TS3USB30E
- VCC operation at 2.7V to 4.3V
- D+/D– pins tolerate up to 5.25V
- 1.8V compatible control-pin inputs
- IOFF supports partial power-down-mode operation
- RON = 10Ω maximum
- ΔRON = 0.35Ω typical
- Cio(ON) = 7.5pF typical
- Low power consumption (70nA maximum)
- –3dB bandwidth = 1400MHz typical
- Latch-up performance exceeds 100mA per JESD 78, Class II (1)
- ESD performance tested per JESD 22
- 8000V human-body model (A114-B, Class II)
- 1000V charged-device model (C101)
- ESD performance I/O port to GND (2)
- 15000V human-body model
- Packaged in 10-pin UQFN (1.8mm × 1.4mm)
(1)Except OE and S inputs
(2)High-voltage HBM is performed in addition to the standard HBM testing (A114-B, Class II) and applies to I/O ports tested with respect to GND only.
The TS3USB30E is a high-bandwidth 1:2 switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1400MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs, or from two different hosts to one corresponding output. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The TS3USB30E is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480Mbps).
The TS3USB30E integrates ESD protection cells on all pins, is available in a tiny UQFN package (1.8mm × 1.4mm) or a VSSOP package, and is characterized over the free-air temperature range of –40°C to 85°C.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TS3USB30E ESD-Protected, High-Speed USB 2.0 (480Mbps) 1:2 Multiplexer/Demultiplexer Switch With Single Enable datasheet (Rev. G) | PDF | HTML | 2024年 10月 28日 |
| Application note | Passive Mux Selection Based On Bandwidth (Rev. A) | PDF | HTML | 2024年 7月 31日 | |
| Application note | High-Speed Layout Guidelines for Signal Conditioners and USB Hubs | 2018年 6月 14日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| UQFN (RSW) | 10 | Ultra Librarian |
| VSSOP (DGS) | 10 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。