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協定專用交換器與多工器

TS5A22364

現行

具負訊號功能的 0.65-Ω、5-V、2:1 (SPDT) 雙通道類比開關

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產品規格表

TS5A22364

現行
產品規格表 立即訂購

產品詳細資料

Protocols Analog Audio Configuration 2:1 SPDT Number of channels 2 Bandwidth (MHz) 18.3 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 520 Input/output voltage (min) (V) -3.2 Input/output voltage (max) (V) 5.5 Supply current (typ) (µA) 0.2 ESD HBM (typ) (kV) 1.5 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -78 ESD CDM (kV) 1.5 Input/output continuous current (max) (mA) 350 CON (typ) (pF) 370 Off isolation (typ) (dB) -70 Ron (max) (mΩ) 1300 Ron channel match (max) (Ω) 0.3 RON flatness (typ) (Ω) 0.076 Turnoff time (disable) (max) (ns) 70 Turnon time (enable) (max) (ns) 120 VIH (min) (V) 1.4 VIL (max) (V) 0.8
Protocols Analog Audio Configuration 2:1 SPDT Number of channels 2 Bandwidth (MHz) 18.3 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 520 Input/output voltage (min) (V) -3.2 Input/output voltage (max) (V) 5.5 Supply current (typ) (µA) 0.2 ESD HBM (typ) (kV) 1.5 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -78 ESD CDM (kV) 1.5 Input/output continuous current (max) (mA) 350 CON (typ) (pF) 370 Off isolation (typ) (dB) -70 Ron (max) (mΩ) 1300 Ron channel match (max) (Ω) 0.3 RON flatness (typ) (Ω) 0.076 Turnoff time (disable) (max) (ns) 70 Turnon time (enable) (max) (ns) 120 VIH (min) (V) 1.4 VIL (max) (V) 0.8
DSBGA (YZP) 10 2.8125 mm² 2.25 x 1.25 VSON (DRC) 10 9 mm² 3 x 3 VSSOP (DGS) 10 14.7 mm² 3 x 4.9
  • Specified Break-Before-Make Switching
  • Negative Signaling Capability: Maximum Swing from –2.75 V to 2.75 V (VCC = 2.75 V)
  • Internal Shunt Switch Prevents Audible Click-and-Pop When Switching Between Two Sources
  • Low ON-State Resistance (0.65 Ω Typical)
  • Low Charge Injection
  • Excellent ON-State Resistance Matching
  • 2.3-V to 5.5-V Power Supply (VCC)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2500-V Human-Body Model
      (A114-B, Class II)
    • 1500-V Charged-Device Model (C101)
    • 200-V Machine Model (A115-A)
  • Specified Break-Before-Make Switching
  • Negative Signaling Capability: Maximum Swing from –2.75 V to 2.75 V (VCC = 2.75 V)
  • Internal Shunt Switch Prevents Audible Click-and-Pop When Switching Between Two Sources
  • Low ON-State Resistance (0.65 Ω Typical)
  • Low Charge Injection
  • Excellent ON-State Resistance Matching
  • 2.3-V to 5.5-V Power Supply (VCC)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2500-V Human-Body Model
      (A114-B, Class II)
    • 1500-V Charged-Device Model (C101)
    • 200-V Machine Model (A115-A)

The TS5A22364 is a bidirectional, 2-channel, single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V. The device features negative signal capability that allows signals below ground to pass through the switch without distortion. Additionally, the TS5A22364 includes an internal shunt switch, which automatically discharges any capacitance at the NC or NO terminals when they are unconnected to COM. This reduces the audible click/pop noise when switching between two sources. The break-before-make feature prevents signal distortion during the transferring of a signal from one path to another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications. The 3.00-mm x 3.00-mm DRC package is also available as a nonmagnetic package for medical imaging applications.

The TS5A22364 is a bidirectional, 2-channel, single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V. The device features negative signal capability that allows signals below ground to pass through the switch without distortion. Additionally, the TS5A22364 includes an internal shunt switch, which automatically discharges any capacitance at the NC or NO terminals when they are unconnected to COM. This reduces the audible click/pop noise when switching between two sources. The break-before-make feature prevents signal distortion during the transferring of a signal from one path to another. Low ON-state resistance, excellent channel-to-channel ON-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications. The 3.00-mm x 3.00-mm DRC package is also available as a nonmagnetic package for medical imaging applications.
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類型 標題 日期
* Data sheet TS5A22364 0.65-Ω Dual SPDT Analog Switches With Negative Signaling Capability datasheet (Rev. H) PDF | HTML 2017年 6月 21日
Application brief 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) PDF | HTML 2022年 7月 26日
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 2022年 6月 2日
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 2021年 12月 1日
Application note Preventing Excess Power Consumption on Analog Switches 2008年 7月 3日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

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介面轉接器

LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

使用指南: PDF
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介面轉接器

LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
使用指南: PDF
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模擬型號

TS5A22364 HSpice Model

SCDM123.ZIP (105 KB) - HSpice Model
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模擬型號

TS5A22364 IBIS Model

SCDM122.ZIP (67 KB) - IBIS Model
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封裝 引腳 下載
DSBGA (YZP) 10 檢視選項
VSON (DRC) 10 檢視選項
VSSOP (DGS) 10 檢視選項
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