TPA751
- Fully Specified for 3.3-V and 5-V Operation
- Wide Power Supply Compatibility 2.5 V – 5.5 V
- Power Supply Rejection at 217 Hz
- 84 dB at VDD = 5 V
- 81 dB at VDD = 3.3 V
- Output Power for RL = 8
- 700 mW at VDD = 5 V
- 250 mW at VDD = 3.3 V
- Ultralow Supply Current in Shutdown Mode . . . 1.5 nA
- Thermal and Short-Circuit Protection
- Surface-Mount Packaging
- SOIC
- PowerPAD™ MSOP
- MicroStar Junior™ (BGA)
PowerPAD and MicroStar Junior are trademarks of Texas Instruments.
The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior (BGA), 8-pin SOIC surface-mount package and a surface-mount PowerPAD MSOP.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 700-mW Mono Low-Voltage Audio Power Amplifier with Differential Inputs datasheet (Rev. C) | 2002年 10月 18日 | |
EVM User's guide | TPA751MSOPEVM - User Guide | 2003年 7月 21日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 引腳 | 下載 |
---|---|---|
HVSSOP (DGN) | 8 | 檢視選項 |
SOIC (D) | 8 | 檢視選項 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 資格摘要
- 進行中可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。