CC2564MODAEM
具備整合式天線的雙模 Bluetooth® CC2564 模組評估板
CC2564MODAEM
概覽
CC2564MODAEM 評估板包含 Bluetooth BR/EDR/LE HCI 解決方案。bCC2564MODA 基於 TI 的 CC2564B 雙模 Bluetooth 單晶片裝置，旨在用於評估與設計目的，以減少設計工作並加快上市時間。
如需完整的評估解決方案，CC2564MODAEM 板可直接插入 TI 硬體開發套件，包含 MSP-EXP430F5529、MSP-EXP430F5438、DK-TM4C123G 與 DK-TM4C129X。此外，適用於 MSP430 與 TM4C12x MCU 的經過認證且免權利金的 TI Bluetooth 堆疊 (TIBLUETOOTHSTACK-SDK) 也已提供。
CC2564MODA 提供同級最佳的 RF 性能，其傳輸功率與接收靈敏度提供的覆蓋範圍約為其他純 BLE 解決方案的 2 倍。
特點
- 雙模（Bluetooth 與 Bluetooth 低功耗）Bluetooth 規範 v4.1
- CC2564MODA 上的整合式天線適用於隨插即用的應用程式
- 該裝置通過 FCC、IC、CE 認證，具備經過認證且免權利金的 TI Bluetooth 堆疊、快速入門指南、展示以及 UART 與 PCM/I2S 介面
- Class 1.5 傳輸功率 (+10dBm) 與高靈敏度（典型值 -93dBm）
- 直接插入 TI 硬體開發套件的 EM 連接器：
- MSP-EXP430F5529
- MSP-EXP430F5438
- DK-TM4C123G
- DK-TM4C129X
- 1 塊具 TI CC2564MODA 裝置的 CC2564MODAEM 電路板
- 1 組用於 MSP-EXP430F5438 板的跳線區塊
- 4 組用於 MSP-EXP430F5529 板的跳線
- MSP-EXP430F5529、MSP-EXP430F5438、DK-TM4C123G 與 DK-TM4C129X 板分開販售
Low-power MCUs
Wi-Fi 產品
訂購並開始開發
開發板
CC2564MODAEM — Dual-mode Bluetooth CC2564 Module with Integrated Antenna Evaluation Board
CC2564MODAEM — Dual-mode Bluetooth CC2564 Module with Integrated Antenna Evaluation Board
認證
CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports
支援產品和硬體
產品
Wi-Fi 產品
硬體開發
開發板
CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports
產品
Wi-Fi 產品
硬體開發
開發板
文件
Link to FCC, ISED, & Certification Reports
Link to FCC, ISED, & Certification Reports
Link to CC2564MODNEM Reference Only Certification Reports
Link to CC2564MODAEM Reference Only Certification Reports
Link to CC256xQFNEM Reference Only Certification Reports
Link to CC256xCQFN-EM Reference Only Certification Reports
Link to BOOST-CC2564MODA Reference Only Certification Reports
版本資訊
This page provides access to the Dual Mode BT certification reports. Here you will find certification reports for both modules and EVMs. Note that module certification reports can be reused by the customer for regulatory compliance. However the customer should consult with their regulatory house to ensure they meet the requirements for certification at their product level. EVM certification reports are provided for reference only. When using a chip down version, the customer is responsible for their own certification.
新功能
- Updated CE certification reports for CC2564 Modules
設計檔案
技術文件
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TI 所選的重要文件
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檢視所有 10
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | EVM User's guide | Dual-Mode Bluetooth CC2564 Module With Integrated Antenna Evaluation Board | 2015/7/7 | |||
| 證書 | CC2564MODAEM EC Declaration of Conformity (DoC) (Rev. D) | 2021/3/3 | ||||
| 白皮書 | Wireless Connectivity For The Internet of Things, One Size Does Not Fit All (Rev. A) | 2017/10/16 | ||||
| 技術文章 | The dual-mode Bluetooth® module you’ve been waiting for is here | PDF | HTML | 2016/2/17 | |||
| 更多文件說明 | Dual-mode Bluetooth CC256x solutions (Rev. C) | 2016/2/3 | ||||
| 使用指南 | TI Dual-mode Bluetooth Stack on STM32F4 MCUs User Guide | PDF | HTML | 2015/7/8 | |||
| 使用指南 | CC2564MODA Evaluation Board Quick Start Guide | 2015/7/1 | ||||
| 使用指南 | CC256xEM Bluetooth Adapter Kit Quick Start Guide | 2015/5/21 | ||||
| 使用指南 | CC256xEM Bluetooth Adapter Kit User Guide | 2015/5/19 | ||||
| 白皮書 | Three Flavors of Bluetooth: Which One to Choose? | 2014/3/25 |