JAJSTE0 March 2024 LMK05318B-Q1
PRODUCTION DATA
The LMK05318B-Q1 is a high-performance device. To provide good electrical and thermal performance, TI recommends to design a thermally-enhanced interface between the IC ground/thermal pad and the PCB ground using at least a 5×5 through-hole via pattern connected to multiple PCB ground layers (see Figure 8-8).