TMUXHS5212
- Provides 2 differential-channels of bidirectional 2:1 mux or 1:2 demux
- Suitable for interfaces with datarates up to
32Gbps NRZ
- Supports PCIe 5.0 (32 GT/s), USB 4.0, CXL 3.1, TBT 4, SATA 3, SAS-4, DSI/CSI, and Ethernet applications
- −3dB differential BW of 18.5GHz typ
- Dynamic characteristics at 16GHz typ:
- Insertion loss = −2.75dB
- Return loss = −17dB
- Crosstalk = −30dB
- Minimal skew:
- Bit-to-Bit = 3ps typ
- Channel-to-Channel = 10ps typ
- Supports common mode voltages from 0 to 1.2V
- Single supply voltage VCC of 1.8V
- Adaptive common mode voltage tracking
- Low active (60µA typ) and standby current consumption (1µA typ)
- Temperature range of −40° to 105°C
- Available in 2.5mm × 2.5mm QFN package with 0.35mm pitch
The TMUXHS5212 is a 2-channel bidirectional passive switch with 2:1 mux or 1:2 demux configurations. It supports differential signaling up to 32GBbps NRZ, thus enabling it for many applications including PCI Express 5.0, USB 4, 50G Ethernet, CXL 3.1 and Thunderbolt™ 4. The device operates off of a 1.8V supply with ultra low active and standby power, and its control pins are compatible with 1.8V digital inputs.
The dynamic characteristics of the TMUXHS5212 allow for high-speed switching with minimal attenuation and negligible added jitter to the eye diagram for both NRZ and PAM applications. It is designed for best intra-pair skew performance, low crosstalk, and reliable signal integrity.
The TMUXHS5212 is rated for a temperature range of -40°C to 105°C that can suit commercial, industrial and personal electronics applications.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | TMUXHS5212 32Gbps Two-Channel Differential 2:1 Mux or 1:2 Demux datasheet | PDF | HTML | 2026/7/31 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
TMUXHS5212-EVM — TMUXHS5212 evaluation module
The TMUXHS5212-EVM is used to evaluate the high- speed signaling performance of the TMUXHS5212. The evaluation module (EVM) comes with a soldered unit. The EVM allows for engineers to evaluate the signal performance passing through the multiplexer compared to just a trace. The I/Os are tied through (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| — (—) | — |
訂購與品質
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。