CC2651R3SIPA

ACTIVE

Product details

Protocols Bluetooth low energy, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Features Bluetooth LE support, Bluetooth mesh, LE 1M PHY, LE 2M PHY, OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor GPIO 32 Peripherals 1 SPI, 1 UART, 12-bit ADC 8-channel, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S Operating temperature range (C) -40 to 105 Rating Catalog
Protocols Bluetooth low energy, Multi-standard, Proprietary 2.4 GHz, Thread, Zigbee Features Bluetooth LE support, Bluetooth mesh, LE 1M PHY, LE 2M PHY, OAD, Sleepy end device, Zigbee coordinator, Zigbee network processor GPIO 32 Peripherals 1 SPI, 1 UART, 12-bit ADC 8-channel, 2 comparators, 4 timers, 8-bit DAC, I2C, I2S Operating temperature range (C) -40 to 105 Rating Catalog

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4 processor
  • 352KB flash program memory
  • 32KB of ultra-low leakage SRAM
  • 8KB of Cache SRAM (Alternatively available as general-purpose RAM)
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Low power consumption

  • MCU consumption:
    • 3.60 mA active mode, CoreMark
    • 61 µA/MHz running CoreMark
    • 0.8 µA standby mode, RTC, 32KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Radio Consumption:
    • 6.8 mA RX
    • 7.1 mA TX at 0 dBm
    • 9.6 mA TX at +5 dBm

Wireless protocol support

High performance radio

  • -104 dBm for Bluetooth® Low Energy 125-kbps
  • Output power up to +5 dBm with temperature compensation

Regulatory compliance

  • Regulatory certification for compliance with worldwide radio frequency:
    • ETSI RED (Europe)
    • ISED (Canada)
    • FCC (USA)

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • UART, SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128-bit cryptographic accelerator
  • True random number generator (TRNG)
  • Additional cryptography drivers available in Software Development Kit (SDK)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • Tj: -40 to +105°C

Package

  • 7-mm × 7-mm MOU (32 GPIOs)
  • RoHS-compliant package

Wireless microcontroller

  • Powerful 48-MHz Arm® Cortex®-M4 processor
  • 352KB flash program memory
  • 32KB of ultra-low leakage SRAM
  • 8KB of Cache SRAM (Alternatively available as general-purpose RAM)
  • Programmable radio includes support for 2-(G)FSK, 4-(G)FSK, MSK, Bluetooth® 5.2 Low Energy, IEEE 802.15.4 PHY and MAC
  • Supports over-the-air upgrade (OTA)

Low power consumption

  • MCU consumption:
    • 3.60 mA active mode, CoreMark
    • 61 µA/MHz running CoreMark
    • 0.8 µA standby mode, RTC, 32KB RAM
    • 0.1 µA shutdown mode, wake-up on pin
  • Radio Consumption:
    • 6.8 mA RX
    • 7.1 mA TX at 0 dBm
    • 9.6 mA TX at +5 dBm

Wireless protocol support

High performance radio

  • -104 dBm for Bluetooth® Low Energy 125-kbps
  • Output power up to +5 dBm with temperature compensation

Regulatory compliance

  • Regulatory certification for compliance with worldwide radio frequency:
    • ETSI RED (Europe)
    • ISED (Canada)
    • FCC (USA)

MCU peripherals

  • Digital peripherals can be routed to any GPIO
  • Four 32-bit or eight 16-bit general-purpose timers
  • 12-bit ADC, 200 kSamples/s, 8 channels
  • 8-bit DAC
  • Two comparators
  • Programmable current source
  • UART, SSI, I2C, I2S
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor

Security enablers

  • AES 128-bit cryptographic accelerator
  • True random number generator (TRNG)
  • Additional cryptography drivers available in Software Development Kit (SDK)

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.8-V to 3.8-V single supply voltage
  • Tj: -40 to +105°C

Package

  • 7-mm × 7-mm MOU (32 GPIOs)
  • RoHS-compliant package

The SimpleLink™ CC2651R3SIPA device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, TI 15.4-Stack (2.4 GHz). The CC2651R3SIPA is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2651R3SIPA is an ultra-compact 7-mm x 7-mm certified wireless module 2.4 GHz with integrated antenna, DCDC components, Balun, and high frequency crystal oscillator.

The CC2651R3SIPA has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. The CC2651R3SIPA supports +5 dBm TX at 9.6 mA in the 2.4-GHz band. CC2651R3SIPA has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2651R3SIPA has a low sleep current of 0.9 µA with RTC and 32KB RAM retention.

TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2651R3SIPA device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCU. CC2651R3SIPA is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

The SimpleLink™ CC2651R3SIPA device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, TI 15.4-Stack (2.4 GHz). The CC2651R3SIPA is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.

The CC2651R3SIPA is an ultra-compact 7-mm x 7-mm certified wireless module 2.4 GHz with integrated antenna, DCDC components, Balun, and high frequency crystal oscillator.

The CC2651R3SIPA has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. The CC2651R3SIPA supports +5 dBm TX at 9.6 mA in the 2.4-GHz band. CC2651R3SIPA has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.

The CC2651R3SIPA has a low sleep current of 0.9 µA with RTC and 32KB RAM retention.

TI has a product life cycle policy with a commitment to product longevity and continuity of supply.

The CC2651R3SIPA device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCU. CC2651R3SIPA is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.

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Technical documentation

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Type Title Date
* Data sheet CC2651R3SIPA SimpleLink™ Multiprotocol 2.4 GHz Wireless System-in-Package Module with integrated Antenna & 352-KB Memory datasheet (Rev. A) PDF | HTML 29 Jun 2022
* Errata CC2651R3SIPA Errata (Rev. A) PDF | HTML 29 Jun 2022
Technical article An out-of-the-box Internet of Things: building a seamless and secure smart home network 12 Jun 2018
Technical article Thread vs. Zigbee – what’s the difference? 16 May 2018
Technical article Your microcontroller deserves a nap – designing “sleepy” wireless applications 28 Mar 2018
Technical article SimpleLink™ MCU SDKs: Breaking down TI Drivers 12 Apr 2017

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

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Development kit

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Software development kit (SDK)

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Ordering & quality

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  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

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