CC26XX-CERTIFICATION

Radio certification for SimpleLink™ CC26xx

CC26XX-CERTIFICATION

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Overview

Are you looking for CC26xx module certification support? CC26xx-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
Features
  • The CC26XX-REPORTS link provides access to SimpleLink CC26xx certification reports for:
    • CC26xx module and system-in-package (SiP) modules
    • CC26xx evaluation boards (note: reports for evaluation boards are for reference only)
  • The CC26XX-REQUEST link provides
    • A TI letter of authorization for FCC and ISED when requested by customer regulatory test house
    • Used for both CC26xx modules and SiP modules
  • The CC26XX-RESOURCES link provides:
    • Support for certification for regions not currently supported by the CC26xx module and SiP modular certification
    • CC26xx module and SiP module design information for regulatory compliance when requested by the customer regulatory test house
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Downloads

Certification

CC26XX-REPORTS CC26xx Regulatory Certification Reports

Supported products & hardware

Supported products & hardware

Products
Low-power 2.4-GHz products
CC2642R SimpleLink™ 32-bit Arm Cortex-M4F Bluetooth® Low Energy wireless MCU with 352kB Flash CC2650MODA SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol 2.4 GHz wireless module with 128kB Flash CC2651R3SIPA SimpleLink™ multiprotocol 2.4-GHz wireless system-in-package module with integrated antenna CC2652PSIP SimpleLink™ multiprotocol 2.4-GHz wireless system-in-package module with integrated power amplifier CC2652R SimpleLink™ 32-bit Arm Cortex-M4F multiprotocol 2.4 GHz wireless MCU with 352kB Flash CC2652RSIP SimpleLink™ multiprotocol 2.4-GHz wireless system-in-package module with 352-KB memory
Hardware development
BOOSTXL-CC2650MA TI SimpleLink™ Bluetooth® low energy CC2650 Module BoosterPack™ Plug-in Module
Evaluation board
LP-CC2652PSIP CC2562PSIP LaunchPad™ development kit for SimpleLink™ multiprotocol 2.4-GHz wireless SIP module LP-CC2651R3SIPA CC2651R3SIPA LaunchPad™ development kit for SimpleLink™ multiprotocol 2.4-GHz wireless SIP module
Download options

CC26XX-REPORTS CC26xx Regulatory Certification Reports

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Latest version
Version: 7.20.00.00
Release date: 08 May 2023
Products
Low-power 2.4-GHz products
CC2642R SimpleLink™ 32-bit Arm Cortex-M4F Bluetooth® Low Energy wireless MCU with 352kB Flash CC2650MODA SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol 2.4 GHz wireless module with 128kB Flash CC2651R3SIPA SimpleLink™ multiprotocol 2.4-GHz wireless system-in-package module with integrated antenna CC2652PSIP SimpleLink™ multiprotocol 2.4-GHz wireless system-in-package module with integrated power amplifier CC2652R SimpleLink™ 32-bit Arm Cortex-M4F multiprotocol 2.4 GHz wireless MCU with 352kB Flash CC2652RSIP SimpleLink™ multiprotocol 2.4-GHz wireless system-in-package module with 352-KB memory
Hardware development
BOOSTXL-CC2650MA TI SimpleLink™ Bluetooth® low energy CC2650 Module BoosterPack™ Plug-in Module
Evaluation board
LP-CC2652PSIP CC2562PSIP LaunchPad™ development kit for SimpleLink™ multiprotocol 2.4-GHz wireless SIP module LP-CC2651R3SIPA CC2651R3SIPA LaunchPad™ development kit for SimpleLink™ multiprotocol 2.4-GHz wireless SIP module

Documentation

Link to FCC, ISED, CE, & Japan Certification Reports

Link to FCC, ISED, CE, & UK, Japan, Korea, and Taiwan Certification Reports

Link to FCC, ISED, CE, & UK Certification Reports

Link to FCC, ISED, CE, & UK Certification Reports

Link to CC3230x-CC26x2EM-7ID Reference-Only CE & FCC Certification Reports

Release Information

This page provides access to the CC26XX certification reports. Here you will find certification reports for both modules and EVMs. Note that module certification reports can be reused by the customer for regulatory compliance. However the customer should consult with their regulatory house to ensure they meet the requirements for certification at their product level. EVM certification reports are provided for reference only. When using a chip down version, the customer is responsible for their own certification.

What's new

  • Updated CC2651R3SIPAT0MOUR with Japan, Korea, and Tiawan reports
  • Updated CC2652RSIPMOT CE with missing safety report
Certification

CC26XX-REQUEST CC26xx certification support request (FCC and ISED)

Supported products & hardware
Certification

CC26XX-RESOURCES CC26xx support documents required for certification

Supported products & hardware

Supported products & hardware

Low-power 2.4-GHz products
CC2650MODA SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol 2.4 GHz wireless module with 128kB Flash
Evaluation board
BOOSTXL-CC2650MA TI SimpleLink™ Bluetooth® low energy CC2650 Module BoosterPack™ Plug-in Module
Debug probe
TMDSEMU110-ETH XDS110 EnergyTrace™ High Dynamic Range (ETHDR) Debug Probe Add-On TMDSEMU200-U XDS200 USB Debug Probe

Technical documentation

No results found. Please clear your search and try again.
View all 2
Type Title Date
Application note How to Certify Your Bluetooth Product (Rev. K) PDF | HTML 01 Nov 2023
Application note ETSI EN 300 328 Blocking Test for Bluetooth Low Energy PDF | HTML 08 Feb 2017

Related design resources

Software development

DRIVER OR LIBRARY
BLE-STACK Bluetooth Low Energy software stack REMOTI RF4CE Compliant Protocol Stack TIMAC IEEE802.15.4 Medium Access control (MAC) software stack Z-STACK-ARCHIVE Archive for Z-Stack Fully Compliant ZigBee 2012 Solution
IDE, CONFIGURATION, COMPILER OR DEBUGGER
CCSTUDIO Code Composer Studio™ integrated development environment (IDE) SENSOR-CONTROLLER-STUDIO Sensor Controller Studio
SOFTWARE PROGRAMMING TOOL
FLASH-PROGRAMMER SmartRF Flash Programmer

Design tools & simulation

CALCULATION TOOL
PACKET-SNIFFER SmartRF Protocol Packet Sniffer RF-RANGE-ESTIMATOR TI RF Range Estimator SMARTRFTM-STUDIO SmartRF Studio
DESIGN TOOL
3P-WIRELESS-MODULES Third party wireless module search tool

Support & training

TI E2E™ forums with technical support from TI engineers

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Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

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