SNOAA35D April   2023  – December 2023 LM2901 , LM2901B , LM2901B-Q1 , LM2903 , LM2903-Q1 , LM2903B , LM2903B-Q1 , LM339 , LM339-N , LM393 , LM393-N , LM393B , LM397 , TL331 , TL331-Q1 , TL331B

 

  1.   1
  2.   Application Design Guidelines for LM339, LM393, TL331 Family Comparators Including the New B-versions
  3.   Trademarks
  4. 1 Devices Covered in Application Note
    1. 1.1 Base Part Numbers
    2. 1.2 Input Voltage Offset Grades
    3. 1.3 Maximum Supply Voltage
    4. 1.4 High Reliability Options
  5. 2 The New TL331B, TL391B, LM339B, LM393B, LM2901B and LM2903B B Versions
    1. 2.1 PCN to Change Classic Die to a New Die Design
      1. 2.1.1 Determine Die Used for Single TL331 and Dual LM293, LM393, and LM2903
      2. 2.1.2 Determine Die Used for Quad LM139, LM239, LM339, and LM2901
      3. 2.1.3 Device PCN Summary
    2. 2.2 Changes to Package Top Markings
  6. 3 Input Considerations
    1. 3.1  Input Stage Schematic – The Classic LM339 Family
    2. 3.2  Input Stage Schematic - New B Devices
    3. 3.3  Differences Between the Classic and B Die Devices
    4. 3.4  Input Voltage Range
    5. 3.5  Input Voltage Range vs. Common Mode Voltage Range
    6. 3.6  Reason for Input Range Headroom Limitation
    7. 3.7  Input Voltage Range Feature
      1. 3.7.1 Both Inputs Above Input Range Behavior
    8. 3.8  Negative Input Voltages
      1. 3.8.1 Maximum Input Current
      2. 3.8.2 Phase Reversal or Inversion
      3. 3.8.3 Protecting Inputs from Negative Voltages
        1. 3.8.3.1 Simple Resistor and Diode Clamp
        2. 3.8.3.2 Voltage Divider with Clamp
          1. 3.8.3.2.1 Split Voltage Divider with Clamp
    9. 3.9  Power-Up Behavior
    10. 3.10 Capacitors and Hysteresis
    11. 3.11 Output to Input Cross-Talk
  7. 4 Output Stage Considerations
    1. 4.1 Output VOL and IOL
    2. 4.2 Pull-Up Resistor Selection
    3. 4.3 Short Circuit Sinking Current
    4. 4.4 Pulling Output Up Above VCC
    5. 4.5 Negative Voltages Applied to Output
    6. 4.6 Adding Large Filter Capacitors To Output
  8. 5 Power Supply Considerations
    1. 5.1 Supply Bypassing
      1. 5.1.1 Low VCC Guidance
      2. 5.1.2 Split Supply use
  9. 6 General Comparator Usage
    1. 6.1 Unused Comparator Connections
      1. 6.1.1 Do Not Connect Inputs Directly to Ground
      2. 6.1.2 Unused Comparator Input Connections
      3. 6.1.3 Leave Outputs Floating
      4. 6.1.4 Prototyping
  10. 7 PSPICE and TINA TI Models
  11. 8 Conclusion
  12. 9 Related Documentation
    1. 9.1 Related Links
  13. 10Revision History

2.1 PCN to Change Classic Die to a New Die Design

In March 2021, Product Change Notifications (PCN's) #20210318001 (Single and Dual) and #20231016006 (Quad) were issued to notify customers that the classic die is to be replaced with a new die based on the B device die. These PCN notices contain a list of the devices planned to change. These PCN's are sent to customers from their distributors.

The existing electrical specification limits, part markings and orderable part numbers for the classic devices remain the same. Some of the electrical table typical numbers and graphs can change to reflect any major differences between the old die and new die. The new die devices have passed, or exceeded, all the qualifications of the classic die. A qualification summary is available within the associated PCN.

For known differences, please see Differences between the classic and B version.

TI recommends that any new or updated designs specify the new B devices to immediately spot any possible compatibility issues. Eventually, all die will be based on the B die.

These high volume device families are assembled at multiple assembly sites, and not all of these assembly sites are converting to the new die at the same time. Therefore, as of this writing, it is possible to receive a mix of classic die and new die for a given high volume orderable part number (LM2903DR for example). The mix will be between sealed containers (bag or reel) and not mixed within a single rail or reel. The reel or bag information will provide the necessary die information.

Only the Native TI Commercial and Automotive devices are affected by the PCN's. At this time, there are no plans to PCN the Ex-National Semiconductor (the "-N") versions. The Military (/883, -MIL), QML, Space and Rad Hard families using the ex-National die will continue with their existing die. Some Native TI Military devices may be be affected by a PCN. These will be listed in the associated PCN.

To determine which die is used, the chip site and fab site location fields on the box label or bag label are viewed.