SBOS671D September 2018 – December 2022 OPA2828 , OPA828
PRODUCTION DATA
The OPAx828 are protected from thermal overloads by an internal thermal shutdown feature. The shutdown design provides thermal protection when operated in demanding, high-temperature industrial environments. The devices accurately measure the die junction temperature at the hottest spot on the die. As the junction temperature reaches the thermal shutdown temperature, the devices are disabled by placing the output into a high-impedance state. This state prevents further power dissipation and allows the OPAx828 to begin cooling. After the junction temperature reduces by the thermal hysteresis amount, the OPAx828 resume normal operation. If the output condition that caused the OPAx828 to heat up is still present, the devices can enter thermal shutdown again. The OPAx828 quiescent current during shutdown reduces to approximately 20 µA. Identify and correct the cause of any thermal shutdown to resume normal device operation. Thermal shutdown occurs when the OPAx828 junction temperature exceeds approximately 165°C. When in thermal shutdown, the OPAx828 return to normal operation when the junction temperature cools to approximately 145°C.