LP-CC2651R3SIPA

This page provides access to the CC26XX certification reports. Here you will find certification reports for both modules and EVMs. Note that module certification reports can be reused by the customer for regulatory compliance. However the customer should consult with their regulatory house to ensure they meet the requirements for certification at their product level. EVM certification reports are provided for reference only. When using a chip down version, the customer is responsible for their own certification.

The SimpleLink™ Low Power F2 Software Development Kit (SDK), formerly known as the CC13xx and CC26xx SDK, delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC13xx and CC26xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC13xx and CC26xx wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth 5.2, Bluetooth Mesh, Thread 1.1.1 networking stack based on OpenThread, Zigbee 3.0 compliant protocol suite, RF-Proprietary examples, TI’s 15.4 Stack, TI Wi-SUN FAN, as well as the TI-RTOS7 kernel and TI Drivers in one easy-to-use software package along with example applications and documentation. In addition, the Dynamic Multi-Protocol Manager (DMM) software component enables multiprotocol development on a single SimpleLink wireless MCU. Although not included in the SDK, SimpleLink CC13xx and CC26xx wireless MCUs are also capable of supporting the Matter standard. Please refer to the TI Matter open source repository for resources and more information: https://github.com/TexasInstruments/matter

The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.

Features:

• Supports proprietary  Sub-1 GHz and 2.4 GHz applications using basic RX and TX examples
• TI 15.4-Stack, an IEEE 802.15.4-based star topology networking solution for the Sub-1 GHz and 2.4 GHz bands
• Certified Wi-SUN® FAN 1.0 compliant Sub-1 GHz mesh stack (learn more at TI.com/wisun or download the Wi-SUN software brief)
• Bluetooth® Low Energy (BLE) software protocol stack supporting Bluetooth 5.2 and Bluetooth mesh (learn more at TI.com/ble)
• Matter 1.0 and Thread 1.3 networking protocol based on open-source Matter project and Openthread (learn more at TI.com/matter)
• Zigbee software protocol stack (Z-stack - learn more at TI.com/Zigbee)
• Supports concurrent operation of BLE + Sub-1 GHz (TI 15.4-Stack or proprietary Sub-1 GHz) and BLE + Zigbee using the Dynamic Multi-Protocol
• Supports Amazon Sidewalk Sub-1 GHz FSK and Bluetooth Low Energy