TMP144
- Multiple Device Access (MDA):
- Global read/write operations
- SMAART Wire™ / UART interface
- Resolution: 12-bit or 0.0625°C
- ±1°C maximum (–10°C to +100°C)
- ±2°C maximum (–40°C to +125°C)
- Low quiescent current:
- 3-µA active I Q at 0.25 Hz
- 0.6-µA shutdown
- Supply range: 1.4 V to 3.6 V
- Push-pull digital output
- Package:
- 0.76 mm × 0.96 mm, 150-µm maximum height, 4-ball YMT (DSBGA)
- 0.76 mm × 0.96 mm, 310-µm maximum height, 4-ball YBK (DSBGA)
- 0.76 mm × 0.96 mm, 625-µm maximum height, 4-ball YFF (DSBGA)
The TMP144 digital output temperature sensor can read temperatures to a resolution of 0.0625°C.
The device has a SMAART Wire™ / UART interface that supports daisy-chain configurations. The interface also supports Multiple Device Access (MDA) commands that let the host communicate with multiple devices on the bus simultaneously. MDA commands are used as an alternative to sending individual commands to each device on the bus. Up to 16 TMP144 devices can be attached together serially and can be read by the host computer.
The TMP144 device is designed for space-constrained, power-sensitive applications with multiple temperature measurement zones that must be monitored. The device is specified for operation over a temperature range of –40°C to 125°C and is available in three different 4-ball, low-height wafer chip-scale package (DSBGA) options. The YMT package of the device has a height of 150 µm, which is 40% thinner than a 0201 resistor. The thinner YMT package can be placed under heat-dissipating components on the system for better accuracy and faster thermal response times.
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技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TMP144 Low-Power, Digital Temperature Sensor With SMAART Wire™ / UART Interface datasheet (Rev. C) | PDF | HTML | 2023年 3月 15日 |
| Application note | How to Read and Interpret Digital Temperature Sensor Output Data (Rev. A) | PDF | HTML | 2025年 1月 21日 | |
| Application note | Under-Component Monitoring With Ultra-Small Temperature Sensors (Rev. A) | PDF | HTML | 2023年 4月 21日 | |
| Application brief | Efficient Cold Chain Management With Scalable High-Accuracy Temperature Sensors (Rev. A) | PDF | HTML | 2020年 12月 11日 | |
| Application note | How to Boost Your CPU, GPU, and SoC Performance Through Thermal Accuracy | PDF | HTML | 2020年 9月 22日 |
設計與開發
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| DSBGA (YBK) | 4 | Ultra Librarian |
| DSBGA (YFF) | 4 | Ultra Librarian |
| PICOSTAR (YMT) | 4 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點