SLAS666B January 2010 – October 2018 TLV320DAC3101
PRODUCTION DATA.
THERMAL METRIC(1) | TLV320DAC3101 | UNIT | ||
---|---|---|---|---|
RHB (VQFN) | ||||
32 PINS | ||||
RθJA | Junction-to-ambient thermal resistance | 32.7 | °C/W | |
RθJC(top) | Junction-to-case (top) thermal resistance | 23.2 | °C/W | |
RθJB | Junction-to-board thermal resistance | 6.6 | °C/W | |
ψJT | Junction-to-top characterization parameter | 0.3 | °C/W | |
ψJB | Junction-to-board characterization parameter | 6.5 | °C/W | |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2 | °C/W |