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通用型音訊放大器

TPA3001D1

不推薦在新設計中採用

20-W 單聲道、8 至 18-V 電源供電、類比輸入 D 類音訊放大器

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產品規格表
TPA3001D1 不建議用於新設計
此產品將繼續向現有客戶提供。新設計應考量替代產品。
open-in-new 比較替代產品
功能相同，但引腳輸出與所比較的裝置不同
TPA3112D1 現行 無濾波器且具 SpeakerGuard™ 的 25-W 立體聲道、8 至 26-V 電源、類比輸入 D 類音訊放大器 Refreshed version of TPA3112

TPA3001D1

不推薦在新設計中採用
產品規格表 立即訂購

產品詳細資料

Audio input type Analog Input Speaker channels (max) Mono Control interface Hardware Power stage supply (max) (V) 18 Power stage supply (min) (V) 8 THD + N at 1 kHz (%) 0.2 Load (min) (Ω) 4 Analog supply voltage (min) (V) 8 Analog supply voltage (max) (V) 18 Rating Catalog Operating temperature range (°C) -40 to 85
Audio input type Analog Input Speaker channels (max) Mono Control interface Hardware Power stage supply (max) (V) 18 Power stage supply (min) (V) 8 THD + N at 1 kHz (%) 0.2 Load (min) (Ω) 4 Analog supply voltage (min) (V) 8 Analog supply voltage (max) (V) 18 Rating Catalog Operating temperature range (°C) -40 to 85
HTSSOP (PWP) 24 49.92 mm² 7.8 x 6.4
  • 20 W Into 8- Load From 18-V Supply (10% THD+N)
  • Short-Circuit Protection (Short to VCC, Short to GND,
    Short Between Outputs)
  • Third-Generation Modulation Technique:
    • Replaces Large LC Filter With Small, Low-Cost Ferrite
      Bead Filter in Most Applications
    • Improved Efficiency
    • Improved SNR
  • Low Supply Current: 8 mA Typ at 12 V
  • Shutdown Control: < 1 µA Typ
  • Space-Saving, Thermally-Enhanced PowerPAD™ Packaging
  • APPLICATIONS
    • LCD Monitors/TVs
    • Hands-Free Car Kits
    • Powered Speakers

PowerPAD Is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners
  • 20 W Into 8- Load From 18-V Supply (10% THD+N)
  • Short-Circuit Protection (Short to VCC, Short to GND,
    Short Between Outputs)
  • Third-Generation Modulation Technique:
    • Replaces Large LC Filter With Small, Low-Cost Ferrite
      Bead Filter in Most Applications
    • Improved Efficiency
    • Improved SNR
  • Low Supply Current: 8 mA Typ at 12 V
  • Shutdown Control: < 1 µA Typ
  • Space-Saving, Thermally-Enhanced PowerPAD™ Packaging
  • APPLICATIONS
    • LCD Monitors/TVs
    • Hands-Free Car Kits
    • Powered Speakers

PowerPAD Is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners

The TPA3001D1 (sometimes referred to as TPA3001) is a 20-W monaural bridge-tied load (BTL) class-D audio power amplifier (class-D amp) with high efficiency, eliminating the need for heat sinks. The TPA3001D1 can drive 4- or 8- speakers with only a ferrite bead filter required to reduce EMI.

The gain of the amplifier is controlled by two input terminals, GAIN1 and GAIN0. This allows the amplifier to be configured for a gain of 12, 18, 23.6, or 36 dB. The differential input stage provides high common-mode rejection and improved power-supply rejection.

The amplifier also includes depop circuitry to reduce the amount of pop at power-up and when cycling SHUTDOWN.

The TPA3001D1 (TPA3001) is available in the 24-pin thermally enhanced TSSOP package (PWP), which eliminates the need for an external heat sink.

The TPA3001D1 (sometimes referred to as TPA3001) is a 20-W monaural bridge-tied load (BTL) class-D audio power amplifier (class-D amp) with high efficiency, eliminating the need for heat sinks. The TPA3001D1 can drive 4- or 8- speakers with only a ferrite bead filter required to reduce EMI.

The gain of the amplifier is controlled by two input terminals, GAIN1 and GAIN0. This allows the amplifier to be configured for a gain of 12, 18, 23.6, or 36 dB. The differential input stage provides high common-mode rejection and improved power-supply rejection.

The amplifier also includes depop circuitry to reduce the amount of pop at power-up and when cycling SHUTDOWN.

The TPA3001D1 (TPA3001) is available in the 24-pin thermally enhanced TSSOP package (PWP), which eliminates the need for an external heat sink.
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* Data sheet 20W Mono Class-D Audio Power Amplifier datasheet (Rev. E) 2010年 8月 23日

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點