Wireless microcontroller
Low power consumption
Wireless protocol support
High performance radio
Regulatory compliance
MCU peripherals
Security enablers
Development tools and software
Operating range
Package
The SimpleLink™ CC2651R3SIPA device is a multiprotocol 2.4-GHz wireless microcontroller (MCU) supporting Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, TI 15.4-Stack (2.4 GHz). The CC2651R3SIPA is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.
The CC2651R3SIPA is an ultra-compact 7-mm x 7-mm certified wireless module 2.4 GHz with integrated antenna, DCDC components, Balun, and high frequency crystal oscillator.
The CC2651R3SIPA has a software defined radio powered by an Arm® Cortex® M0, which allows support for multiple physical layers and RF standards. The device supports operation in the 2360 to 2500-MHz frequency band. The CC2651R3SIPA supports +5 dBm TX at 9.6 mA in the 2.4-GHz band. CC2651R3SIPA has a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY.
The CC2651R3SIPA has a low sleep current of 0.9 µA with RTC and 32KB RAM retention.
TI has a product life cycle policy with a commitment to product longevity and continuity of supply.
The CC2651R3SIPA device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth® Low Energy, Thread, Zigbee, Wi-SUN®, Amazon Sidewalk, mioty, Sub-1 GHz MCUs, and host MCU. CC2651R3SIPA is part of a scalable portfolio with flash sizes from 32KB to 704KB with pin-to-pin compatible package options. The common SimpleLink™CC13xx and CC26xx Software Development Kit (SDK) and SysConfig system configuration tool supports migration between devices in the portfolio. A comprehensive number of software stacks, application examples and SimpleLink™ Academy training sessions are included in the SDK. For more information, visit wireless connectivity.
For additional terms or required resources, click any title below to view the detail page where available.
This LaunchPad™ development kit is used to speed development with the SimpleLink™ multistandard CC2651R3SIPA wireless system-in-package module with integrated antenna MCU with support for Bluetooth® 5 Low Energy (LE), and IEEE 802.15.4 based protocols including ZigBee® and Tl 15.4 applications. (...)
The Texas Instruments XDS110 is a new class of debug probe (emulator) for TI embedded processors. The XDS110 replaces the XDS100 family while supporting a wider variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a single pod. Also, all XDS debug probes support Core and System Trace in all (...)
The XDS200 is a debug probe (emulator) used for debugging TI embedded devices. The XDS200 features a balance of low cost with good performance as compared to the low cost XDS110 and the high performance XDS560v2. It supports a wide variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a (...)
The SimpleLink™ Low Power SDKs support the CC13xx, CC23xx and CC26xx family of products. Together, these SDKs provide comprehensive software packages for the development of Sub-1 GHz and 2.4 GHz applications including support for Bluetooth® Low Energy, Mesh, Zigbee®, Matter, Thread, 802.15.4-based, (...)
The current tools ARM-CGT-CLANG are derived from the open-source Clang compiler and its supporting LLVM (...)
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SysConfig is a configuration tool designed to simplify hardware and software configuration challenges to accelerate software development.
SysConfig is available as part of the Code Composer Studio™ integrated development environment as well as a standalone application. Additionally SysConfig (...)
SmartRF Flash (...)
UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)
The SimpleLink hardware design review process provides a way to get in touch, one-on-one, with a subject matter expert that can help review your design and provide valuable feedback. A simple three-step process for requesting a review as well as links to relevant technical documentation and (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| QFM (MOU) | 50 | Ultra Librarian |
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
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This release adds the Power Estimator for CC23xx devices
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Link to FCC, ISED, CE, & Japan Certification Reports
Link to FCC, ISED, CE, & UK, Japan, Korea, and Taiwan Certification Reports
Link to FCC, ISED, CE, & UK Certification Reports
Link to FCC, ISED, CE, & UK Certification Reports
Link to CC3230x-CC26x2EM-7ID Reference-Only CE & FCC Certification Reports
This page provides access to the CC26XX certification reports. Here you will find certification reports for both modules and EVMs. Note that module certification reports can be reused by the customer for regulatory compliance. However the customer should consult with their regulatory house to ensure they meet the requirements for certification at their product level. EVM certification reports are provided for reference only. When using a chip down version, the customer is responsible for their own certification.
Hardware Design Review Request Form for SimpleLink 2.4GHz Devices
The SimpleLink™ Low Power F2 Software Development Kit (SDK), formerly known as the CC13xx and CC26xx SDK, delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC13xx and CC26xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC13xx and CC26xx wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth 5.2, Zigbee 3.0 compliant protocol suite, RF-Proprietary examples, TI’s 15.4 Stack, TI Wi-SUN FAN Stack, Amazon Sidewalk examples, as well as the TI-RTOS7 and FreeRTOS™ kernels and TI Drivers in one easy-to-use software package along with example applications and documentation. In addition, the Dynamic Multi-Protocol Manager (DMM) software component enables multiprotocol development on a single SimpleLink wireless MCU.
Although not included in the SDK, SimpleLink CC13xx and CC26xx wireless MCUs are also capable of supporting the following wireless solutions: Please refer to their respective repositories for resources and more information.
The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.
This is version 8.30.01.01 of the SimpleLink Low Power F2 SDK. This version only contains internal metadata updates for integrating with the TI Developer Zone; there are no embedded software changes from the 8.30.00.121 release. This SDK is also available on GitHub at https://github.com/TexasInstruments/simplelink-lowpower-f2-sdk
The SysConfig tool is used configure TI software and hardware. For software configuration, SysConfig is used in conjunction with a TI SDK. For PinMux configuration, the tool may be used standalone.