Application brief | Enhance Thermal Sensing Performance With I3C Bus | PDF | HTML | 2021/12/22 | |||
| 應用說明 | TMP139 Breakout Board Overview | PDF | HTML | 2020/12/23 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| DSBGA (YAH) | 6 | Ultra Librarian |