TPA311
- Fully Specified for 3.3-V and 5-V Operation
- Wide Power Supply Compatibility 2.5 V - 5.5 V
- Output Power for RL = 8
- 350 mW at VDD = 5 V, BTL
- 250 mW at VDD = 5 V, SE
- 250 mW at VDD = 3.3 V, BTL
- 75 mW at VDD = 3.3 V, SE
- Shutdown Control
- IDD = 7 µA at 3.3 V
- IDD = 60 µA at 5 V
- BTL to SE Mode Control
- Integrated Depop Circuitry
- Thermal and Short-Circuit Protection
- Surface Mount Packaging
- SOIC
- PowerPADTM MSOP
PowerPAD is a trademark of Texas Instruments Incorporated.
The TPA311 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA311 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA311 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 350-mW Low-Voltage Audio Power Amplifier datasheet (Rev. C) | 2003年 5月 2日 | |
Application note | PowerPAD™ Thermally Enhanced Package (Rev. H) | 2018年 7月 6日 | ||
EVM User's guide | TPA311EVM - User Guide (Rev. A) | 2001年 4月 17日 | ||
User guide | TPA311MSOPEVM - User Guide (Rev. A) | 2001年 4月 17日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 引腳 | 下載 |
---|---|---|
HVSSOP (DGN) | 8 | 檢視選項 |
SOIC (D) | 8 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。