1517-pin (AAW) package image

66AK2H06DAAW2 ACTIVE

High performance multicore DSP+Arm - 2x Arm A15 cores, 4x C66x DSP cores

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Quality information

Rating Catalog
RoHS Yes
REACH Yes
MSL rating / Peak reflow Level-4-245C-72HR
Quality, reliability
& packaging information

Information included:

  • RoHS
  • REACH
  • Device marking
  • Lead finish / Ball material
  • MSL rating / Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
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Additional manufacturing information

Information included:

  • Fab location
  • Assembly location
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Export classification

*For reference only

  • US ECCN: 5A991B

Packaging information

Package | Pins FCBGA (AAW) | 1517
Operating temperature range (°C) 0 to 85
Package qty | Carrier 21 | JEDEC TRAY (5+1)

Features for the 66AK2H06

  • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With
    • 1.0 GHz or 1.2 GHz C66x Fixed- and Floating-Point DSP Core
      • 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
      • 19.2 GFlops/Core for Floating Point @ 1.2 GHz
    • Memory
      • 32-KB L1P Per CorePac
      • 32-KB L1D Per CorePac
      • 1024-KB Local L2 Per CorePac
  • ARM CorePac
    • Four ARM® Cortex®-A15 MPCore™ Processors at up to 1.4 GHz
    • 4MB of L2 Cache Memory Shared by Four ARM Cores
    • Full Implementation of ARMv7-A Architecture Instruction Set
    • 32-KB L1 Instruction and Data Caches per Core
    • AMBA 4.0 AXI Coherency Extension (ACE) Master Port, Connected to MSMC for Low-Latency Access to Shared MSMC SRAM
  • Multicore Shared Memory Controller (MSMC)
    • 6MB of MSM SRAM Memory Shared by Eight DSP CorePacs and One ARM CorePac
    • Memory Protection Unit (MPU) for Both MSM SRAM and DDR3_EMIF
  • Multicore Navigator
    • 16k Multipurpose Hardware Queues With Queue Manager
    • Packet-Based DMA for Zero-Overhead Transfers
  • Network Coprocessor
    • Packet Accelerator Enables Support for
      • Transport Plane IPsec, GTP-U, SCTP, PDCP
      • L2 User Plane PDCP (RoHC, Air Ciphering)
      • 1-Gbps Wire Speed Throughput at 1.5 MPackets Per Second
    • Security Accelerator Engine Enables Support for
      • IPSec, SRTP, 3GPP, and WiMAX Air Interface, and SSL/TLS Security
      • ECB, CBC, CTR, F8, A5/3, CCM, GCM, HMAC, CMAC, GMAC, AES, DES, 3DES, Kasumi, SNOW 3G, SHA-1, SHA-2 (256-Bit Hash), MD5
      • Up to 2.4 Gbps IPSec and 2.4 Gbps Air Ciphering
    • Ethernet Subsystem
      • Five-Port Switch (Four SGMII Ports)
  • Peripherals
    • Four Lanes of SRIO 2.1
      • Supports up to 5 GBaud
      • Supports Direct I/O, Message Passing
    • Two Lanes PCIe Gen2
      • Supports up to 5 GBaud
    • Two HyperLinks
      • Supports Connections to Other KeyStone™ Architecture Devices Providing Resource Scalability
      • Supports up to 50 GBaud
    • 10-Gigabit Ethernet (10-GbE) Switch Subsystem (66AK2H14 Only)
      • Two XFI Ports
      • IEEE 1588 Support
    • Five Enhanced Direct Memory Access (EDMA) Modules
    • Two 72-Bit DDR3/DDR3L Interfaces With Speeds up to 1600 MHz
    • EMIF16 Interface
    • USB 3.0
    • Two UART Interfaces
    • Three I2C Interfaces
    • 32 GPIO Pins
    • Three SPI Interfaces
    • Semaphore Module
    • 64-Bit Timers
      • Twenty 64-Bit Timers for 66AK2H14 and 66AK2H12
      • Fourteen 64-Bit Timers for 66AK2H06
    • Five On-Chip PLLs
  • Commercial Case Temperature:
    • 0ºC to 85ºC
  • Extended Case Temperature:
    • –40ºC to 100ºC

Description for the 66AK2H06

The 66AK2Hxx platform combines the quad ARM Cortex-A15 processor with up to eight TMS320C66x high-performance DSPs using the KeyStone II architecture. The 66AK2H14/12/06 device provides up to 5.6 GHz of ARM and 9.6 GHz of DSP processing coupled with security, packet processing, and Ethernet switching at lower power than multichip solutions. The 66AK2H14/12/06 device is optimal for embedded infrastructure applications like cloud computing, media processing, high-performance computing, transcoding, security, gaming, analytics, and virtual desktop.

The C66x core combines fixed-point and floating-point computational capability in the processor without sacrificing speed, size, or power consumption. The raw computational performance is 38.4 GMACS/core and 19.2 Gflops/core (@ 1.2 GHz operating frequency). The C66x is also 100% backward compatible with software for C64x+ devices. The C66x core incorporates 90 new instructions targeted for floating point (FPi) and vector math oriented (VPi) processing.

The 66AK2H14/12/06 device has a complete set of development tools that includes: a C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.

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Carrier options

You can choose different carrier options based on the quantity of parts, including full reel, custom reel, cut tape, tube or tray.

A custom reel is a continuous length of cut tape from one reel to maintain lot- and date-code traceability, built to the exact quantity requested. Following industry standards, a brass shim connects an 18-inch leader and trailer on both sides of the cut tape for direct feeding into automated assembly machines. TI includes a reeling fee for custom reel orders.

Cut tape is a length of tape cut from a reel. TI may fulfill orders using multiple strips of cut tapes or boxes to satisfy the quantity requested.

TI often ships tube or tray devices inside a box or in the tube or tray, depending on inventory availability. We pack all tapes, tubes or sample boxes according to internal electrostatic discharge and moisture-sensitivity-level protection requirements.

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