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通用型音訊放大器

TPA311

現行

具有橋接負載到單端切換模式的 350-mW 單聲道 AB 類音訊放大器

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產品規格表

TPA311

現行
產品規格表 立即訂購

產品詳細資料

Speaker channels (max) Mono Control interface Hardware Output power (W) 0.35 THD + N at 1 kHz (%) 1 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.7 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) to
Speaker channels (max) Mono Control interface Hardware Output power (W) 0.35 THD + N at 1 kHz (%) 1 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.7 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) to
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9 SOIC (D) 8 29.4 mm² 4.9 x 6
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 5 V, SE
    • 250 mW at VDD = 3.3 V, BTL
    • 75 mW at VDD = 3.3 V, SE
  • Shutdown Control
    • IDD = 7 µA at 3.3 V
    • IDD = 60 µA at 5 V
  • BTL to SE Mode Control
  • Integrated Depop Circuitry
  • Thermal and Short-Circuit Protection
  • Surface Mount Packaging
    • SOIC
    • PowerPADTM MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8
    • 350 mW at VDD = 5 V, BTL
    • 250 mW at VDD = 5 V, SE
    • 250 mW at VDD = 3.3 V, BTL
    • 75 mW at VDD = 3.3 V, SE
  • Shutdown Control
    • IDD = 7 µA at 3.3 V
    • IDD = 60 µA at 5 V
  • BTL to SE Mode Control
  • Integrated Depop Circuitry
  • Thermal and Short-Circuit Protection
  • Surface Mount Packaging
    • SOIC
    • PowerPADTM MSOP

PowerPAD is a trademark of Texas Instruments Incorporated.

The TPA311 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA311 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA311 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

The TPA311 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA311 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA311 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
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TPA301 現行 350-mW、單聲道、AB 類音訊放大器 Ultra-low quiescent current in shutdown mode (0.15 µA)

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* Data sheet 350-mW Low-Voltage Audio Power Amplifier datasheet (Rev. C) 2003年 5月 2日

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

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