SBOS671D September 2018 – December 2022 OPA2828 , OPA828
PRODUCTION DATA
THERMAL METRIC(1) | OPA828 | OPA2828 | UNIT | ||
---|---|---|---|---|---|
D (SOIC) | DGN (HVSSOP) | DGN (HVSSOP) | |||
8 PINS | 8 PINS | 8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 121.5 | 56.7 | 49.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 64.3 | 74.9 | 61.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 65 | 29.2 | 21.8 | °C/W |
ψJT | Junction-to-top characterization parameter | 18 | 3.7 | 1.7 | °C/W |
ψJB | Junction-to-board characterization parameter | 64.3 | 29.1 | 21.7 | °C/W |