SNOAA35D April   2023  – December 2023 LM2901 , LM2901B , LM2901B-Q1 , LM2903 , LM2903-Q1 , LM2903B , LM2903B-Q1 , LM339 , LM339-N , LM393 , LM393-N , LM393B , LM397 , TL331 , TL331-Q1 , TL331B

 

  1.   1
  2.   Application Design Guidelines for LM339, LM393, TL331 Family Comparators Including the New B-versions
  3.   Trademarks
  4. 1 Devices Covered in Application Note
    1. 1.1 Base Part Numbers
    2. 1.2 Input Voltage Offset Grades
    3. 1.3 Maximum Supply Voltage
    4. 1.4 High Reliability Options
  5. 2 The New TL331B, TL391B, LM339B, LM393B, LM2901B and LM2903B B Versions
    1. 2.1 PCN to Change Classic Die to a New Die Design
      1. 2.1.1 Determine Die Used for Single TL331 and Dual LM293, LM393, and LM2903
      2. 2.1.2 Determine Die Used for Quad LM139, LM239, LM339, and LM2901
      3. 2.1.3 Device PCN Summary
    2. 2.2 Changes to Package Top Markings
  6. 3 Input Considerations
    1. 3.1  Input Stage Schematic – The Classic LM339 Family
    2. 3.2  Input Stage Schematic - New B Devices
    3. 3.3  Differences Between the Classic and B Die Devices
    4. 3.4  Input Voltage Range
    5. 3.5  Input Voltage Range vs. Common Mode Voltage Range
    6. 3.6  Reason for Input Range Headroom Limitation
    7. 3.7  Input Voltage Range Feature
      1. 3.7.1 Both Inputs Above Input Range Behavior
    8. 3.8  Negative Input Voltages
      1. 3.8.1 Maximum Input Current
      2. 3.8.2 Phase Reversal or Inversion
      3. 3.8.3 Protecting Inputs from Negative Voltages
        1. 3.8.3.1 Simple Resistor and Diode Clamp
        2. 3.8.3.2 Voltage Divider with Clamp
          1. 3.8.3.2.1 Split Voltage Divider with Clamp
    9. 3.9  Power-Up Behavior
    10. 3.10 Capacitors and Hysteresis
    11. 3.11 Output to Input Cross-Talk
  7. 4 Output Stage Considerations
    1. 4.1 Output VOL and IOL
    2. 4.2 Pull-Up Resistor Selection
    3. 4.3 Short Circuit Sinking Current
    4. 4.4 Pulling Output Up Above VCC
    5. 4.5 Negative Voltages Applied to Output
    6. 4.6 Adding Large Filter Capacitors To Output
  8. 5 Power Supply Considerations
    1. 5.1 Supply Bypassing
      1. 5.1.1 Low VCC Guidance
      2. 5.1.2 Split Supply use
  9. 6 General Comparator Usage
    1. 6.1 Unused Comparator Connections
      1. 6.1.1 Do Not Connect Inputs Directly to Ground
      2. 6.1.2 Unused Comparator Input Connections
      3. 6.1.3 Leave Outputs Floating
      4. 6.1.4 Prototyping
  10. 7 PSPICE and TINA TI Models
  11. 8 Conclusion
  12. 9 Related Documentation
    1. 9.1 Related Links
  13. 10Revision History

2.1.3 Device PCN Summary

Device PCN Summary summarizes the differences between the pre-PCN and post-PCN behavior.

Table 2-1 Device PCN Summary

Device Family

(Including -Q1)

Chip Site Origin Packing Label Field

(20L) CSO : _ _ _

Chip Country Origin Packing Label Field

(21L) CCO : _ _ _

 Die Process Both Inputs Above Input Range Ouptut Behavior
LM139/239/339 (Pre PCN) SHE USA JI1 Low
LM139/239/339 (Post PCN) RFB USA TIB High
LM339B RFB USA TIB High
LM2901 (Pre PCN) SHE USA JI1 Low
LM2901 (Post PCN) RFB USA TIB High
LM2901B RFB USA TIB High
LM193/239/393 (Pre PCN) SHE USA JI1 Low
LM193/239/393 (Post PCN) RFB USA JI3 High
LM393B CU3 CHN JI3 High
LM2903 (Pre PCN) SHE USA JI1 Low
LM2903 (Post PCN) CU3 CHN JI3 High
LM2903B CU3 CHN JI3 High
TL331 (Pre PCN) SHE USA JI1 Low
TL331 (Post PCN) CU3 CHN JI3 High
TL331B CU3 CHN JI3 High